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VLZ47-GS08 Equivalent & Substitute Parts
Part Overview
The VLZ47-GS08 is a Zener diode rated at 46.5 V nominal with 500 mW power dissipation in a surface mount SOD-80 QuadroMELF package. Manufactured by Vishay General Semiconductor - Diodes Division, this component is classified as Automotive grade with AEC-Q101 qualification. The part is currently listed as Obsolete, necessitating identification of equivalent substitute components for ongoing design support and procurement continuity.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 46.5 | V |
| Power - Max | 500 | mW |
| Impedance (Max) | 90 | Ohms |
| Current - Reverse Leakage @ Vr | 40 | µA @ 41.8 V |
| Voltage - Forward (Vf) (Max) @ If | 1.5 | V @ 200 mA |
| Operating Temperature Range | -65 to 175 | °C |
| Mounting Type | Surface Mount | |
| Package / Case | SOD-80 | |
| Grade | Automotive | |
| Qualification | AEC-Q101 | |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the VLZ47-GS08 is determined by the following critical electrical and mechanical parameters:
Electrical Compatibility Criteria:
- Zener voltage nominal rating within the application tolerance band
- Power dissipation capacity equal to or greater than 500 mW
- Impedance (Zzt) maximum of 90 Ohms
- Forward voltage characteristics at specified current
- Reverse leakage current specifications
- Operating temperature range of -65°C to 175°C
Mechanical Compatibility Criteria:
- Surface mount package type (SOD-80 family)
- Pin configuration and footprint compatibility
- Automotive grade classification
- AEC-Q101 qualification status
Regulatory Compliance:
- RoHS3 compliance
- REACH unaffected status
The TLZ47-GS08 qualifies as a direct substitute based on matching electrical performance parameters, identical power rating, equivalent impedance specification, and compatible surface mount packaging within the SOD-80 family.
Parameter Comparison
| Parameter | VLZ47-GS08 | TLZ47-GS08 | Unit |
|---|---|---|---|
| Voltage - Zener (Nom) | 46.5 | 47 | V |
| Power - Max | 500 | 500 | mW |
| Impedance (Max) | 90 | 90 | Ohms |
| Current - Reverse Leakage @ Vr | 40 µA @ 41.8 V | 40 nA @ 41.8 V | |
| Voltage - Forward (Vf) (Max) @ If | 1.5 @ 200 mA | 1.5 @ 200 mA | V |
| Operating Temperature Range | -65 to 175 | -65 to 175 | °C |
| Mounting Type | Surface Mount | Surface Mount | |
| Package / Case | SOD-80 QuadroMELF | SOD-80 MiniMELF | |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The TLZ47-GS08 serves as the active equivalent for the obsolete VLZ47-GS08. Selection of the TLZ47-GS08 is supported by the following factors:
Electrical Performance: Both components maintain identical power dissipation capacity (500 mW), impedance specification (90 Ohms maximum), and forward voltage characteristics. The nominal Zener voltage differs by 0.5 V (46.5 V versus 47 V), which falls within typical application tolerance bands for high-voltage Zener diode circuits.
Leakage Characteristics: The TLZ47-GS08 exhibits superior reverse leakage performance (40 nanoamperes versus 40 microamperes), representing a 1000-fold improvement in leakage current specification.
Thermal Performance: Both components operate across the identical temperature range (-65°C to 175°C), ensuring thermal compatibility in automotive applications.
Regulatory Compliance: The TLZ47-GS08 maintains RoHS3 compliance and REACH unaffected status, matching the regulatory profile of the original component.
Product Availability: The TLZ47-GS08 is classified as Active with substantial inventory availability (10,400 pieces), ensuring procurement continuity for ongoing production requirements.
Package Consideration: Both components utilize SOD-80 surface mount packaging. The TLZ47-GS08 employs MiniMELF variant geometry while the VLZ47-GS08 uses QuadroMELF variant. Footprint verification is required to confirm mechanical compatibility with existing PCB layouts.
Frequently Asked Questions (FAQ)
Q: What is the primary difference between the VLZ47-GS08 and TLZ47-GS08?
A: The VLZ47-GS08 is obsolete, while the TLZ47-GS08 is an active product from the same manufacturer. The TLZ47-GS08 offers superior reverse leakage current performance (40 nA versus 40 µA) and maintains all critical electrical parameters including 500 mW power rating, 90 Ohms impedance, and identical operating temperature range.
Q: Are the Zener voltage ratings interchangeable?
A: The nominal Zener voltages differ by 0.5 V (46.5 V versus 47 V). Substitution is valid when circuit design tolerances accommodate this voltage differential. Applications requiring precise voltage regulation within narrow bands must evaluate circuit performance impact.
Q: What is the difference between SOD-80 QuadroMELF and SOD-80 MiniMELF packages?
A: Both are SOD-80 surface mount packages but differ in physical dimensions and footprint geometry. QuadroMELF and MiniMELF variants have different lead spacing and body dimensions. PCB layout compatibility must be verified before substitution to ensure proper solder joint formation and thermal performance.
Q: Can the TLZ47-GS08 be used in automotive applications?
A: The TLZ47-GS08 is manufactured by Vishay General Semiconductor - Diodes Division and maintains RoHS3 compliance and REACH unaffected status. However, automotive qualification status (AEC-Q101) for the TLZ47-GS08 must be confirmed through the manufacturer's current datasheet, as this information was not provided in the available parameters.
Q: What is the significance of the improved reverse leakage current in the TLZ47-GS08?
A: The TLZ47-GS08 exhibits reverse leakage current of 40 nanoamperes compared to 40 microamperes in the VLZ47-GS08. Lower leakage current reduces standby power consumption and improves circuit efficiency, particularly in applications where the Zener diode operates in reverse bias for extended periods.
Q: Is the TLZ47-GS08 available in tape and reel packaging?
A: Yes, the TLZ47-GS08 is supplied in Tape & Reel (TR) packaging format, suitable for automated assembly processes. This packaging format differs from the original component's packaging specification but does not affect electrical or thermal performance.
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