XC2S30-6CS144C Equivalent & Substitute Parts

Part Overview

The XC2S30-6CS144C is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 92 I/O pins, 30,000 gates, and 24,576 RAM bits in a 144-TFBGA, CSPBGA package. This device operates at a supply voltage of 2.375V to 2.625V and supports a temperature range of 0°C to 85°C (TJ). The part is currently in Last Time Buy status, indicating end-of-life production. Identifying equivalent and substitute parts is necessary to support ongoing design requirements, ensure supply chain continuity, and evaluate alternative FPGA solutions that meet functional and mechanical specifications.

Substiute Parts

XC2S30-6CS144C

AMDIn Stock: 2297XC2S30-6CS144C Datasheet

Current PartRFQ

T8Q144C3

Efinix, Inc.In Stock: 1011T8Q144C3 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the XC2S30-6CS144C are identified based on the following critical parameters that determine functional and mechanical compatibility:

Substitution Criteria:

1. I/O Pin Count: The substitute must provide a comparable number of I/O pins to support equivalent interface requirements. The XC2S30-6CS144C provides 92 I/O pins.

2. Logic Capacity: The substitute must offer sufficient logic elements or cells to accommodate the design complexity. The XC2S30-6CS144C contains 972 logic cells.

3. RAM Capacity: The substitute must provide adequate embedded RAM resources. The XC2S30-6CS144C includes 24,576 RAM bits.

4. Package Type: The substitute must use a 144-pin surface mount package compatible with existing PCB layouts and assembly processes.

5. Operating Temperature Range: The substitute must support the 0°C to 85°C (TJ) operating temperature range.

6. Mounting Type: The substitute must be surface mount technology (SMT) compatible.

The T8Q144C3 (Efinix Trion® FPGA) meets these substitution criteria with 97 I/O pins, 7,384 logic cells, 125,829 RAM bits, and a 144-LQFP package, all within the specified temperature range and surface mount requirements.

Parameter Comparison

Engineering Selection Recommendations

XC2S30-6CS144C (Main Part):

The XC2S30-6CS144C is suitable for applications requiring legacy Spartan®-II FPGA functionality. However, the Last Time Buy status indicates this part is no longer in active production. The RoHS non-compliant designation may restrict use in applications subject to RoHS regulations. Existing inventory of 2,200 pieces is available for immediate procurement.

T8Q144C3 (Substitute):

The T8Q144C3 is an active product offering enhanced logic capacity (7,384 cells versus 972 cells) and significantly greater RAM resources (125,829 bits versus 24,576 bits). This substitute provides ROHS3 compliance, addressing regulatory requirements that may not be met by the legacy XC2S30-6CS144C. The T8Q144C3 operates at a lower supply voltage (1.15V to 1.25V versus 2.375V to 2.625V), resulting in reduced power consumption. Both devices share identical operating temperature ranges and MSL ratings. The primary design consideration is the package transition from 144-TFBGA, CSPBGA to 144-LQFP, which requires PCB layout modification. Current inventory of 975 pieces supports immediate availability.

Frequently Asked Questions (FAQ)

Q: Can the T8Q144C3 directly replace the XC2S30-6CS144C without PCB modifications?

A: No. The XC2S30-6CS144C uses a 144-TFBGA, CSPBGA package, while the T8Q144C3 uses a 144-LQFP package. These packages have different footprints, pin layouts, and mechanical dimensions. PCB redesign is required for substitution.

Q: What are the key electrical differences between these two FPGAs?

A: The primary electrical difference is supply voltage. The XC2S30-6CS144C requires 2.375V to 2.625V, while the T8Q144C3 operates at 1.15V to 1.25V. Both devices support the same operating temperature range (0°C to 85°C TJ) and share identical MSL ratings (3, 168 Hours).

Q: Does the T8Q144C3 provide sufficient logic capacity for designs originally targeting the XC2S30-6CS144C?

A: Yes. The T8Q144C3 contains 7,384 logic cells compared to 972 cells in the XC2S30-6CS144C, providing approximately 7.6 times greater logic capacity. Additionally, the T8Q144C3 provides 125,829 RAM bits versus 24,576 bits in the main part, offering significantly enhanced embedded memory resources.

Q: What is the I/O pin compatibility between these devices?

A: The T8Q144C3 provides 97 I/O pins compared to 92 I/O pins on the XC2S30-6CS144C. The substitute offers five additional I/O pins, which may support expanded interface requirements or provide design flexibility.

Q: Are there compliance or regulatory considerations for substitution?

A: Yes. The XC2S30-6CS144C is RoHS non-compliant, while the T8Q144C3 is ROHS3 compliant. Applications subject to RoHS regulations must use the T8Q144C3 or equivalent compliant alternatives. Both devices are REACH Unaffected.

Q: What is the impact of the package change on assembly and testing?

A: The transition from BGA to LQFP package affects PCB assembly processes, test fixture design, and thermal management strategies. BGA packages typically offer superior thermal performance and higher pin density, while LQFP packages provide easier manual rework and lower assembly costs. Design and manufacturing teams must evaluate these trade-offs for specific applications.

Q: Are both devices available in current inventory?

A: Yes. The XC2S30-6CS144C has 2,200 pieces in stock (Last Time Buy status), and the T8Q144C3 has 975 pieces in stock (Active product status). The T8Q144C3 represents a more sustainable long-term supply option due to its active product designation.