XMLEZW-02-0000-0D0HT530F Equivalent & Substitute Parts

Part Overview

The XMLEZW-02-0000-0D0HT530F is a CreeLED EasyWhite™ XLamp® XM-L warm white LED (3000K) in 2020 (5050 metric) surface mount package. This component is classified as obsolete product status. Finding equivalent substitute parts is necessary due to discontinued manufacturing and limited inventory availability. The substitute part identified maintains functional compatibility through equivalent color temperature, mounting type, and package form factor while offering enhanced performance characteristics.

Substiute Parts

XMLEZW-02-0000-0D0HT530F

CreeLED, Inc.In Stock: 807XMLEZW-02-0000-0D0HT530F Datasheet

Current PartRFQ

XHP50B-00-0000-0D0UG230G

CreeLED, Inc.In Stock: 828XHP50B-00-0000-0D0UG230G Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The XHP50B-00-0000-0D0UG230G qualifies as a functional substitute based on the following alignment criteria:

Matching Parameters:

• Color temperature: Both 3000K warm white
• Package form factor: Both 2020 (5050 metric) surface mount
• Mounting type: Both surface mount
• Compliance: Both RoHS compliant and REACH unaffected
• Electrical classification: Both suitable for 12V operation (substitute supports dual 6V/12V)

Enhanced Characteristics: The substitute part offers improved performance in luminous flux (810lm vs. 270lm), higher color rendering index (90 vs. 80), and superior thermal management (1.2°C/W vs. 2.5°C/W). The substitute operates at active product status with current manufacturing availability.

Parameter Comparison

Engineering Selection Recommendations

The XHP50B-00-0000-0D0UG230G is suitable as a substitute for the obsolete XMLEZW-02-0000-0D0HT530F based on product lifecycle and compliance status. The substitute maintains active manufacturing status with current inventory availability. Both components meet RoHS compliance and REACH unaffected requirements. The substitute's improved thermal resistance and higher color rendering index provide enhanced performance margins for thermal management and color accuracy applications. The 0.019" (0.48mm) increase in seated height requires verification against mechanical clearance constraints in the target application.

Frequently Asked Questions (FAQ)

Q: Can the XHP50B-00-0000-0D0UG230G directly replace the XMLEZW-02-0000-0D0HT530F in existing designs?

A: Direct replacement is possible with mechanical and electrical verification. Both components use identical 2020 (5050 metric) package footprints and 12V forward voltage operation. The substitute's increased seated height (3.63mm vs. 3.15mm) must be confirmed against PCB clearance and enclosure constraints. The substitute supports dual voltage operation (6V/12V) but should be operated at the original 12V specification for compatibility.

Q: What are the key differences in electrical performance?

A: The substitute operates at higher luminous flux (810lm vs. 270lm) and efficiency (103 lm/W vs. 64 lm/W). Current requirements differ: the substitute supports 1.4A at 12V or 700mA at 6V operation, compared to the original 350mA at 12V. Thermal resistance is improved (1.2°C/W vs. 2.5°C/W), reducing junction temperature rise under identical power dissipation.

Q: Are there color temperature differences between these parts?

A: Both components are specified at 3000K warm white. The original uses 4-step MacAdam Ellipse binning while the substitute uses 3-step MacAdam Ellipse binning. The substitute achieves higher color rendering index (90 vs. 80), indicating improved color accuracy across the visible spectrum.

Q: What compliance certifications apply to both parts?

A: Both components are RoHS compliant and REACH unaffected. Both carry EAR99 ECCN classification and 8541.41.0000 HTSUS code. Moisture sensitivity level is 1 (unlimited) for the original; equivalent MSL data for the substitute is not provided in the specification.

Q: Is the substitute available in the same packaging format?

A: The substitute is supplied in Tape & Reel (TR) format, while the original packaging format is not specified. Both use identical 2020 (5050 metric) surface mount package form factor suitable for automated assembly processes.