XC2S200-5FGG256C Equivalent & Substitute Parts

Part Overview

The XC2S200-5FGG256C is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 176 I/O pins, 5292 logic cells, and 57344 total RAM bits in a 256-BGA package. This device is designated as Last Time Buy, indicating end-of-life status and limited availability for new designs. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support long-term production requirements for applications currently utilizing this component.

Substiute Parts

XC2S200-5FGG256C

AMDIn Stock: 1466XC2S200-5FGG256C Datasheet

Current PartRFQ

T13F256C3

Efinix, Inc.In Stock: 11590T13F256C3 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the XC2S200-5FGG256C is evaluated based on the following critical parameters that determine functional and physical compatibility:

Package Compatibility: Both the main part and substitute must utilize 256-pin BGA packaging with surface mount technology to ensure PCB layout compatibility and assembly process alignment.

I/O Pin Count: The substitute part must provide a minimum of 176 I/O pins to accommodate existing circuit designs. The T13F256C3 provides 195 I/O pins, exceeding the minimum requirement.

Logic Cell Capacity: The substitute must provide sufficient logic elements to support the design complexity. The T13F256C3 provides 12828 logic cells, significantly exceeding the 5292 cells of the main part.

RAM Capacity: The substitute must provide adequate embedded RAM resources. The T13F256C3 provides 744489 total RAM bits, substantially exceeding the 57344 bits of the main part.

Voltage Supply Range: The substitute operates at 1.15V ~ 1.25V, which differs from the main part's 2.375V ~ 2.625V range. This difference requires power supply redesign and is a critical consideration for substitution feasibility.

Operating Temperature Range: Both parts operate within 0°C ~ 85°C (TJ), providing thermal compatibility.

Compliance & Certifications: Both parts are ROHS3 compliant, carry MSL 3 rating, and share identical ECCN and HTSUS classifications, ensuring regulatory alignment.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The XC2S200-5FGG256C is designated Last Time Buy, indicating AMD has ceased production and support. The T13F256C3 maintains Active product status with Efinix, Inc., ensuring ongoing availability, technical support, and manufacturing continuity.

Compliance Alignment: Both parts achieve ROHS3 compliance and share identical ECCN (EAR99) and HTSUS (8542.39.0001) classifications, ensuring regulatory and export control compatibility.

Moisture Sensitivity: Both parts carry MSL 3 rating with 168-hour floor life, providing equivalent handling and storage requirements.

Functional Capacity: The T13F256C3 provides superior logic cell capacity (12828 vs. 5292), RAM capacity (744489 vs. 57344 bits), and I/O count (195 vs. 176), enabling designs to scale or accommodate additional functionality without architectural constraints.

Critical Design Consideration: The voltage supply differential (1.15V ~ 1.25V for T13F256C3 versus 2.375V ~ 2.625V for XC2S200-5FGG256C) necessitates complete power distribution network redesign, including voltage regulator replacement and power plane reconfiguration. This represents a significant engineering effort and must be validated through comprehensive testing.

Package Footprint Difference: The T13F256C3 utilizes a 13x13mm footprint compared to the 17x17mm footprint of the main part. PCB layout modification is required to accommodate the smaller package dimensions.

Frequently Asked Questions (FAQ)

Q: Can the T13F256C3 be used as a direct pin-for-pin replacement for the XC2S200-5FGG256C?

A: No. While both parts use 256-pin BGA packaging, the physical footprints differ (13x13mm versus 17x17mm), and the pin assignments are not identical. PCB layout redesign is required. Additionally, the voltage supply ranges differ significantly, requiring power supply circuit modifications.

Q: What are the primary compatibility factors when evaluating FPGA substitutes?

A: The primary compatibility factors are: package type and pin count (256-BGA in both cases), I/O pin availability (minimum 176 required), logic cell capacity (minimum 5292 required), embedded RAM capacity (minimum 57344 bits required), supply voltage range, operating temperature range, and regulatory compliance status (ROHS3, ECCN, HTSUS).

Q: Does the T13F256C3 provide sufficient logic resources for designs currently using the XC2S200-5FGG256C?

A: Yes. The T13F256C3 provides 12828 logic cells and 744489 RAM bits, both substantially exceeding the 5292 logic cells and 57344 RAM bits of the main part. Designs can be migrated without resource constraints.

Q: What is the significance of the voltage supply difference between these parts?

A: The XC2S200-5FGG256C operates at 2.375V ~ 2.625V, while the T13F256C3 operates at 1.15V ~ 1.25V. This difference requires replacement of voltage regulators, redesign of power distribution networks, and potential modifications to I/O interface circuits. This is not a transparent substitution and requires full electrical validation.

Q: Are both parts compliant with current environmental and export regulations?

A: Yes. Both parts are ROHS3 compliant, carry MSL 3 rating, and share identical ECCN (EAR99) and HTSUS (8542.39.0001) classifications, ensuring compliance with current environmental and export control requirements.

Q: What is the impact of the different package footprints on PCB design?

A: The T13F256C3 footprint (13x13mm) is smaller than the XC2S200-5FGG256C footprint (17x17mm). This allows for more compact board layouts but requires complete PCB redesign, including via placement, trace routing, and power plane configuration. The smaller footprint may enable board size reduction or provide additional routing space for other components.

Q: Is the T13F256C3 actively manufactured and supported?

A: Yes. The T13F256C3 maintains Active product status with Efinix, Inc., ensuring ongoing manufacturing, technical support, and long-term availability. The XC2S200-5FGG256C is Last Time Buy, indicating end-of-life status with limited future availability.