WLAN8101HMP Equivalent & Substitute Parts

Part Overview

The WLAN8101HMP is a QFN module RF Amplifier IC manufactured by NXP USA Inc. This component is classified as obsolete, indicating it is no longer in active production. For applications currently utilizing the WLAN8101HMP, identifying suitable substitute components is essential to ensure design continuity and maintain supply chain reliability. The obsolete status necessitates evaluation of functionally equivalent alternatives that meet the same electrical and mechanical requirements.

Substiute Parts

WLAN8101HMP
NXP USA Inc.In Stock: 3146WLAN8101HMP Datasheet
WLAN8101HMP
Current Part
WLAN7207HY
NXP USA Inc.In Stock: 723WLAN7207HY Datasheet
WLAN7207HY
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number WLAN8101HMP
Manufacturer NXP USA Inc.
Description QFN MODULE
Detailed Description RF Amplifier IC
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991G
HTSUS 8542.31.0001

Substitute Part Grouping Explanation

Substitute components for the WLAN8101HMP are identified based on the following criteria:

  • Functional classification as RF module components
  • Manufacturer alignment (NXP USA Inc.)
  • Compliance certifications (ROHS3, REACH Unaffected)
  • Physical form factor compatibility (QFN/WFLGA package families)
  • Active product status to ensure ongoing availability

The WLAN7207HY meets these substitution criteria as an active NXP product with equivalent compliance certifications and compatible packaging architecture.

Parameter Comparison

Parameter WLAN8101HMP WLAN7207HY
Manufacturer NXP USA Inc. NXP USA Inc.
Description QFN MODULE QFN MODULE
Detailed Description RF Amplifier IC RF Front End 2.4GHz WLAN 18-HWFLGA (2x2.4)
Product Status Obsolete Active
RF Type Not specified WLAN
Frequency Not specified 2.4GHz
Package / Case Not specified 18-WFLGA Exposed Pad
Supplier Device Package Not specified 18-HWFLGA (2x2.4)
RoHS Status ROHS3 Compliant Not specified
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The WLAN7207HY is identified as the primary substitute for the obsolete WLAN8101HMP based on the following factors:

  • Both components are manufactured by NXP USA Inc., ensuring consistent design and quality standards
  • The WLAN7207HY maintains active product status, providing assured long-term availability and supply chain stability
  • Both components comply with REACH regulations (REACH Unaffected designation)
  • The WLAN7207HY is specified as a 2.4GHz WLAN RF Front End module, indicating functional alignment with wireless RF applications
  • Package compatibility is maintained through the 18-WFLGA Exposed Pad configuration

Selection of the WLAN7207HY as a substitute requires verification that the specific electrical characteristics, pin configuration, and frequency band alignment meet the requirements of the target application.

Frequently Asked Questions (FAQ)

Q: Why is the WLAN8101HMP classified as obsolete? A: The WLAN8101HMP has reached end-of-life status and is no longer manufactured by NXP USA Inc. Obsolete classification indicates production has been discontinued.

Q: What makes the WLAN7207HY a suitable substitute? A: The WLAN7207HY is manufactured by the same supplier (NXP USA Inc.), maintains equivalent compliance certifications (REACH Unaffected), and is specified as an active RF Front End module for 2.4GHz WLAN applications. Both components utilize compatible QFN/WFLGA package architectures.

Q: Are there electrical parameter differences between these components? A: Detailed electrical parameters (gain, noise figure, P1dB, supply voltage, and supply current) are not provided in the available specification data for either component. Direct electrical equivalence must be confirmed through detailed datasheet review and application-specific testing.

Q: What is the significance of the 18-HWFLGA (2x2.4) package designation? A: This designation specifies an 18-pin WFLGA package with exposed pad, with physical dimensions of 2.0mm x 2.4mm. This form factor is standard for compact RF module applications.

Q: Does the WLAN7207HY require different PCB layout considerations? A: The 18-WFLGA Exposed Pad package may require specific PCB layout practices for thermal management and RF signal integrity. Layout compatibility must be evaluated against the original WLAN8101HMP design.

Q: Are there supply chain considerations for the WLAN7207HY? A: The WLAN7207HY is listed as active with 632 units in stock, indicating current availability. Active product status provides assurance of continued supply compared to the obsolete WLAN8101HMP.

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