XC2S30-6CSG144C Equivalent & Substitute Parts

Part Overview

The XC2S30-6CSG144C is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 92 I/O pins, 30,000 gates, and 24,576 RAM bits in a 144-TFBGA/CSPBGA package. This device is classified as Last Time Buy, indicating end-of-life status and limited availability for new designs. Identifying equivalent and substitute parts is necessary to ensure continued supply chain access, support for legacy system maintenance, and evaluation of alternative architectures that meet functional and electrical requirements.

Substiute Parts

XC2S30-6CSG144C

AMDIn Stock: 2212XC2S30-6CSG144C Datasheet

Current PartRFQ

T8Q144C3

Efinix, Inc.In Stock: 1011T8Q144C3 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the XC2S30-6CSG144C is evaluated based on functional and electrical compatibility within the embedded FPGA category. The primary substitute identified is the T8Q144C3 (Efinix Trion® FPGA), which shares the following critical alignment criteria:

Substitution-Determining Parameters:

• I/O Pin Count: XC2S30 provides 92 I/O; T8Q144C3 provides 97 I/O. The higher I/O count in the substitute accommodates designs requiring additional signal routing without reducing functionality.
• Logic Capacity: XC2S30 contains 972 logic cells; T8Q144C3 contains 7,384 logic cells. The substitute provides significantly greater logic density, supporting more complex designs.
• On-Chip Memory: XC2S30 includes 24,576 RAM bits; T8Q144C3 includes 125,829 RAM bits. The substitute offers expanded memory resources for data-intensive applications.
• Package Form Factor: Both devices use 144-pin packages (XC2S30: 144-TFBGA/CSPBGA; T8Q144C3: 144-LQFP). Package footprints differ in pitch and dimensions, requiring PCB redesign.
• Supply Voltage: XC2S30 operates at 2.375V ~ 2.625V; T8Q144C3 operates at 1.15V ~ 1.25V. Voltage incompatibility requires separate power supply domains and level-shifting interface circuitry.
• Operating Temperature: Both devices support 0°C ~ 85°C (TJ), providing thermal compatibility.
• Compliance: Both devices are ROHS3 compliant with MSL 3 rating, meeting environmental and handling standards.

Parameter Comparison

Engineering Selection Recommendations

XC2S30-6CSG144C (Main Part): Use for existing designs currently in production or maintenance phase. This device is ROHS3 compliant and carries MSL 3 certification, meeting standard environmental and handling requirements. Last Time Buy status indicates limited future availability; procurement should prioritize current inventory (2,200 pcs available) for ongoing support needs.

T8Q144C3 (Substitute): Suitable for new designs or redesigns requiring FPGA functionality with enhanced capacity. The Trion® T8Q144C3 is in active production status, ensuring long-term supply chain stability. ROHS3 compliance and MSL 3 rating match the main part's environmental standards. However, substitution requires:

• PCB Redesign: Package change from 144-TFBGA/CSPBGA (12x12mm) to 144-LQFP (20x20mm) necessitates new footprint layout and routing.
• Power Supply Architecture: Voltage incompatibility (2.375V–2.625V vs. 1.15V–1.25V) requires independent power domains and level-shifting circuitry for any interface signals.
• Design Retargeting: Different FPGA architecture and tool chain (Efinix vs. AMD) require HDL redesign, simulation, and verification.
• Functional Verification: Increased logic capacity (7,384 vs. 972 cells) and memory (125,829 vs. 24,576 bits) provide design headroom but require validation against original specifications.

Selection between these parts depends on project phase, supply requirements, and tolerance for redesign effort.

Frequently Asked Questions (FAQ)

Q: Can the T8Q144C3 directly replace the XC2S30-6CSG144C on an existing PCB?

A: No. The devices use different package types (144-TFBGA/CSPBGA vs. 144-LQFP) with different footprints, pin pitches, and dimensions. PCB redesign is required. Additionally, supply voltage incompatibility (2.375V–2.625V vs. 1.15V–1.25V) requires separate power supply domains and interface level-shifting circuitry.

Q: Are the I/O pin counts compatible?

A: The XC2S30 provides 92 I/O pins, while the T8Q144C3 provides 97 I/O pins. The substitute offers 5 additional I/O pins. Pin-to-pin compatibility cannot be assumed; pinout mapping must be verified against device datasheets and application requirements.

Q: What are the key differences in logic capacity?

A: The XC2S30 contains 972 logic cells and 30,000 gates, while the T8Q144C3 contains 7,384 logic cells. The substitute provides approximately 7.6 times greater logic density. Designs originally targeting the XC2S30 will fit within the T8Q144C3 with significant headroom for additional functionality.

Q: How does on-chip memory compare?

A: The XC2S30 includes 24,576 RAM bits, while the T8Q144C3 includes 125,829 RAM bits. The substitute provides 5.1 times greater memory capacity, supporting more complex data buffering and storage requirements.

Q: Are both devices environmentally compliant?

A: Yes. Both the XC2S30-6CSG144C and T8Q144C3 are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity ratings. They meet equivalent environmental and handling standards.

Q: What is the thermal operating range for both devices?

A: Both devices operate across 0°C to 85°C (TJ), providing identical thermal compatibility for equivalent operating environments.

Q: Why is the XC2S30 classified as Last Time Buy?

A: Last Time Buy status indicates the device is at end-of-life. AMD is no longer manufacturing this part, and existing inventory will be depleted. New designs should transition to active-production alternatives such as the T8Q144C3 to ensure long-term supply chain availability.

Q: What design effort is required to substitute the T8Q144C3?

A: Substitution requires PCB redesign (new footprint and layout), power supply architecture changes (separate voltage domains and level-shifting), HDL retargeting to the Efinix tool chain, and comprehensive functional verification. The substitute's greater capacity provides design flexibility but demands engineering effort for successful integration.

Q: Are the supply voltages compatible?

A: No. The XC2S30 requires 2.375V to 2.625V, while the T8Q144C3 requires 1.15V to 1.25V. These voltage domains are incompatible and require separate power supplies. Any interface signals between the two voltage domains require level-shifting circuitry to prevent damage and ensure reliable operation.