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W25Q64FVTBAQ Equivalent & Substitute Parts
Part Overview
The W25Q64FVTBAQ is a 64Mbit NOR Flash memory IC manufactured by Winbond Electronics, designed for SPI and Quad I/O applications. This device operates at 104 MHz with a 7 ns access time and is housed in a 24-TFBGA (8x6) surface mount package. The part is classified as obsolete, necessitating identification of active equivalent alternatives that maintain functional compatibility while meeting current supply chain requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Size | 64Mbit |
| Memory Organization | 8M x 8 |
| Memory Technology | FLASH - NOR |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 104 MHz |
| Access Time | 7 ns |
| Supply Voltage | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C |
| Package Type | 24-TFBGA (8x6) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the W25Q64FVTBAQ is determined by strict equivalence across the following critical parameters:
Memory Capacity & Organization: The substitute must provide 64Mbit capacity with 8M x 8 organization to ensure direct functional replacement without firmware modification.
Memory Technology & Interface: The substitute must utilize FLASH - NOR technology with SPI - Quad I/O interface compatibility to maintain protocol-level compatibility with existing host systems.
Electrical Specifications: The substitute must operate within the 2.7V ~ 3.6V supply voltage range and support the -40°C ~ 105°C operating temperature window to ensure compatibility with the target application environment.
Package & Mounting: The substitute must use the 24-TFBGA (8x6) surface mount package to ensure mechanical and electrical compatibility with existing PCB designs and assembly processes.
Performance Characteristics: While clock frequency and access time may vary, the substitute must not introduce timing constraints that would degrade system performance below the original specification.
Parameter Comparison
| Parameter | W25Q64FVTBAQ (Main Part) | W25Q64JVTBAQ (Substitute) |
|---|---|---|
| Manufacturer | Winbond Electronics | Winbond Electronics |
| Memory Size | 64Mbit | 64Mbit |
| Memory Organization | 8M x 8 | 8M x 8 |
| Memory Technology | FLASH - NOR | FLASH - NOR |
| Memory Interface | SPI - Quad I/O, QPI | SPI - Quad I/O |
| Clock Frequency | 104 MHz | 133 MHz |
| Access Time | 7 ns | 6 ns |
| Supply Voltage | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C |
| Package Type | 24-TFBGA (8x6) | 24-TFBGA (8x6) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
| Series | SpiFlash® | SpiFlash® |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
The W25Q64JVTBAQ is a direct functional equivalent to the W25Q64FVTBAQ. Both devices share identical memory capacity, organization, technology, interface protocol, supply voltage range, operating temperature range, package type, and moisture sensitivity classification.
The W25Q64JVTBAQ offers performance improvements over the main part, with a higher clock frequency of 133 MHz compared to 104 MHz and a faster access time of 6 ns compared to 7 ns. These enhancements provide superior performance characteristics while maintaining full backward compatibility.
The primary distinction is product status: the W25Q64FVTBAQ is classified as obsolete, while the W25Q64JVTBAQ maintains active status. This makes the W25Q64JVTBAQ the appropriate selection for new designs and ongoing production requirements where component availability and long-term supply assurance are critical factors.
Both devices carry REACH Unaffected compliance status and identical MSL ratings, ensuring equivalent environmental and regulatory compliance profiles.
Frequently Asked Questions (FAQ)
Q: Can the W25Q64JVTBAQ be used as a direct replacement for the W25Q64FVTBAQ in existing designs?
A: Yes. Both devices share identical memory capacity (64Mbit), organization (8M x 8), technology (FLASH - NOR), interface protocol (SPI - Quad I/O), supply voltage range (2.7V ~ 3.6V), operating temperature range (-40°C ~ 105°C), and package type (24-TFBGA 8x6). The W25Q64JVTBAQ provides equal or superior performance characteristics.
Q: What are the performance differences between these two parts?
A: The W25Q64JVTBAQ operates at 133 MHz clock frequency compared to 104 MHz for the W25Q64FVTBAQ, and provides a 6 ns access time versus 7 ns. These represent performance improvements that do not compromise compatibility.
Q: Are there any interface protocol differences between these parts?
A: The W25Q64FVTBAQ supports SPI - Quad I/O and QPI modes, while the W25Q64JVTBAQ supports SPI - Quad I/O. Both devices maintain full SPI - Quad I/O compatibility. Applications utilizing QPI mode exclusively should verify alternative solutions.
Q: Do these parts have identical packaging and mounting requirements?
A: Yes. Both devices use the 24-TFBGA (8x6) surface mount package with identical pin configurations, footprints, and assembly requirements. No PCB redesign is necessary for substitution.
Q: Are the moisture sensitivity and environmental compliance ratings the same?
A: Yes. Both parts carry MSL 3 (168 Hours) rating and REACH Unaffected compliance status, ensuring equivalent handling, storage, and regulatory requirements.
Q: Why is the W25Q64FVTBAQ classified as obsolete?
A: Product obsolescence is determined by manufacturer lifecycle decisions. The W25Q64JVTBAQ represents the active equivalent within the Winbond SpiFlash® product line and is the recommended selection for current applications.
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