WS5A47R0J Equivalent & Substitute Parts

Part Overview

The WS5A47R0J is a 47 Ohm, 5W wirewound through-hole resistor manufactured by Bourns Inc. in the WS series. This axial-package component features flame retardant coating, pulse withstanding capability, and safety-rated construction, making it suitable for applications requiring reliable power dissipation and thermal stability across industrial temperature ranges. The part is currently in active production status with 897 units in stock. Substitute parts are identified to address packaging variations, inventory availability, and application-specific requirements while maintaining electrical and mechanical compatibility.

Substiute Parts

WS5A47R0J

Bourns Inc.In Stock: 915WS5A47R0J Datasheet

Current PartRFQ

WS5M47R0J

Bourns Inc.In Stock: 4106WS5M47R0J Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the WS5A47R0J is determined by the following critical parameters:

• Resistance Value: 47 Ohms (exact match required)
• Tolerance: ±5% (exact match required)
• Power Rating: 5W (exact match required)
• Composition: Wirewound (exact match required)
• Package Type: Axial (exact match required)
• Temperature Coefficient: ±200ppm/°C (exact match required)
• Operating Temperature Range: -55°C to 200°C (exact match required)
• Regulatory Compliance: ROHS3 Compliant, REACH Unaffected (exact match required)

The WS5M47R0J qualifies as a direct substitute based on identical electrical specifications, composition, and regulatory compliance. The primary difference is the physical dimension and packaging format, which does not affect electrical performance or thermal characteristics in applications where the smaller form factor is acceptable.

Parameter Comparison

Engineering Selection Recommendations

Both the WS5A47R0J and WS5M47R0J are active production components with identical electrical specifications and full regulatory compliance (ROHS3 Compliant, REACH Unaffected). Selection between these parts depends on physical space constraints and packaging requirements:

• WS5A47R0J: Select when standard axial package dimensions (8.50mm diameter × 24.50mm length) are specified or when standard packaging format is required.
• WS5M47R0J: Select when compact form factor (6.50mm diameter × 17.50mm length) is acceptable and when cut tape packaging format is compatible with assembly processes. This option provides higher inventory availability (3998 units versus 897 units).

Both parts deliver identical thermal performance, pulse withstanding capability, and safety-rated construction across the full operating temperature range of -55°C to 200°C.

Frequently Asked Questions (FAQ)

Q: Can WS5M47R0J replace WS5A47R0J in all applications?

A: Yes, provided that the smaller physical dimensions (6.50mm diameter × 17.50mm length versus 8.50mm diameter × 24.50mm length) are compatible with the PCB layout and mechanical assembly. Electrical performance, thermal characteristics, and regulatory compliance are identical.

Q: What is the difference between standard packaging and cut tape (CT) packaging?

A: Cut tape packaging is a continuous reel format where components are individually cut and separated, typically used for automated assembly processes. Standard packaging refers to the base component format. Both deliver identical electrical and mechanical specifications.

Q: Are there any thermal performance differences between these parts?

A: No. Both parts have identical power ratings (5W), temperature coefficients (±200ppm/°C), and operating temperature ranges (-55°C to 200°C). Thermal performance is equivalent.

Q: Do both parts meet the same regulatory requirements?

A: Yes. Both WS5A47R0J and WS5M47R0J are ROHS3 Compliant and REACH Unaffected, with identical ECCN (EAR99) and HTSUS (8533.21.0080) classifications.

Q: Which part should be selected for new designs?

A: Selection is based on physical space availability and packaging format compatibility. Both parts are in active production. The WS5M47R0J offers higher inventory availability and a more compact form factor for space-constrained applications.