W25Q256FVCIF Equivalent & Substitute Parts

Part Overview

The W25Q256FVCIF is a 256Mbit NOR Flash memory IC manufactured by Winbond Electronics, featuring SPI Quad I/O and QPI interface capabilities. This Surface Mount device operates at 104 MHz clock frequency and is housed in a 24-TFBGA (6x8) package. The W25Q256FVCIF has been discontinued at DiGi Electronics, necessitating identification of functionally equivalent substitute components for ongoing design requirements and production continuity.

Key Parameters

Parameter	Value
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O, QPI
Clock Frequency	104 MHz
Voltage Supply Range	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Package Type	24-TFBGA (6x8)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the W25Q256FVCIF are determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: All substitute parts maintain 256Mbit capacity with 32M x 8 organization, ensuring direct functional replacement without firmware or software modification.

Package & Pinout Compatibility: All substitute parts use the identical 24-TFBGA (6x8) Surface Mount package, guaranteeing mechanical and electrical compatibility with existing PCB layouts and reflow processes.

Voltage & Temperature Specifications: All substitute parts operate within the same 2.7V ~ 3.6V supply voltage range and -40°C ~ 85°C temperature envelope, maintaining system-level compatibility.

Memory Interface: All substitute parts support SPI Quad I/O interface, ensuring protocol compatibility with host controllers designed for the W25Q256FVCIF.

Regulatory Compliance: All substitute parts maintain ROHS3 compliance, REACH unaffected status, and identical MSL rating, satisfying procurement and environmental requirements.

The substitute parts identified (W25Q256JVCIM and W25Q256JVCIQ) operate at 133 MHz clock frequency, which exceeds the 104 MHz specification of the main part. This higher frequency rating does not prevent substitution, as devices are backward compatible with lower-speed applications.

Parameter Comparison

Parameter	W25Q256FVCIF	W25Q256JVCIM	W25Q256JVCIQ
Manufacturer	Winbond Electronics	Winbond Electronics	Winbond Electronics
Memory Size	256Mbit	256Mbit	256Mbit
Memory Organization	32M x 8	32M x 8	32M x 8
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O	SPI - Quad I/O
Clock Frequency	104 MHz	133 MHz	133 MHz
Write Cycle Time - Page	3ms	3ms	3ms
Voltage Supply Range	2.7V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	24-TFBGA (6x8)	24-TFBGA (6x8)	24-TFBGA (6x8)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)
Product Status	Discontinued at DiGi Electronics	Active	Active

Engineering Selection Recommendations

W25Q256JVCIM is suitable for applications where packaging flexibility is not a constraint. This part maintains active product status with Winbond Electronics, ensuring long-term availability and supply chain stability. The 133 MHz clock frequency provides operational margin above the 104 MHz requirement of the original design.

W25Q256JVCIQ is suitable for applications requiring Tray packaging for automated assembly processes. This part also maintains active product status and identical electrical specifications to the W25Q256JVCIM variant. The Tray packaging option accommodates high-volume production environments.

Both substitute parts satisfy ROHS3 compliance and REACH regulatory requirements, maintaining consistency with the original W25Q256FVCIF specifications. Selection between W25Q256JVCIM and W25Q256JVCIQ depends solely on packaging requirements for the target manufacturing process.

Frequently Asked Questions (FAQ)

Q: Can W25Q256JVCIM or W25Q256JVCIQ be used as direct replacements for W25Q256FVCIF?

A: Yes. Both parts are direct substitutes. They maintain identical memory capacity (256Mbit), organization (32M x 8), package type (24-TFBGA 6x8), voltage range (2.7V ~ 3.6V), temperature range (-40°C ~ 85°C), and SPI Quad I/O interface compatibility. The higher 133 MHz clock frequency does not prevent substitution in applications designed for 104 MHz operation.

Q: What is the difference between W25Q256JVCIM and W25Q256JVCIQ?

A: The primary difference is packaging format. W25Q256JVCIM uses standard packaging, while W25Q256JVCIQ uses Tray packaging. Both parts are electrically and mechanically identical, with the same 24-TFBGA (6x8) footprint and identical electrical specifications.

Q: Are there interface compatibility concerns when substituting these parts?

A: No. All three parts support SPI Quad I/O interface. The W25Q256FVCIF additionally supports QPI mode, which is not present in the substitute parts. However, applications using only SPI Quad I/O mode experience no functional difference.

Q: Do the substitute parts meet the same regulatory and compliance standards?

A: Yes. Both W25Q256JVCIM and W25Q256JVCIQ are ROHS3 compliant, REACH unaffected, and carry identical MSL rating (3, 168 Hours) as the W25Q256FVCIF.

Q: Why is the clock frequency higher on the substitute parts?

A: The W25Q256JVCIM and W25Q256JVCIQ operate at 133 MHz versus 104 MHz for the W25Q256FVCIF. Higher clock frequency ratings indicate enhanced performance capability and do not create compatibility issues in applications designed for lower frequencies.

Q: What is the current availability status of these substitute parts?

A: W25Q256JVCIM and W25Q256JVCIQ maintain active product status with Winbond Electronics, ensuring ongoing availability. The original W25Q256FVCIF has been discontinued at DiGi Electronics, making substitution necessary for continued production.

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