XC2S15-5CS144C Equivalent & Substitute Parts

Part Overview

The XC2S15-5CS144C is a Spartan®-II Field Programmable Gate Array (FPGA) manufactured by AMD, featuring 86 I/O pins, 432 logic cells, and 16,384 total RAM bits in a 144-TFBGA, CSPBGA package. This device is classified as obsolete and is no longer in active production. Due to its obsolete status, identifying functionally equivalent substitute components is necessary for system redesign, legacy system maintenance, and procurement continuity. Substitute parts must maintain compatibility with the 144-pin ball grid array form factor, surface mount technology, and the specified operating temperature range of 0°C to 85°C.

Substiute Parts

XC2S15-5CS144C

AMDIn Stock: 1568XC2S15-5CS144C Datasheet

Current PartRFQ

T8Q144C3

Efinix, Inc.In Stock: 1011T8Q144C3 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the XC2S15-5CS144C are identified based on the following substitution criteria:

Primary Compatibility Parameters:

• Package Form Factor: 144-pin ball grid array or equivalent pin count package (144-LQFP acceptable as mechanical alternative)
• I/O Count: Minimum 86 I/O pins to maintain signal interface capability
• Logic Cell Count: Minimum 432 logic elements to support design implementation
• RAM Capacity: Minimum 16,384 bits to preserve on-chip memory functionality
• Operating Temperature Range: 0°C to 85°C (TJ) to ensure thermal compatibility
• Mounting Technology: Surface mount configuration for PCB assembly compatibility

Secondary Considerations:

• Product status (active vs. obsolete) for supply chain viability
• Compliance certifications (RoHS, REACH) for regulatory alignment
• Voltage supply specifications for power delivery compatibility

The Efinix Trion® T8Q144C3 meets the primary compatibility parameters with enhanced specifications in logic cell count (7,384 vs. 432) and RAM capacity (125,829 bits vs. 16,384 bits), while maintaining the 144-pin package footprint and surface mount technology. The substitute operates at a lower supply voltage (1.15V ~ 1.25V) and maintains the identical operating temperature range.

Parameter Comparison

Engineering Selection Recommendations

Substitution Feasibility:

The T8Q144C3 serves as a functional substitute for the XC2S15-5CS144C based on the following engineering criteria:

1. Package Compatibility: Both devices utilize 144-pin surface mount packages. The main part uses 144-TFBGA (12x12 mm), while the substitute uses 144-LQFP (20x20 mm). PCB layout redesign is required to accommodate the different footprint dimensions and pin pitch.

2. Functional Capacity: The substitute exceeds the minimum required specifications for logic cells (7,384 vs. 432) and RAM capacity (125,829 vs. 16,384 bits), ensuring design implementation feasibility without functional degradation.

3. I/O Capability: The substitute provides 97 I/O pins compared to the main part's 86 I/O pins, offering additional signal interface capability.

4. Thermal Compatibility: Both devices operate within the identical temperature range (0°C to 85°C TJ), ensuring thermal design compatibility.

5. Supply Voltage Redesign: The substitute operates at 1.15V ~ 1.25V compared to the main part's 2.375V ~ 2.625V. Power delivery architecture redesign is mandatory, including voltage regulator replacement and power distribution network recalculation.

6. Compliance Status: The substitute is ROHS3 compliant and maintains active production status, providing regulatory alignment and long-term supply chain continuity compared to the obsolete main part.

7. Moisture Sensitivity: Both devices share identical MSL classification (3, 168 Hours), maintaining equivalent handling and storage requirements.

Implementation Considerations:

Substitution requires design modifications including PCB layout revision for the different package footprint, power supply circuit redesign for the lower voltage requirement, and FPGA design verification to confirm functional equivalence within the Trion® architecture. No firmware or logic design changes are inherently required due to the substitute's superior capacity specifications.

Frequently Asked Questions (FAQ)

Q: Can the T8Q144C3 directly replace the XC2S15-5CS144C without PCB modifications?

A: No. While both devices use 144-pin surface mount packages, the physical footprints differ significantly. The main part uses a 12x12 mm BGA package, while the substitute uses a 20x20 mm LQFP package. PCB layout redesign is required, including trace routing, via placement, and component positioning adjustments.

Q: What is the impact of the different supply voltage specifications?

A: The substitute requires 1.15V ~ 1.25V compared to the main part's 2.375V ~ 2.625V. This necessitates complete power delivery circuit redesign, including voltage regulator replacement, decoupling capacitor recalculation, and power distribution network verification. Existing power supply designs are not compatible.

Q: Are the I/O pin assignments identical between the two devices?

A: No. The devices use different FPGA architectures (Spartan®-II vs. Trion®) with different pin assignments. Pin mapping must be verified against the respective datasheets, and FPGA design files require modification to accommodate the new pin configuration.

Q: Does the substitute's higher logic cell count affect design compatibility?

A: The substitute's greater logic capacity (7,384 vs. 432 cells) and RAM (125,829 vs. 16,384 bits) exceed the main part's specifications. Existing designs will fit within the substitute's capacity. However, FPGA design verification is required to confirm functional equivalence within the Trion® architecture and to validate timing closure.

Q: What are the moisture handling requirements for the substitute?

A: Both devices share identical MSL classification (3, 168 Hours). Storage, handling, and reflow procedures remain equivalent. Standard moisture control protocols for MSL-3 components apply to the substitute.

Q: Is the substitute suitable for high-temperature applications?

A: Both devices operate within the identical temperature range (0°C to 85°C TJ). The substitute does not extend the thermal operating range. Applications requiring operation beyond 85°C require alternative component selection.

Q: What compliance certifications does the substitute provide?

A: The T8Q144C3 is ROHS3 compliant and REACH unaffected. The main part is RoHS non-compliant. The substitute meets current environmental and regulatory standards, providing compliance alignment for new designs and regulatory requirement satisfaction.

Q: Is design migration from Spartan®-II to Trion® architecture straightforward?

A: Design migration requires FPGA design file modification to accommodate the Trion® architecture, including logic synthesis retargeting, timing analysis, and functional verification. The substitute's enhanced capacity simplifies design implementation but does not eliminate the need for architectural validation.