W971GG8KB25I Equivalent & Substitute Parts

Part Overview

The W971GG8KB25I is a 1Gbit DDR2 SDRAM memory IC manufactured by Winbond Electronics in a 60-WBGA (8x12.5) package. This component operates at 200 MHz with a 57.5 ns access time and is designed for parallel memory applications requiring 1.7V to 1.9V supply voltage across an operating temperature range of -40°C to 95°C.

The W971GG8KB25I is classified as obsolete. Equivalent and substitute parts are necessary to maintain system compatibility, ensure continued availability, and support legacy equipment requiring DDR2 SDRAM memory with identical electrical and mechanical specifications.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Memory Format	SDRAM - DDR2
Memory Size	1Gbit
Memory Organization	128M x 8
Memory Interface	Parallel
Clock Frequency	200 MHz
Access Time	57.5 ns
Write Cycle Time	15 ns
Voltage Supply	1.7V ~ 1.9V
Operating Temperature	-40°C ~ 95°C (TC)
Package Type	60-WBGA (8x12.5)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the W971GG8KB25I is determined by strict equivalence across the following critical parameters:

Core Electrical Compatibility:

Memory Type: Volatile DRAM
Memory Format: SDRAM - DDR2
Memory Size: 1Gbit
Memory Organization: 128M x 8
Memory Interface: Parallel
Voltage Supply: 1.7V ~ 1.9V
Write Cycle Time: 15 ns

Mechanical Compatibility:

Mounting Type: Surface Mount
Package Classification: 60-pin BGA variants (WBGA, TWBGA, FBGA)

Performance Parameters:

Clock Frequency: 200 MHz or higher
Access Time: 57.5 ns or faster
Operating Temperature: Must encompass -40°C to 95°C or equivalent industrial range

Compliance Requirements:

RoHS3 Compliant
Moisture Sensitivity Level: 3 (168 Hours)

Substitute parts are grouped based on whether they meet all core electrical requirements while offering equal or superior performance characteristics. Package variants (WBGA, TWBGA, FBGA) are considered compatible within the 60-pin BGA family when pin configurations and electrical specifications align.

Parameter Comparison

Part Number	Manufacturer	Memory Size	Organization	Clock Frequency	Access Time	Voltage Supply	Operating Temperature	Package	Product Status
W971GG8KB25I	Winbond Electronics	1Gbit	128M x 8	200 MHz	57.5 ns	1.7V ~ 1.9V	-40°C ~ 95°C (TC)	60-WBGA (8x12.5)	Obsolete
IS43DR81280B-25EBL	ISSI	1Gbit	128M x 8	400 MHz	450 ps	1.7V ~ 1.9V	0°C ~ 70°C (TA)	60-TWBGA (8x10.5)	Active
IS43DR81280B-25EBLI	Integrated Silicon Solution	1Gbit	128M x 8	400 MHz	450 ps	1.7V ~ 1.9V	-40°C ~ 85°C (TA)	60-TWBGA (8x10.5)	Active
IS43DR81280C-25DBLI	ISSI	1Gbit	128M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 85°C (TA)	60-TWBGA (8x10.5)	Active
IS46DR81280B-25DBLA1	ISSI	1Gbit	128M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 85°C (TA)	60-TWBGA (8x10.5)	Active
IS46DR81280B-25DBLA2	ISSI	1Gbit	128M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 105°C (TA)	60-TWBGA (8x10.5)	Active
IS46DR81280B-3DBLA1	ISSI	1Gbit	128M x 8	333 MHz	450 ps	1.7V ~ 1.9V	-40°C ~ 85°C (TA)	60-TWBGA (8x10.5)	Active
MT47H128M8SH-25E IT:M	Micron Technology Inc.	1Gbit	128M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 95°C (TC)	60-FBGA (8x10)	Active
MT47H128M8SH-25E:M	Micron Technology Inc.	1Gbit	128M x 8	400 MHz	400 ps	1.7V ~ 1.9V	0°C ~ 85°C (TC)	60-FBGA (8x10)	Active

Engineering Selection Recommendations

Primary Substitutes for Full Compatibility:

The MT47H128M8SH-25E IT:M offers the closest functional equivalence to the W971GG8KB25I. Both components operate across the -40°C to 95°C temperature range, maintain identical voltage supply specifications (1.7V ~ 1.9V), and deliver superior performance with 400 MHz clock frequency and 400 ps access time. The 60-FBGA package is mechanically compatible within the 60-pin BGA family. This part is actively manufactured and RoHS3 compliant.

