XC2S200-5FGG256I Equivalent & Substitute Parts

Part Overview

The XC2S200-5FGG256I is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 176 I/O pins, 5292 logic cells, and 57344 total RAM bits in a 256-BGA package. This device is designated as Last Time Buy, indicating end-of-life status and limited availability for new designs. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support long-term production requirements for applications currently utilizing this component.

Substiute Parts

XC2S200-5FGG256I

AMDIn Stock: 1553XC2S200-5FGG256I Datasheet

Current PartRFQ

T13F256I4

Efinix, Inc.In Stock: 12134T13F256I4 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the XC2S200-5FGG256I is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must utilize 256-pin BGA packaging with surface mount technology to ensure PCB layout compatibility and assembly process alignment.

I/O Pin Count: The substitute part must provide a minimum of 176 I/O pins to maintain signal connectivity and interface requirements of the original design.

Logic Cell Capacity: The substitute must provide sufficient logic elements to accommodate the functional requirements originally implemented in 5292 logic cells.

RAM Capacity: The substitute must provide adequate embedded RAM resources to support the original design's memory requirements of 57344 bits.

Voltage Supply Range: The substitute must operate within or encompass the 2.375V ~ 2.625V supply voltage specification to ensure power delivery compatibility.

Operating Temperature Range: The substitute must support the -40°C ~ 100°C operating temperature range to maintain thermal performance across all application environments.

Compliance Standards: The substitute must maintain ROHS3 compliance and equivalent moisture sensitivity classification to ensure regulatory and manufacturing process compatibility.

Parameter Comparison

Engineering Selection Recommendations

The T13F256I4 (Trion® FPGA by Efinix, Inc.) is identified as a substitute part for the XC2S200-5FGG256I based on package format, I/O capacity, logic cell capacity, RAM capacity, and operating temperature range alignment.

Product Status Consideration: The XC2S200-5FGG256I is designated Last Time Buy, indicating end-of-life status. The T13F256I4 maintains Active product status, ensuring long-term availability and continued manufacturer support.

Compliance Alignment: Both parts maintain ROHS3 compliance and identical Moisture Sensitivity Level (MSL) classification of 3 (168 Hours), ensuring regulatory and manufacturing process compatibility.

Critical Design Modifications Required: Implementation of the T13F256I4 substitute requires the following design changes:

1. Power supply voltage must be redesigned from 2.375V ~ 2.625V to 1.15V ~ 1.25V
2. PCB layout must be modified to accommodate the smaller 13x13mm package footprint (versus 17x17mm)
3. Design tool flow and HDL compilation must be adapted to the Efinix Trion® architecture
4. Functional verification is required due to architectural differences between Spartan®-II and Trion® platforms

Capacity Advantages: The T13F256I4 provides increased logic cell capacity (12828 versus 5292), RAM capacity (744489 versus 57344 bits), and I/O count (195 versus 176), offering design headroom for future enhancements.

Frequently Asked Questions (FAQ)

Q: Can the T13F256I4 be used as a direct pin-for-pin replacement for the XC2S200-5FGG256I?

A: No. While both devices utilize 256-pin BGA packaging, the physical package dimensions differ (17x17mm versus 13x13mm), requiring PCB layout redesign. Additionally, the supply voltage specifications are incompatible (2.375V ~ 2.625V versus 1.15V ~ 1.25V), necessitating power supply circuit modification.

Q: What are the key electrical differences between these parts?

A: The primary electrical difference is the supply voltage range. The XC2S200-5FGG256I operates at 2.375V ~ 2.625V, while the T13F256I4 operates at 1.15V ~ 1.25V. Both devices support identical operating temperature ranges (-40°C ~ 100°C) and maintain equivalent moisture sensitivity classifications.

Q: Are both parts RoHS compliant?

A: Yes. Both the XC2S200-5FGG256I and T13F256I4 are ROHS3 compliant and meet current regulatory requirements for hazardous substance restrictions.

Q: What is the significance of the Last Time Buy status for the XC2S200-5FGG256I?

A: Last Time Buy designation indicates that the manufacturer (AMD) will no longer accept new orders after a specified cutoff date. Existing inventory will be depleted, and the part will reach end-of-life. Designs currently using this component should transition to alternative parts to ensure long-term supply chain continuity.

Q: Does the T13F256I4 provide sufficient capacity for designs originally targeting the XC2S200-5FGG256I?

A: Yes. The T13F256I4 provides greater logic cell capacity (12828 versus 5292), significantly higher RAM capacity (744489 versus 57344 bits), and additional I/O pins (195 versus 176). These increased resources ensure that designs originally implemented on the XC2S200-5FGG256I can be accommodated with capacity to spare.

Q: What design tool changes are necessary when migrating from Spartan®-II to Trion® architecture?

A: Design migration requires adaptation of the HDL compilation flow to Efinix design tools and verification of functional behavior on the Trion® architecture. The underlying FPGA architectures differ, necessitating design tool recompilation and functional testing to ensure correct operation.

Q: Are there inventory considerations when selecting between these parts?

A: Yes. The XC2S200-5FGG256I has 1518 pieces in stock with Last Time Buy status, indicating limited future availability. The T13F256I4 has 12124 pieces in stock with Active product status, ensuring sustained availability for current and future production requirements.