W25Q64FVTBIP Equivalent & Substitute Parts

Part Overview

The W25Q64FVTBIP is a 64Mbit NOR Flash memory IC manufactured by Winbond Electronics, featuring SPI Quad I/O interface capability and QPI support. This device is packaged in a 24-TFBGA (8x6) surface mount configuration and operates across a supply voltage range of 2.7V to 3.6V with an operating temperature range of -40°C to 85°C.

The W25Q64FVTBIP is classified as obsolete. Substitute parts are necessary to ensure continued design support, maintain supply chain reliability, and access active product status with enhanced performance characteristics while maintaining electrical and mechanical compatibility.

Substiute Parts

W25Q64FVTBIP

Winbond ElectronicsIn Stock: 850W25Q64FVTBIP Datasheet

Current PartRFQ

W25Q64JVTBIG

Winbond ElectronicsIn Stock: 792W25Q64JVTBIG Datasheet

DirectRFQ

W25Q64JVTBIM

Winbond ElectronicsIn Stock: 715W25Q64JVTBIM Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the W25Q64FVTBIP are selected based on strict equivalence of the following critical parameters:

Mandatory Equivalence Parameters:

• Memory Size: 64Mbit
• Memory Organization: 8M x 8
• Memory Interface: SPI - Quad I/O
• Package / Case: 24-TBGA
• Supplier Device Package: 24-TFBGA (8x6)
• Voltage - Supply: 2.7V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Technology: FLASH - NOR
• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 3 (168 Hours)

The substitute parts W25Q64JVTBIG and W25Q64JVTBIM meet all mandatory equivalence parameters. These devices are manufactured by Winbond Electronics within the SpiFlash® series and maintain identical memory capacity, organization, interface protocol, physical packaging, voltage specifications, and environmental operating conditions. Both substitute parts carry active product status, ensuring long-term availability and supply chain continuity.

Parameter Comparison

Engineering Selection Recommendations

The W25Q64JVTBIG and W25Q64JVTBIM are direct functional equivalents to the W25Q64FVTBIP for applications requiring 64Mbit SPI Quad I/O NOR Flash memory in 24-TFBGA packaging. Both substitute parts are manufactured by Winbond Electronics and maintain identical electrical specifications, mechanical compatibility, and environmental operating conditions.

The primary distinction between the main part and substitute parts is product status. The W25Q64FVTBIP is classified as obsolete, whereas both W25Q64JVTBIG and W25Q64JVTBIM carry active product status. This transition ensures continued manufacturing support, supply chain availability, and compliance with current regulatory requirements.

Both substitute parts are ROHS3 compliant and REACH unaffected, meeting the same environmental and regulatory standards as the original part. The substitute parts demonstrate enhanced clock frequency performance at 133 MHz compared to the main part's 104 MHz specification, providing improved operational capability within the same electrical and thermal envelope.

Selection between W25Q64JVTBIG and W25Q64JVTBIM should be based on specific procurement requirements, inventory availability, and supplier device package designations, as both parts are electrically and mechanically equivalent.

Frequently Asked Questions (FAQ)

Q: Are W25Q64JVTBIG and W25Q64JVTBIM pin-compatible with W25Q64FVTBIP?

A: Yes. All three parts utilize the 24-TFBGA (8x6) package configuration with identical pinout and mechanical dimensions. Surface mount assembly processes and PCB footprints designed for W25Q64FVTBIP are directly compatible with both substitute parts.

Q: What is the difference between W25Q64JVTBIG and W25Q64JVTBIM?

A: Both parts are electrically and mechanically equivalent. The designations W25Q64JVTBIG and W25Q64JVTBIM represent different supplier device package codes assigned by Winbond Electronics. Functional performance, memory capacity, interface protocol, and electrical specifications are identical between the two variants.

Q: Can W25Q64JVTBIG or W25Q64JVTBIM be used as direct replacements in existing designs using W25Q64FVTBIP?

A: Yes. Both substitute parts meet all mandatory equivalence parameters including memory size, organization, interface protocol, packaging, voltage specifications, and operating temperature range. No design modifications are required for direct substitution.

Q: Why is the clock frequency higher in the substitute parts?

A: The substitute parts W25Q64JVTBIG and W25Q64JVTBIM operate at 133 MHz compared to the main part's 104 MHz. This represents an enhancement in the active product line. The higher clock frequency is backward compatible with designs operating at lower frequencies.

Q: Are there any compliance or regulatory differences between the main part and substitute parts?

A: No. All three parts are ROHS3 compliant and REACH unaffected. Moisture sensitivity level (MSL 3, 168 hours) is identical across all variants. Both substitute parts maintain the same environmental and regulatory compliance standards as the original part.

Q: What is the significance of the obsolete status for W25Q64FVTBIP?

A: Obsolete status indicates that the W25Q64FVTBIP is no longer in active production. Winbond Electronics has transitioned this product line to the active W25Q64JVTBIG and W25Q64JVTBIM variants. Substitution ensures access to actively manufactured parts with guaranteed long-term supply chain support.

Q: Are the write cycle times equivalent between all three parts?

A: The main part W25Q64FVTBIP specifies write cycle times of 50µs (word) and 3ms (page). The substitute parts specify 3ms for page write cycle time. Both substitute parts are functionally compatible for standard SPI Quad I/O write operations within the specified timing parameters.