Secondary Substitutes with Temperature Derating:

The IS43DR81280C-25DBLI and IS46DR81280B-25DBLA1 provide electrical equivalence with identical memory organization and voltage specifications. Both operate at 400 MHz with 400 ps access time. The operating temperature range is -40°C to 85°C, which covers the primary operating window of the W971GG8KB25I but does not extend to the full 95°C upper limit. These parts are actively manufactured and RoHS3 compliant.

Extended Temperature Range Alternative:

The IS46DR81280B-25DBLA2 extends the operating temperature to -40°C to 105°C, providing margin beyond the original specification. This part maintains all electrical equivalence criteria and is actively manufactured.

Performance-Optimized Alternatives:

The IS46DR81280B-3DBLA1 operates at 333 MHz with 450 ps access time, representing a mid-range performance option between the original 200 MHz specification and the 400 MHz alternatives. This part is suitable for applications where the original 200 MHz specification is a minimum requirement rather than a target frequency.

All substitute parts listed are RoHS3 compliant with Moisture Sensitivity Level 3 (168 Hours), matching the original component's environmental specifications.

Frequently Asked Questions (FAQ)

Q: Can the MT47H128M8SH-25E IT:M directly replace the W971GG8KB25I in existing designs?

A: The MT47H128M8SH-25E IT:M meets all core electrical specifications: 1Gbit capacity, 128M x 8 organization, 1.7V ~ 1.9V supply voltage, and parallel interface. The 60-FBGA package is mechanically compatible with 60-pin BGA socket designs. The superior performance characteristics (400 MHz vs. 200 MHz, 400 ps vs. 57.5 ns access time) ensure backward compatibility. Physical board layout verification is required to confirm pin-to-pin compatibility within the 60-pin BGA family.

Q: What is the difference between the ISSI IS43DR81280C-25DBLI and IS46DR81280B-25DBLA1?

A: Both parts share identical electrical specifications: 1Gbit capacity, 128M x 8 organization, 400 MHz clock frequency, 400 ps access time, and 1.7V ~ 1.9V supply voltage. The primary difference is the base product number designation (IS43 vs. IS46), which reflects internal design revisions. Both operate across -40°C to 85°C. The IS46DR81280B-25DBLA1 is the more recent design variant.

Q: Why does the IS43DR81280B-25EBL have a narrower operating temperature range (0°C ~ 70°C) compared to other substitutes?

A: The IS43DR81280B-25EBL is specified for commercial-grade applications with a 0°C to 70°C operating range. The W971GG8KB25I is specified for industrial-grade applications (-40°C to 95°C). The IS43DR81280B-25EBL is suitable only for applications that do not require the full industrial temperature range. For industrial applications, select IS43DR81280B-25EBLI, IS43DR81280C-25DBLI, or MT47H128M8SH-25E IT:M.

Q: Are all substitute parts RoHS3 compliant?

A: All substitute parts listed are RoHS3 compliant and carry Moisture Sensitivity Level 3 (168 Hours), matching the environmental compliance profile of the W971GG8KB25I.

Q: What is the significance of the package designation differences (WBGA vs. TWBGA vs. FBGA)?

A: All three package types are 60-pin Ball Grid Array variants with compatible electrical interfaces. WBGA (8x12.5), TWBGA (8x10.5), and FBGA (8x10) differ in physical dimensions. The W971GG8KB25I uses WBGA; substitute parts use TWBGA or FBGA. Physical board layout and socket compatibility must be verified before substitution. Pin assignments within the 60-pin BGA family are standardized for DDR2 SDRAM devices.

Q: Can the IS46DR81280B-25DBLA2 be used in applications requiring operation above 95°C?

A: The IS46DR81280B-25DBLA2 is specified for -40°C to 105°C operation, extending 10°C beyond the original W971GG8KB25I specification. This part is suitable for applications requiring operation up to 105°C. Thermal management and board-level design considerations remain the responsibility of the system designer.

Q: What performance improvement does the MT47H128M8SH-25E:M provide over the W971GG8KB25I?

A: The MT47H128M8SH-25E:M operates at 400 MHz clock frequency (2x the original 200 MHz) with 400 ps access time (faster than the original 57.5 ns). These performance enhancements provide improved memory bandwidth and reduced latency. The part is backward compatible with designs requiring the original 200 MHz specification, as it exceeds the minimum performance requirements.

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