VLZ3V0-GS18 Equivalent & Substitute Parts

Part Overview

The VLZ3V0-GS18 is a Zener Diode rated at 3 V with 500 mW power dissipation, manufactured by Vishay General Semiconductor - Diodes Division. This component is packaged in SOD-80 QuadroMELF surface mount configuration and is qualified to AEC-Q101 automotive standards. The part is currently classified as obsolete, necessitating identification of equivalent substitute components that maintain electrical and mechanical compatibility for ongoing production and repair applications.

Substiute Parts

VLZ3V0-GS18

Vishay General Semiconductor - Diodes DivisionIn Stock: 729VLZ3V0-GS18 Datasheet

Current PartRFQ

TLZ3V0-GS18

Vishay General Semiconductor - Diodes DivisionIn Stock: 776TLZ3V0-GS18 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the VLZ3V0-GS18 is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Zener voltage rating: 3 V (nominal)
• Maximum power dissipation: 500 mW
• Forward voltage: 1.5 V maximum at 200 mA
• Operating temperature range: -65°C to 175°C
• Impedance characteristics within acceptable tolerance

Mechanical Compatibility Criteria:

• Surface mount configuration
• SOD-80 package family (includes QuadroMELF and MiniMELF variants)
• Automotive grade qualification (AEC-Q101)
• RoHS3 compliance

The TLZ3V0-GS18 qualifies as a direct substitute based on matching electrical specifications and surface mount SOD-80 packaging, despite differences in impedance maximum rating and packaging variant designation.

Parameter Comparison

Engineering Selection Recommendations

The TLZ3V0-GS18 is the direct substitute for the obsolete VLZ3V0-GS18. Both components are manufactured by Vishay General Semiconductor - Diodes Division and share identical electrical specifications for zener voltage, power rating, and forward voltage characteristics. Both components maintain AEC-Q101 automotive qualification and ROHS3 compliance.

The primary distinction between these parts is the packaging variant: the main part uses SOD-80 QuadroMELF while the substitute uses SOD-80 MiniMELF. Both variants fall within the SOD-80 package family and are compatible with surface mount assembly processes. The impedance maximum specification differs slightly (70 Ohms versus 80 Ohms), with the substitute part having a marginally higher impedance rating that remains within acceptable operational parameters for equivalent circuit performance.

The TLZ3V0-GS18 is currently in active production status, ensuring availability for new designs and replacement applications where the VLZ3V0-GS18 is no longer obtainable.

Frequently Asked Questions (FAQ)

Q: Can the TLZ3V0-GS18 be used as a direct replacement for the VLZ3V0-GS18 in existing designs?

A: Yes. Both components share identical zener voltage (3 V), power rating (500 mW), forward voltage characteristics (1.5 V @ 200 mA), and operating temperature range (-65°C to 175°C). The primary difference is the SOD-80 packaging variant (QuadroMELF versus MiniMELF), which affects physical dimensions but not electrical performance. PCB layout modifications may be required to accommodate the different package footprint.

Q: What is the significance of the impedance difference between these parts?

A: The VLZ3V0-GS18 specifies a maximum impedance of 70 Ohms, while the TLZ3V0-GS18 specifies 80 Ohms. This 10 Ohm difference represents a minor variation in dynamic impedance characteristics. For most circuit applications, this difference is negligible and does not affect functional performance in standard zener diode voltage regulation or protection circuits.

Q: Are both parts automotive qualified?

A: The VLZ3V0-GS18 carries AEC-Q101 automotive qualification. The TLZ3V0-GS18 is listed as an active automotive-grade component from the same manufacturer. Both parts meet automotive reliability and qualification standards.

Q: What are the packaging implications of switching from QuadroMELF to MiniMELF?

A: Both QuadroMELF and MiniMELF are SOD-80 package variants used for surface mount zener diodes. The MiniMELF variant typically offers a smaller physical footprint. PCB footprint libraries and assembly specifications must be updated to reflect the different package dimensions. Reflow soldering parameters remain compatible with standard surface mount processes.

Q: Are there any compliance or regulatory differences between these parts?

A: Both components are ROHS3 compliant and REACH unaffected. Both carry identical ECCN (EAR99) and HTSUS (8541.10.0050) classifications. No compliance or regulatory barriers exist for substitution.

Q: Why is the main part classified as obsolete?

A: The VLZ3V0-GS18 is no longer in active production. The TLZ3V0-GS18 represents the active equivalent from the same manufacturer, providing continuity for applications requiring 3 V, 500 mW zener diodes in surface mount SOD-80 packaging.