W631GG6MB-09 Equivalent & Substitute Parts

Part Overview

The W631GG6MB-09 is a 1Gbit DDR3 SDRAM memory integrated circuit manufactured by Winbond Electronics. This component is classified as obsolete and is no longer in active production. The part features SSTL_15 interface signaling, operates at 1.066 GHz clock frequency, and is packaged in a 96-VFBGA form factor with dimensions of 7.5x13mm. Due to its obsolete status, equivalent substitute parts are necessary for ongoing system support, maintenance, and new design implementations where DDR3 SDRAM functionality is required.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Technology	SDRAM - DDR3
Memory Size	1Gbit
Memory Interface	SSTL_15
Clock Frequency	1.066 GHz
Access Time	20 ns
Write Cycle Time	15 ns
Supply Voltage	1.425V ~ 1.575V
Operating Temperature	0°C ~ 95°C (TC)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the W631GG6MB-09 is determined by strict equivalence across the following critical parameters:

Direct Functional Equivalence Parameters:

Memory technology (SDRAM - DDR3)
Memory capacity (1Gbit total)
Memory interface standard (SSTL_15)
Clock frequency (1.066 GHz)
Access time (20 ns)
Write cycle time (15 ns)
Supply voltage range (1.425V ~ 1.575V)
Operating temperature range (0°C ~ 95°C)
RoHS compliance status (ROHS3)
Moisture sensitivity level (MSL 3)

Packaging Considerations: Substitutes may differ in package type (96-VFBGA versus 78-VFBGA) and memory organization (64M x 16 versus 128M x 8), provided the total memory capacity remains 1Gbit and the physical mounting type remains surface mount. Package differences require PCB layout verification.

Product Status: The W631GG6MB-09 is obsolete. Active substitute parts are preferred for new applications and ongoing support.

Parameter Comparison

Parameter	W631GG6MB-09 (Main)	W631GG6NB-09 (Substitute)	W631GG8NB-09 (Substitute)
Manufacturer	Winbond Electronics	Winbond Electronics	Winbond Electronics
Memory Type	Volatile DRAM	Volatile DRAM	Volatile DRAM
Technology	SDRAM - DDR3	SDRAM - DDR3	SDRAM - DDR3
Memory Size	1Gbit	1Gbit	1Gbit
Memory Organization	64M x 16	64M x 16	128M x 8
Memory Interface	SSTL_15	SSTL_15	SSTL_15
Clock Frequency	1.066 GHz	1.066 GHz	1.066 GHz
Access Time	20 ns	20 ns	20 ns
Write Cycle Time	15 ns	15 ns	15 ns
Supply Voltage	1.425V ~ 1.575V	1.425V ~ 1.575V	1.425V ~ 1.575V
Operating Temperature	0°C ~ 95°C (TC)	0°C ~ 95°C (TC)	0°C ~ 95°C (TC)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	96-VFBGA (7.5x13)	96-VFBGA (7.5x13)	78-VFBGA (8x10.5)
Product Status	Obsolete	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

W631GG6NB-09 Selection Criteria: The W631GG6NB-09 is a direct substitute for the W631GG6MB-09. Both parts share identical electrical specifications, memory organization (64M x 16), package dimensions (96-VFBGA 7.5x13), and compliance certifications. The W631GG6NB-09 is currently in active production status, making it the preferred choice for applications requiring pin-for-pin and footprint compatibility with the original W631GG6MB-09. This part requires no PCB layout modifications.

W631GG8NB-09 Selection Criteria: The W631GG8NB-09 is a parametric equivalent substitute. It maintains all critical electrical parameters (1Gbit capacity, 1.066 GHz frequency, 20 ns access time, SSTL_15 interface, identical voltage and temperature ranges) and compliance certifications. However, this part differs in two aspects: memory organization (128M x 8 versus 64M x 16) and package form factor (78-VFBGA 8x10.5 versus 96-VFBGA 7.5x13). Selection of the W631GG8NB-09 requires PCB redesign to accommodate the different package footprint and verification that the memory organization change is compatible with system architecture.

Product Status Consideration: Both substitute parts are in active production status, ensuring long-term availability and supply chain stability compared to the obsolete W631GG6MB-09.

Frequently Asked Questions (FAQ)

Q: Can the W631GG6NB-09 be used as a direct replacement for the W631GG6MB-09?

A: Yes. The W631GG6NB-09 is a direct substitute. Both parts are electrically identical, share the same package footprint (96-VFBGA 7.5x13), memory organization (64M x 16), and all electrical specifications. No PCB modifications are required.

Q: What is the difference between the W631GG6NB-09 and W631GG8NB-09?

A: The primary differences are package type and memory organization. The W631GG6NB-09 uses a 96-VFBGA package with 64M x 16 organization, while the W631GG8NB-09 uses a 78-VFBGA package with 128M x 8 organization. Both maintain 1Gbit total capacity and identical electrical performance. The different package requires PCB layout changes.

Q: Can the W631GG8NB-09 be used in place of the W631GG6MB-09 without PCB modifications?

A: No. The W631GG8NB-09 has a different package footprint (78-VFBGA 8x10.5 versus 96-VFBGA 7.5x13) and memory organization. PCB redesign is required to accommodate the new package dimensions and pin configuration.

Q: Are all three parts RoHS compliant?

A: Yes. The W631GG6MB-09, W631GG6NB-09, and W631GG8NB-09 are all ROHS3 compliant.

Q: What is the moisture sensitivity level for these parts?

A: All three parts have a Moisture Sensitivity Level (MSL) of 3, with a floor life of 168 hours. Standard moisture control procedures during storage and handling are required.

Q: Why is the W631GG6MB-09 listed as obsolete?

A: The W631GG6MB-09 is no longer manufactured by Winbond Electronics. Active substitute parts (W631GG6NB-09 and W631GG8NB-09) are available for new designs and system support.

Q: Do the substitute parts have the same operating temperature range?

A: Yes. All three parts operate across the same temperature range of 0°C to 95°C (TC).

Q: What supply voltage is required for these DDR3 SDRAM parts?

A: All three parts require a supply voltage between 1.425V and 1.575V.

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