XC2364B40F80LABKXUMA1 Equivalent & Substitute Parts

Part Overview

The XC2364B40F80LABKXUMA1 is a C166SV2 16/32-bit microcontroller from Infineon Technologies' XC23xxB series, operating at 80MHz with 320KB FLASH memory and 34KB RAM. This device is classified as obsolete, making identification of suitable substitute components essential for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

XC2364B40F80LABKXUMA1
Infineon TechnologiesIn Stock: 905XC2364B40F80LABKXUMA1 Datasheet
XC2364B40F80LABKXUMA1
Current Part
XC2365B40F80LRABKXUMA1
Infineon TechnologiesIn Stock: 3134XC2365B40F80LRABKXUMA1 Datasheet
XC2365B40F80LRABKXUMA1
Direct

Key Parameters

Parameter Value
Manufacturer Infineon Technologies
Series XC23xxB
Core Processor C166SV2
Core Size 16/32-Bit
Speed 80MHz
Program Memory Size 320KB (320K x 8)
Program Memory Type FLASH
RAM Size 34K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 76
Data Converters A/D 16x10b
Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I2S, POR, PWM, WDT
Operating Temperature -40°C ~ 125°C (TA)
Package / Case 100-LQFP Exposed Pad
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the XC2364B40F80LABKXUMA1 is determined by strict equivalence across the following critical parameters:

  • Core Processor Architecture: C166SV2 (identical processor core required)
  • Memory Configuration: 320KB FLASH and 34KB RAM (exact capacity match)
  • Operating Frequency: 80MHz (clock speed equivalence)
  • Voltage Supply Range: 3V ~ 5.5V (power supply compatibility)
  • I/O Count: 76 pins (functional pin count)
  • Connectivity Interfaces: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI (peripheral feature set)
  • Package Type: 100-LQFP Exposed Pad (physical form factor)
  • Mounting Technology: Surface Mount (assembly compatibility)

The XC2365B40F80LRABKXUMA1 meets all substitution criteria as a direct equivalent within the XC23xxB microcontroller family.

Parameter Comparison

Parameter XC2364B40F80LABKXUMA1 XC2365B40F80LRABKXUMA1 Match Status
Manufacturer Infineon Technologies Infineon Technologies Identical
Series XC23xxB XC23xxB Identical
Core Processor C166SV2 C166SV2 Identical
Core Size 16/32-Bit 16/32-Bit Identical
Speed 80MHz 80MHz Identical
Program Memory Size 320KB (320K x 8) 320KB (320K x 8) Identical
Program Memory Type FLASH FLASH Identical
RAM Size 34K x 8 34K x 8 Identical
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V Identical
Number of I/O 76 76 Identical
Data Converters A/D 16x10b A/D 16x10b Identical
Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Identical
Peripherals I2S, POR, PWM, WDT I2S, POR, PWM, WDT Identical
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) Identical
Package / Case 100-LQFP Exposed Pad 100-LQFP Exposed Pad Identical
Mounting Type Surface Mount Surface Mount Identical
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) Identical
Product Status Obsolete Last Time Buy Substitute Available
Packaging Bulk Tape & Reel (TR) Different
RoHS Status Not Specified ROHS3 Compliant Substitute Compliant

Engineering Selection Recommendations

The XC2365B40F80LRABKXUMA1 is the direct functional equivalent for the obsolete XC2364B40F80LABKXUMA1. Selection of the substitute part is based on:

  • Functional Equivalence: All electrical, memory, and peripheral specifications are identical across both devices.
  • Product Status Advantage: The XC2365B40F80LRABKXUMA1 carries Last Time Buy status, providing extended availability compared to the obsolete XC2364B40F80LABKXUMA1.
  • Compliance Enhancement: The substitute part is ROHS3 compliant, meeting current environmental and regulatory requirements.
  • Packaging Consideration: The substitute is supplied in Tape & Reel (TR) format, suitable for automated assembly processes, whereas the original part is supplied in bulk packaging.
  • Inventory Availability: The substitute part has higher current inventory (3025 Pcs) compared to the original (828 Pcs).

Frequently Asked Questions (FAQ)

Q: Are the XC2364B40F80LABKXUMA1 and XC2365B40F80LRABKXUMA1 pin-compatible?

A: Yes. Both devices use the 100-LQFP Exposed Pad package with identical pin assignments, I/O count (76 pins), and electrical characteristics. Direct PCB-level substitution is supported without layout modifications.

Q: What is the difference between the two part numbers?

A: The primary differences are product status and packaging format. The XC2364B40F80LABKXUMA1 is obsolete and supplied in bulk; the XC2365B40F80LRABKXUMA1 is Last Time Buy status and supplied in Tape & Reel format. All functional specifications are identical.

Q: Can I use the XC2365B40F80LRABKXUMA1 in existing designs using the XC2364B40F80LABKXUMA1?

A: Yes. The substitute part is functionally equivalent across all electrical, memory, and peripheral parameters. No firmware, software, or circuit modifications are required for direct substitution.

Q: What does Last Time Buy status mean for the XC2365B40F80LRABKXUMA1?

A: Last Time Buy indicates that Infineon will continue to supply this part for a limited period before discontinuation. This provides a defined window for procurement and design transition planning.

Q: Is the XC2365B40F80LRABKXUMA1 ROHS compliant?

A: Yes. The XC2365B40F80LRABKXUMA1 is ROHS3 compliant, meeting current environmental and hazardous substance restrictions. The original XC2364B40F80LABKXUMA1 compliance status is not specified in available documentation.

Q: Does packaging format affect electrical performance?

A: No. Tape & Reel (TR) and bulk packaging formats do not affect device electrical performance, functionality, or reliability. The packaging difference is relevant only for procurement, storage, and assembly process compatibility.

Q: What is the Moisture Sensitivity Level (MSL) for both parts?

A: Both parts have MSL 3 (168 Hours), indicating identical moisture handling and storage requirements. Standard moisture control procedures during storage and assembly apply to both devices.

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