W632GU8KB-15 Equivalent & Substitute Parts

Part Overview

The W632GU8KB-15 is a 2Gbit DDR3L SDRAM memory IC manufactured by Winbond Electronics in a 78-WBGA package. This part operates at 667 MHz with a 20 ns access time and is designed for parallel memory applications requiring 1.283V to 1.45V supply voltage. The product is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives from active manufacturers. Substitute parts must maintain electrical compatibility while meeting the same memory capacity, interface type, and voltage specifications.

Substiute Parts

W632GU8KB-15
Winbond ElectronicsIn Stock: 954W632GU8KB-15 Datasheet
W632GU8KB-15
Current Part
IS43TR82560BL-15HBLI
ISSI, Integrated Silicon Solution IncIn Stock: 1112IS43TR82560BL-15HBLI Datasheet
IS43TR82560BL-15HBLI
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IS43TR82560DL-125KBL
ISSI, Integrated Silicon Solution IncIn Stock: 1160IS43TR82560DL-125KBL Datasheet
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MT41K256M8DA-107 AIT:K TR
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MT41K256M8DA-107:K
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MT41K256M8DA-125 AIT:K
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MT41K256M8DA-125:K TR
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Key Parameters

Parameter W632GU8KB-15
Memory Type Volatile DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Clock Frequency 667 MHz
Access Time 20 ns
Voltage Supply 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C
Package Type 78-WBGA (10.5x8)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the W632GU8KB-15 are selected based on strict electrical and mechanical compatibility criteria. All substitute candidates must meet the following requirements:

Core Compatibility Parameters:

  • Memory Type: Volatile DRAM
  • Technology: SDRAM - DDR3L
  • Memory Size: 2Gbit
  • Memory Organization: 256M x 8
  • Memory Interface: Parallel
  • Voltage Supply Range: 1.283V ~ 1.45V
  • Access Time: 20 ns or faster
  • Mounting Type: Surface Mount
  • RoHS3 Compliance
  • MSL Rating: 3 (168 Hours)

Substitutes are grouped into two categories based on clock frequency and package configuration:

Group 1 - Direct Frequency Match (667 MHz): IS43TR82560BL-15HBLI operates at the same 667 MHz clock frequency as the original part, providing direct functional equivalence with extended operating temperature range.

Group 2 - Higher Frequency Operation (800-933 MHz): MT41K256M8DA-125 variants and IS43TR82560DL-125KBL operate at higher clock frequencies (800-933 MHz) while maintaining backward compatibility through DDR3L technology. These parts deliver improved performance specifications while remaining electrically compatible.

Parameter Comparison

Parameter W632GU8KB-15 IS43TR82560BL-15HBLI IS43TR82560DL-125KBL MT41K256M8DA-107 AIT:K TR MT41K256M8DA-107:K MT41K256M8DA-125 AIT:K MT41K256M8DA-125 IT:K MT41K256M8DA-125:K MT41K256M8DA-125:K TR
Manufacturer Winbond ISSI ISSI Micron Micron Micron Micron Micron Micron
Memory Size 2Gbit 2Gbit 2Gbit 2Gbit 2Gbit 2Gbit 2Gbit 2Gbit 2Gbit
Memory Organization 256M x 8 256M x 8 256M x 8 256M x 8 256M x 8 256M x 8 256M x 8 256M x 8 256M x 8
Technology DDR3L DDR3L DDR3L DDR3L DDR3L DDR3L DDR3L DDR3L DDR3L
Clock Frequency 667 MHz 667 MHz 800 MHz 933 MHz 933 MHz 800 MHz 800 MHz 800 MHz 800 MHz
Access Time 20 ns 20 ns 20 ns 20 ns 20 ns 13.75 ns 13.75 ns 13.75 ns 13.75 ns
Voltage Supply 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C -40°C ~ 95°C 0°C ~ 95°C -40°C ~ 95°C 0°C ~ 95°C -40°C ~ 95°C -40°C ~ 95°C 0°C ~ 95°C 0°C ~ 95°C
Package Type 78-WBGA (10.5x8) 78-TWBGA (8x10.5) 78-TWBGA (8x10.5) 78-FBGA (8x10.5) 78-FBGA (8x10.5) 78-FBGA (8x10.5) 78-FBGA (8x10.5) 78-FBGA (8x10.5) 78-FBGA (8x10.5)
RoHS Status ROHS3 ROHS3 ROHS3 ROHS3 ROHS3 ROHS3 ROHS3 ROHS3 ROHS3
MSL Rating 3 3 3 3 3 3 3 3 3
Product Status Discontinued Active Active Active Active Active Active Active Active
AEC-Q100 Qualification Not specified Not specified Yes Yes Not specified Yes Not specified Not specified Not specified

