WM8985CGEFL/R Equivalent & Substitute Parts

Part Overview

The WM8985CGEFL/R is a stereo audio codec manufactured by Cirrus Logic Inc., designed for high-fidelity audio applications requiring 24-bit I2S and PCM digital interfaces. This component integrates dual ADCs and DACs with Sigma Delta modulation, delivering 92.5 dB SNR on the ADC side and 98 dB SNR on the DAC side. The device is housed in a 32-QFN (5x5) surface mount package with exposed pad.

The WM8985CGEFL/R has reached obsolete product status. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for legacy systems or new designs requiring compatible audio codec functionality.

Substiute Parts

WM8985CGEFL/R

Cirrus Logic Inc.In Stock: 812WM8985CGEFL/R Datasheet

Current PartRFQ

WM8962BECSN/R

Cirrus Logic Inc.In Stock: 6197WM8962BECSN/R Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the WM8985CGEFL/R is determined by the following critical parameters:

Functional Equivalence Criteria:

• Stereo audio codec architecture with dual ADCs and DACs
• 24-bit resolution capability
• Sigma Delta modulation support
• SNR performance within acceptable range for audio applications
• Operating temperature range compatibility (-40°C ~ 85°C)

Interface Compatibility Considerations:

• The WM8985CGEFL/R uses I2S and PCM digital interfaces
• Substitute parts must support equivalent or compatible digital interface protocols
• Control interface requirements must be evaluated for system integration

Electrical Supply Requirements:

• Analog supply voltage range: 2.5V ~ 3.6V
• Digital supply voltage range: 1.71V ~ 3.6V
• Substitute parts must operate within or encompass these voltage specifications

Physical and Compliance Factors:

• Surface mount technology requirement
• RoHS compliance status
• Moisture sensitivity level (MSL 1)
• REACH and ECCN compliance alignment

The WM8962BECSN/R qualifies as a manufacturer-recommended substitute based on shared core audio codec functionality, dual ADC/DAC architecture, 24-bit resolution, Sigma Delta modulation, compatible operating temperature range, and equivalent compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The WM8985CGEFL/R is classified as obsolete, indicating discontinued manufacturing and limited availability. The WM8962BECSN/R maintains active product status with current manufacturing support and established supply chain availability (6140 pcs in stock versus 712 pcs for the legacy part).

Compliance and Certification Alignment: Both parts maintain equivalent compliance certifications: RoHS compliance, REACH unaffected status, EAR99 ECCN classification, and MSL 1 moisture sensitivity rating. The WM8962BECSN/R carries ROHS3 compliance, representing current regulatory standards.

Critical Design Integration Factor: The primary design consideration for substitution is the digital interface protocol difference. The WM8985CGEFL/R implements I2S and PCM interfaces, while the WM8962BECSN/R implements I2C and SPI interfaces. System-level integration feasibility depends on whether the host processor and firmware can accommodate this interface change.

Electrical Supply Compatibility: The WM8962BECSN/R analog supply voltage range (1.7V ~ 2V) is narrower than the WM8985CGEFL/R (2.5V ~ 3.6V). Designs operating at 2.5V or higher analog supply must verify compatibility with the substitute part's lower maximum specification.

Package Form Factor: The WM8962BECSN/R uses a 49-WLCSP package (3.6x3.9 mm) compared to the 32-QFN package (5x5 mm) of the original part. PCB layout redesign is required for physical integration.

Frequently Asked Questions (FAQ)

Q: Can the WM8962BECSN/R directly replace the WM8985CGEFL/R without firmware changes?

A: Direct replacement is not possible without system-level modifications. The WM8962BECSN/R uses I2C and SPI control interfaces, whereas the WM8985CGEFL/R uses I2S and PCM. The host processor firmware must be updated to support the different interface protocol. Additionally, the PCB layout must be redesigned to accommodate the different package form factor.

Q: What are the key electrical differences between these two parts?

A: The WM8962BECSN/R has a higher ADC SNR specification (94 dB versus 92.5 dB) and identical DAC SNR (98 dB). The analog supply voltage range differs significantly: WM8962BECSN/R operates at 1.7V ~ 2V, while WM8985CGEFL/R operates at 2.5V ~ 3.6V. Digital supply voltage ranges are comparable. Both maintain identical operating temperature specifications (-40°C ~ 85°C).

Q: Is the WM8962BECSN/R suitable for legacy system retrofits?

A: Retrofitting requires comprehensive system redesign including firmware rewrite for interface protocol support, PCB layout modification for the new package, and electrical supply circuit adjustment for the narrower analog voltage range. The substitute is functionally equivalent in audio codec capability but not pin-compatible or interface-compatible with the original design.

Q: What is the significance of the different package types?

A: The WM8985CGEFL/R uses a 32-QFN (5x5 mm) package, while the WM8962BECSN/R uses a 49-WLCSP (3.6x3.9 mm) package. The WLCSP package is smaller and uses ball grid array technology instead of quad flat pack leads. This requires different PCB design, assembly processes, and testing procedures. The increased pin count (49 versus 32) may provide additional functionality or flexibility.

Q: Are both parts RoHS compliant?

A: Yes. The WM8985CGEFL/R is RoHS Compliant, and the WM8962BECSN/R is ROHS3 Compliant. Both meet current regulatory requirements for hazardous substance restrictions. The ROHS3 designation on the substitute indicates compliance with the most current RoHS directive revision.

Q: What is the moisture sensitivity level, and why does it matter?

A: Both parts carry MSL 1 (Unlimited) rating, indicating the lowest moisture sensitivity classification. This means the components can be stored indefinitely without moisture bake-out procedures prior to soldering, simplifying inventory management and manufacturing logistics for both the original and substitute parts.