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W25Q64FVTBBQ Equivalent & Substitute Parts
Part Overview
The W25Q64FVTBBQ is a 64Mbit NOR Flash memory IC manufactured by Winbond Electronics, featuring SPI and Quad I/O interface capabilities. This device is designed for non-volatile data storage applications requiring high-speed serial access with quad-channel support. The part is classified as obsolete, necessitating identification of active equivalent alternatives for new designs and ongoing production requirements. Substitute parts must maintain functional compatibility across memory capacity, interface protocol, package form factor, and electrical operating parameters.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Size | 64Mbit |
| Memory Organization | 8M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Package / Case | 24-TFBGA (8x6) |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature Range | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Technology | FLASH - NOR |
| Series | SpiFlash® |
Substitute Part Grouping Explanation
Substitute parts for the W25Q64FVTBBQ are identified based on strict equivalence across the following critical parameters:
Memory Capacity & Organization: Substitute parts must provide 64Mbit capacity with 8M x 8 organization to ensure direct data storage compatibility.
Interface Protocol: Substitute parts must support SPI with Quad I/O capability to maintain software and hardware interface compatibility.
Package Form Factor: Substitute parts must use 24-TFBGA (8x6) surface-mount packaging to ensure PCB layout and assembly process compatibility.
Electrical Specifications: Substitute parts must operate within the 2.7V to 3.6V supply voltage range and support the -40°C to 85°C operating temperature range minimum.
Manufacturer & Series: Parts from Winbond Electronics within the SpiFlash® series are prioritized to maintain design consistency and supply chain reliability.
The W25Q64JVTBAQ meets all substitution criteria while offering enhanced performance characteristics and active product status.
Parameter Comparison
| Parameter | W25Q64FVTBBQ (Main Part) | W25Q64JVTBAQ (Substitute) |
|---|---|---|
| Manufacturer | Winbond Electronics | Winbond Electronics |
| Memory Size | 64Mbit | 64Mbit |
| Memory Organization | 8M x 8 | 8M x 8 |
| Memory Interface | SPI - Quad I/O, QPI | SPI - Quad I/O |
| Clock Frequency | 104 MHz | 133 MHz |
| Access Time | 7 ns | 6 ns |
| Package / Case | 24-TFBGA (8x6) | 24-TFBGA (8x6) |
| Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 105°C |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active |
| Series | SpiFlash® | SpiFlash® |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Primary Substitute: W25Q64JVTBAQ
The W25Q64JVTBAQ is the recommended substitute for the obsolete W25Q64FVTBBQ. This part maintains full functional equivalence across all critical parameters: identical 64Mbit capacity, 8M x 8 organization, SPI Quad I/O interface, 24-TFBGA package, and 2.7V to 3.6V supply voltage range.
The W25Q64JVTBAQ offers performance enhancements including increased clock frequency (133 MHz versus 104 MHz) and reduced access time (6 ns versus 7 ns), providing improved throughput characteristics. The extended operating temperature range (-40°C to 105°C versus -40°C to 85°C) provides additional thermal margin for demanding applications.
The W25Q64JVTBAQ holds active product status, ensuring long-term availability and supply chain continuity. Both parts maintain identical moisture sensitivity classification (MSL 3) and REACH compliance status, supporting equivalent handling and environmental requirements.
Frequently Asked Questions (FAQ)
Q: Can the W25Q64JVTBAQ directly replace the W25Q64FVTBBQ without design modifications?
A: Yes. The W25Q64JVTBAQ provides direct functional substitution. Both parts share identical memory capacity (64Mbit), organization (8M x 8), interface protocol (SPI Quad I/O), package form factor (24-TFBGA), and supply voltage range (2.7V to 3.6V). No PCB layout changes or firmware modifications are required.
Q: What are the performance differences between these parts?
A: The W25Q64JVTBAQ operates at higher clock frequency (133 MHz versus 104 MHz) and provides faster access time (6 ns versus 7 ns). These enhancements result in improved data throughput. The W25Q64JVTBAQ also supports an extended operating temperature range (-40°C to 105°C versus -40°C to 85°C).
Q: Are there any interface compatibility concerns?
A: No. Both parts implement SPI with Quad I/O capability. The W25Q64FVTBBQ supports QPI mode, while the W25Q64JVTBAQ supports standard Quad I/O. Applications using Quad I/O mode operate identically on both parts. Applications requiring QPI mode must be evaluated for compatibility with standard Quad I/O operation.
Q: Do these parts have identical package dimensions and pin assignments?
A: Yes. Both parts use 24-TFBGA (8x6) surface-mount packaging with identical pin assignments. PCB footprints, solder paste stencils, and pick-and-place programming are directly compatible.
Q: What is the significance of the product status difference?
A: The W25Q64FVTBBQ is classified as obsolete, indicating discontinued manufacturing and limited availability. The W25Q64JVTBAQ maintains active status, ensuring ongoing production, long-term supply availability, and manufacturer support for new designs and production runs.
Q: Are the moisture sensitivity and compliance certifications equivalent?
A: Yes. Both parts carry identical Moisture Sensitivity Level (MSL 3, 168 Hours) and REACH compliance status (REACH Unaffected). Handling, storage, and environmental requirements are identical.
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