VSC7390XHO Equivalent & Substitute Parts

Part Overview

The VSC7390XHO is a telecommunications switch IC manufactured by Microchip Technology, designed for smart Ethernet switching applications in 596-BGA packaging. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The VSC7390XHO operates at 3.3V supply voltage and is housed in a 596-BGA (35x35) package suitable for high-density telecommunications infrastructure.

Substiute Parts

VSC7390XHO

Microchip TechnologyIn Stock: 5765VSC7390XHO Datasheet

Current PartRFQ

VSC7427XJG-02

Microchip TechnologyIn Stock: 2112VSC7427XJG-02 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the VSC7390XHO is determined by the following critical parameters:

• Manufacturer: Microchip Technology (maintained for design continuity and support)
• Category: Interface (telecommunications switching function)
• Application Domain: Telecommunications and Ethernet switching
• Compliance Standards: ROHS3 Compliant, REACH Unaffected
• Moisture Sensitivity Level: MSL 4 (72 Hours)
• Mounting Type: Surface Mount

The VSC7427XJG-02 qualifies as a manufacturer-recommended substitute based on shared manufacturer origin, identical compliance certifications, equivalent moisture sensitivity ratings, and compatible surface mount technology. Both components serve telecommunications interface applications within the Microchip Technology product ecosystem.

Parameter Comparison

Engineering Selection Recommendations

The VSC7427XJG-02 is the manufacturer-recommended substitute for the obsolete VSC7390XHO. Selection of this alternative is supported by:

• Active Product Status: The VSC7427XJG-02 maintains active production status, ensuring long-term availability and supply chain continuity
• Compliance Alignment: Both components maintain ROHS3 compliance and identical MSL ratings, satisfying regulatory and environmental requirements
• Manufacturer Continuity: Both components originate from Microchip Technology, preserving design support and technical documentation consistency
• Package Consideration: The VSC7427XJG-02 utilizes a 672-BGA (27x27) package, which differs in footprint from the original 596-BGA (35x35). PCB layout redesign is required for implementation

Frequently Asked Questions (FAQ)

Q: Can the VSC7427XJG-02 be used as a direct pin-for-pin replacement for the VSC7390XHO?

A: No. While both components are Microchip Technology telecommunications interface ICs, the VSC7427XJG-02 uses a 672-BGA (27x27) package compared to the VSC7390XHO's 596-BGA (35x35) package. PCB layout and routing modifications are necessary.

Q: What is the significance of the different ECCN codes between these parts?

A: The ECCN codes (5A991C1 for VSC7390XHO and 5A991B1 for VSC7427XJG-02) reflect export control classifications. Both codes indicate controlled telecommunications components. Compliance with applicable export regulations is required for both parts.

Q: Are the moisture sensitivity levels identical?

A: Yes. Both the VSC7390XHO and VSC7427XJG-02 carry MSL 4 (72 Hours) ratings, indicating equivalent moisture handling and storage requirements during manufacturing and assembly processes.

Q: Why is the VSC7390XHO listed as obsolete?

A: The VSC7390XHO has reached end-of-life status within Microchip Technology's product portfolio. The VSC7427XJG-02, part of the SparX™-III-26 series, represents the active alternative for new designs and legacy system support.

Q: What compliance certifications apply to both parts?

A: Both components are ROHS3 compliant and REACH unaffected, meeting current environmental and hazardous substance regulations for telecommunications equipment.