Engineering Selection Recommendations

For Direct Frequency Replacement: IS43TR82560BL-15HBLI is the primary substitute when maintaining 667 MHz operation is required. This part is manufactured by ISSI and is currently active in production. It provides identical clock frequency and access time specifications while offering an extended operating temperature range (-40°C to 95°C) compared to the original part (0°C to 95°C). Both parts are ROHS3 compliant with matching MSL ratings.

For Enhanced Performance Applications: The MT41K256M8DA-125 series (available in AIT:K, IT:K, :K, and :K TR variants) operates at 800 MHz with improved 13.75 ns access time, providing performance enhancement over the original 667 MHz specification. These parts are manufactured by Micron Technology and are currently active. The AIT:K variant includes AEC-Q100 automotive qualification. All variants maintain full electrical compatibility with the original part's voltage and memory specifications.

For Highest Performance with Automotive Qualification: MT41K256M8DA-107 AIT:K TR operates at 933 MHz with AEC-Q100 qualification and extended temperature range (-40°C to 95°C). This variant is suitable for applications requiring maximum performance and automotive-grade reliability.

For Automotive Applications: IS43TR82560DL-125KBL is qualified to AEC-Q100 and operates at 800 MHz, providing automotive-grade reliability with enhanced frequency performance.

All substitute parts maintain ROHS3 compliance and identical MSL ratings to the original component, ensuring compatibility with existing manufacturing and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can I use a higher frequency DDR3L memory IC as a substitute for the W632GU8KB-15?

A: Yes. DDR3L memory ICs operating at higher clock frequencies (800 MHz or 933 MHz) are backward compatible with applications designed for 667 MHz operation. The MT41K256M8DA-125 series and IS43TR82560DL-125KBL operate at higher frequencies while maintaining full electrical compatibility through DDR3L technology. The system controller will operate these parts at the lower frequency if required.

Q: What is the difference between the 78-WBGA, 78-TWBGA, and 78-FBGA packages?

A: All three package types are 78-pin ball grid arrays with identical pin counts and electrical functionality. The designations (WBGA, TWBGA, FBGA) indicate different manufacturer package implementations. The physical dimensions are nominally equivalent (8x10.5 or 10.5x8 mm), and these parts are mechanically interchangeable on PCBs designed for 78-pin BGA packages.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All substitute parts listed are ROHS3 compliant, matching the compliance status of the original W632GU8KB-15.

Q: What does AEC-Q100 qualification mean?

A: AEC-Q100 is an automotive electronics qualification standard. Parts bearing this qualification have undergone rigorous testing for automotive applications. IS43TR82560DL-125KBL, MT41K256M8DA-107 AIT:K TR, and MT41K256M8DA-125 AIT:K are AEC-Q100 qualified, making them suitable for automotive systems.

Q: Can I substitute a part with a narrower operating temperature range?

A: Substitution with a narrower operating temperature range is acceptable only if your application operates within that narrower range. The original W632GU8KB-15 operates from 0°C to 95°C. Parts with identical or wider temperature ranges (-40°C to 95°C) provide full compatibility. Parts with identical 0°C to 95°C ranges are direct matches.

Q: What is the significance of the packaging variants (Tray, Tape & Reel)?

A: Packaging variants affect handling and assembly processes but do not impact electrical functionality. Tray packaging is suitable for manual handling and small-volume assembly. Tape & Reel (TR) packaging is optimized for automated pick-and-place assembly equipment. Select based on your manufacturing process requirements.

Q: Is the 20 ns access time specification critical for substitution?

A: The 20 ns access time is a maximum specification. Substitute parts with equal or faster access times (such as the MT41K256M8DA-125 series at 13.75 ns) are fully compatible and provide performance improvement. Faster access times do not create compatibility issues.

Q: Why do some substitute parts have different write cycle times?

A: Write cycle time specifications are provided only for certain parts. This parameter does not affect substitution compatibility for applications using standard DDR3L memory controllers, which manage write timing internally based on clock frequency.

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