ZXMP6A13GTA P-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The ZXMP6A13GTA is a P-Channel MOSFET manufactured by Diodes Incorporated, rated for 60V drain-to-source voltage with 1.7A continuous drain current at 25°C. This device is packaged in SOT-223-3 surface mount configuration and is designed for applications requiring low-side P-channel switching and load control. The part maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when equivalent electrical performance can be achieved within the specified parameter ranges while maintaining the same functional category, voltage rating, and mounting technology. Substitution becomes necessary due to inventory availability, supply chain optimization, or design flexibility requirements.

Substiute Parts

ZXMP6A13GTA

Diodes IncorporatedIn Stock: 15506ZXMP6A13GTA Datasheet

Current PartRFQ

NDT2955

onsemiIn Stock: 41150NDT2955 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the ZXMP6A13GTA are identified based on the following electrical and mechanical criteria:

Matching Parameters (Required for Substitution):

• Drain-to-Source Voltage (Vdss): 60V minimum
• FET Type: P-Channel
• Technology: MOSFET (Metal Oxide)
• Mounting Type: Surface Mount
• Operating Temperature Range: -55°C to 150°C minimum
• Gate-Source Voltage (Vgs Max): ±20V or greater
• RoHS3 Compliance: Required
• MSL Rating: 1 (Unlimited) or equivalent

Performance Flexibility: Substitute parts may exceed the continuous drain current rating and power dissipation specifications of the main part, provided all voltage ratings and thermal operating ranges remain within or exceed the original specifications. On-resistance values may be lower (improved performance) or within acceptable tolerance ranges for the application category.

The NDT2955 qualifies as a direct substitute based on matching voltage ratings, FET type, technology, surface mount configuration, temperature range, and compliance certifications, while offering enhanced current handling capability (2.5A vs. 1.7A) and improved on-resistance characteristics.

Parameter Comparison

Engineering Selection Recommendations

ZXMP6A13GTA Selection Criteria: The ZXMP6A13GTA is appropriate for applications with continuous drain current requirements up to 1.7A and power dissipation within 2W limits. This part is suitable for low-to-moderate current switching applications in 60V systems. The device maintains Active product status with full RoHS3 compliance and REACH Unaffected designation, ensuring regulatory compliance for current and future manufacturing requirements.

NDT2955 Selection Criteria: The NDT2955 serves as a direct electrical and functional substitute with enhanced performance characteristics. This part accommodates higher continuous drain current (2.5A) and power dissipation (3W), making it suitable for applications requiring greater current handling capacity within the same 60V voltage class. The NDT2955 maintains identical compliance certifications (RoHS3, REACH Unaffected) and Active product status. The package variant (SOT-223-4 vs. SOT-223-3) requires PCB layout verification for pin compatibility, though both are surface mount configurations with equivalent thermal and electrical performance in the SOT-223 family.

Substitution Feasibility: Both parts are Active products with identical regulatory compliance. Substitution from ZXMP6A13GTA to NDT2955 is feasible when application current requirements can utilize the higher current rating. Reverse substitution (NDT2955 to ZXMP6A13GTA) is not recommended for applications requiring the full 2.5A capability, as the ZXMP6A13GTA is rated for 1.7A maximum continuous drain current.

Frequently Asked Questions (FAQ)

Q: Can the NDT2955 directly replace the ZXMP6A13GTA in existing designs?

A: The NDT2955 provides electrical substitution with enhanced current and power handling. However, the package variant differs (SOT-223-4 vs. SOT-223-3), requiring PCB footprint verification. Pin configuration must be confirmed against the specific application schematic before implementation.

Q: What are the key differences between these two P-Channel MOSFETs?

A: Both devices share identical 60V drain-to-source voltage ratings, ±20V gate-source voltage limits, and -55°C to 150°C operating temperature ranges. The NDT2955 provides higher continuous drain current (2.5A vs. 1.7A), improved on-resistance (300mOhm vs. 390mOhm at 10V), and greater power dissipation capability (3W vs. 2W). The NDT2955 exhibits higher gate charge (15nC vs. 5.9nC) and input capacitance (601pF vs. 219pF), which may affect switching speed in high-frequency applications.

Q: Are both parts compliant with current regulatory requirements?

A: Yes. Both the ZXMP6A13GTA and NDT2955 maintain RoHS3 compliance, REACH Unaffected status, and Active product designation. Both devices carry MSL 1 (Unlimited) moisture sensitivity ratings, indicating no special handling requirements during storage or assembly.

Q: What is the significance of the package designation difference (SOT-223-3 vs. SOT-223-4)?

A: The SOT-223-3 package contains three leads, while the SOT-223-4 package contains four leads. Both are surface mount configurations within the SOT-223 family. The additional lead in the SOT-223-4 variant typically provides enhanced thermal performance or additional connection options. PCB layout compatibility must be verified before substitution.

Q: Can the ZXMP6A13GTA substitute for the NDT2955 in high-current applications?

A: No. The ZXMP6A13GTA is rated for 1.7A continuous drain current, which is below the NDT2955 specification of 2.5A. Using the ZXMP6A13GTA in applications requiring the full 2.5A capability would exceed device ratings and create reliability risks.

Q: What compliance certifications apply to both devices?

A: Both parts are RoHS3 compliant, REACH Unaffected, and classified under ECCN EAR99 with HTSUS code 8541.29.0095. Both maintain MSL 1 (Unlimited) moisture sensitivity levels, eliminating special moisture control requirements during manufacturing and assembly processes.