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XC2S30-5CSG144C Equivalent & Substitute Parts
Part Overview
The XC2S30-5CSG144C is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 92 I/O pins, 30,000 gates, and 24,576 RAM bits in a 144-TFBGA/CSPBGA package. This device operates at a supply voltage of 2.375V to 2.625V and supports a temperature range of 0°C to 85°C. The part is designated as Last Time Buy, indicating end-of-life status. Identification of equivalent and substitute parts is necessary for design continuity, long-term product support, and supply chain alternatives when original inventory becomes unavailable.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | XC2S30-5CSG144C |
| Manufacturer | AMD |
| Series | Spartan®-II |
| Number of I/O | 92 |
| Number of Logic Elements/Cells | 972 |
| Total RAM Bits | 24,576 |
| Number of Gates | 30,000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 144-TFBGA, CSPBGA |
| Mounting Type | Surface Mount |
| Product Status | Last Time Buy |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the XC2S30-5CSG144C is determined by compatibility across the following critical parameters:
Functional Equivalence Criteria:
- I/O Pin Count: 92 pins (main part) versus 97 pins (substitute)
- Logic Cell Density: 972 cells (main part) versus 7,384 cells (substitute)
- RAM Capacity: 24,576 bits (main part) versus 125,829 bits (substitute)
- Gate Count: 30,000 gates (main part) versus higher capacity in substitute
Electrical Compatibility:
- Supply Voltage: 2.375V ~ 2.625V (main part) versus 1.15V ~ 1.25V (substitute)
- Operating Temperature Range: 0°C ~ 85°C (both parts)
Physical and Compliance Compatibility:
- Mounting Type: Surface Mount (both parts)
- Package Form Factor: 144-pin BGA/LQFP configurations
- RoHS3 Compliance: Both parts compliant
- MSL Rating: 3 (168 Hours) for both parts
The T8Q144C3 substitute part offers higher logic density and RAM capacity, making it suitable for designs requiring expanded functionality. However, the different supply voltage range necessitates circuit design modifications.
Parameter Comparison
| Parameter | XC2S30-5CSG144C (Main) | T8Q144C3 (Substitute) |
|---|---|---|
| Manufacturer | AMD | Efinix, Inc. |
| Series | Spartan®-II | Trion® |
| Number of I/O | 92 | 97 |
| Number of Logic Elements/Cells | 972 | 7,384 |
| Total RAM Bits | 24,576 | 125,829 |
| Number of Gates | 30,000 | Not specified |
| Voltage - Supply | 2.375V ~ 2.625V | 1.15V ~ 1.25V |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Package / Case | 144-TFBGA, CSPBGA | 144-LQFP |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Last Time Buy | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
Engineering Selection Recommendations
For XC2S30-5CSG144C Replacement:
The T8Q144C3 is an active product offering extended logic capacity and RAM resources. Selection of this substitute requires evaluation of the following factors:
Voltage Supply Consideration: The main part operates at 2.375V ~ 2.625V, while the substitute operates at 1.15V ~ 1.25V. Power supply circuitry must be redesigned to accommodate the lower voltage requirement of the Trion® device.
Logic and Memory Capacity: The substitute provides significantly higher logic cell density (7,384 versus 972) and RAM capacity (125,829 versus 24,576 bits), enabling implementation of more complex designs within the same package footprint.
Package Compatibility: The main part uses 144-TFBGA/CSPBGA packaging, while the substitute uses 144-LQFP packaging. PCB layout and footprint modifications are required.
Product Status: The XC2S30-5CSG144C is Last Time Buy, making the active T8Q144C3 a viable long-term alternative for new designs or production continuity.
Compliance: Both parts maintain ROHS3 compliance and identical MSL ratings, supporting equivalent handling and storage requirements.
Frequently Asked Questions (FAQ)
Q: Can the T8Q144C3 directly replace the XC2S30-5CSG144C in existing designs?
A: Direct replacement requires circuit modifications. The supply voltage differs significantly (1.15V ~ 1.25V versus 2.375V ~ 2.625V), necessitating redesign of power delivery networks. Additionally, the package form factor differs (144-LQFP versus 144-TFBGA/CSPBGA), requiring PCB layout changes.
Q: What are the key differences in I/O capability?
A: The XC2S30-5CSG144C provides 92 I/O pins, while the T8Q144C3 provides 97 I/O pins. The substitute offers five additional I/O connections, which may require design accommodation or can be left unconnected if not utilized.
Q: How do the logic resources compare?
A: The T8Q144C3 contains 7,384 logic cells compared to 972 in the XC2S30-5CSG144C, representing approximately 7.6 times greater logic density. RAM capacity also increases from 24,576 bits to 125,829 bits. These differences allow implementation of more complex designs on the substitute part.
Q: Are there any compliance or handling differences?
A: Both parts maintain ROHS3 compliance and carry identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours). Handling, storage, and environmental requirements are equivalent.
Q: What is the product status implication?
A: The XC2S30-5CSG144C is designated Last Time Buy, indicating end-of-life status. The T8Q144C3 is Active, providing long-term availability and support for new designs or production continuity beyond the original part's lifecycle.
Q: Are the operating temperature ranges compatible?
A: Both parts operate across the identical temperature range of 0°C to 85°C (TJ), ensuring thermal compatibility in equivalent operating environments.
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