XR33055HD-F Equivalent & Substitute Parts

Part Overview

The XR33055HD-F is a half-duplex RS422/RS485 transceiver IC manufactured by MaxLinear, Inc. This interface component integrates one driver and one receiver in a single 8-SOIC surface mount package, designed for industrial communication applications requiring robust serial data transmission over extended distances. The part maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating, making it suitable for production deployment in new designs and legacy system replacements.

Substiute Parts

XR33055HD-F

MaxLinear, Inc.In Stock: 740XR33055HD-F Datasheet

Current PartRFQ

XR33155HD-F

MaxLinear, Inc.In Stock: 1329XR33155HD-F Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the XR33055HD-F is determined by strict equivalence across the following critical parameters:

• Protocol Support: Both RS422 and RS485 capability required
• Driver/Receiver Configuration: Exactly 1/1 topology
• Duplex Mode: Half-duplex operation
• Data Rate: 1 Mbps minimum
• Supply Voltage Range: 3V to 5.5V compatibility
• Receiver Hysteresis: 170 mV specification
• Package Type: 8-SOIC form factor with identical 0.154" (3.90mm) width
• Operating Temperature: -40°C to 105°C range
• Compliance: RoHS3 and REACH status alignment

The XR33155HD-F qualifies as a parametric equivalent substitute, meeting all electrical and mechanical specifications without deviation.

Parameter Comparison

Engineering Selection Recommendations

Both the XR33055HD-F and XR33155HD-F maintain Active product status from MaxLinear, Inc., ensuring continued manufacturing support and supply chain availability. Both components carry identical RoHS3 compliance and REACH Unaffected designation, meeting regulatory requirements for industrial and commercial applications across global markets.

Selection between these parts should be based on inventory availability and lead time requirements. The XR33155HD-F currently maintains higher stock levels (1297 pcs vs. 681 pcs), which may provide supply chain advantages for high-volume production schedules. Both parts are packaged in identical 8-SOIC form factors and require no PCB layout modifications for direct substitution.

Frequently Asked Questions (FAQ)

Q: Can the XR33155HD-F replace the XR33055HD-F in existing designs?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, package dimensions, and pin configurations. No circuit modifications or PCB redesign is required.

Q: Are there any differences in operating temperature ranges?

A: No. Both parts operate across the identical -40°C to 105°C temperature range, ensuring equivalent thermal performance in industrial environments.

Q: Do both parts support the same communication protocols?

A: Yes. Both the XR33055HD-F and XR33155HD-F support RS422 and RS485 protocols with identical 1 Mbps data rate capability and 170 mV receiver hysteresis specifications.

Q: What is the significance of the 8-SOIC package specification?

A: The 8-SOIC (Small Outline Integrated Circuit) package with 0.154" (3.90mm) width is a standard surface mount form factor. Both parts use this identical package, enabling direct PCB footprint compatibility without layout modifications.

Q: Are there compliance or certification differences between these parts?

A: No. Both parts carry identical RoHS3 compliance, REACH Unaffected status, and MSL 1 (Unlimited) moisture sensitivity rating, meeting the same regulatory and environmental standards.

Q: Which part should be selected for new production designs?

A: Either part is suitable for new designs. Selection should be based on current inventory availability and supplier lead times, as both maintain Active product status with equivalent technical specifications.