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VLZ39C-GS18 Equivalent & Substitute Parts
Part Overview
The VLZ39C-GS18 is a Zener diode rated at 36.93 V nominal voltage with 500 mW power dissipation in a surface mount SOD-80 QuadroMELF package. Manufactured by Vishay General Semiconductor - Diodes Division, this component is classified as Automotive grade with AEC-Q101 qualification. The part is currently listed as Obsolete, necessitating identification of equivalent substitute components for ongoing design support and procurement continuity.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 36.93 | V |
| Power - Max | 500 | mW |
| Impedance (Max) | 85 | Ohms |
| Current - Reverse Leakage @ Vr | 40 | µA @ 34.2 V |
| Voltage - Forward (Vf) (Max) @ If | 1.5 | V @ 200 mA |
| Operating Temperature Range | -65 to 175 | °C |
| Mounting Type | Surface Mount | |
| Package / Case | SOD-80 | |
| Grade | Automotive | |
| Qualification | AEC-Q101 | |
| RoHS Status | ROHS3 Compliant | |
| MSL | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the VLZ39C-GS18 is determined by the following critical parameters:
Electrical Compatibility:
- Zener voltage nominal rating within acceptable circuit tolerance
- Maximum power dissipation capacity of 500 mW
- Impedance specification of 85 Ohms maximum
- Forward voltage characteristic of 1.5 V maximum at 200 mA
- Operating temperature range of -65°C to 175°C
Mechanical & Packaging Compatibility:
- Surface mount mounting type
- SOD-80 package footprint compatibility
Compliance & Quality:
- Automotive grade classification
- AEC-Q101 qualification
- ROHS3 compliance
- MSL rating of 1 (Unlimited)
The substitute part TLZ39C-GS18 meets these criteria with the following considerations: the nominal Zener voltage is 39 V (compared to 36.93 V), representing a 1.9% deviation. All other electrical parameters, operating temperature range, mounting type, package designation, and compliance certifications remain equivalent or superior to the original part.
Parameter Comparison
| Parameter | VLZ39C-GS18 | TLZ39C-GS18 | Unit |
|---|---|---|---|
| Voltage - Zener (Nom) | 36.93 | 39 | V |
| Power - Max | 500 | 500 | mW |
| Impedance (Max) | 85 | 85 | Ohms |
| Current - Reverse Leakage @ Vr | 40 µA @ 34.2 V | 40 nA @ 34.2 V | |
| Voltage - Forward (Vf) (Max) @ If | 1.5 @ 200 mA | 1.5 @ 200 mA | V |
| Operating Temperature Range | -65 to 175 | -65 to 175 | °C |
| Mounting Type | Surface Mount | Surface Mount | |
| Package / Case | SOD-80 QuadroMELF | SOD-80 MiniMELF | |
| Product Status | Obsolete | Active | |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | |
| MSL | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
The TLZ39C-GS18 is the direct substitute for the obsolete VLZ39C-GS18. Selection is based on the following engineering factors:
Product Status: The TLZ39C-GS18 maintains Active product status, ensuring long-term availability and supply chain continuity compared to the Obsolete VLZ39C-GS18.
Compliance & Certification: Both parts maintain identical compliance profiles: ROHS3 compliance, AEC-Q101 automotive qualification, and MSL rating of 1 (Unlimited). This ensures no degradation in regulatory or quality requirements.
Electrical Parameters: The substitute part delivers equivalent electrical performance across all critical specifications. The nominal Zener voltage difference of 2.07 V (39 V versus 36.93 V) must be evaluated within the context of circuit design tolerance. Reverse leakage current is superior in the substitute (40 nA versus 40 µA), representing a 1000-fold improvement in leakage performance.
Package Compatibility: Both parts utilize SOD-80 surface mount packages. The QuadroMELF variant of the original part and the MiniMELF variant of the substitute are both SOD-80 designations. Physical footprint compatibility must be confirmed against PCB layout specifications.
Procurement: The TLZ39C-GS18 is available in Tape & Reel packaging with confirmed inventory of 1168 pieces, supporting production requirements.
Frequently Asked Questions (FAQ)
Q: Can the TLZ39C-GS18 directly replace the VLZ39C-GS18 in existing designs?
A: The TLZ39C-GS18 is electrically and mechanically compatible with the VLZ39C-GS18 across all specified parameters. Both parts are surface mount SOD-80 devices with identical power ratings, impedance specifications, and operating temperature ranges. Circuit design tolerance for the 2.07 V Zener voltage difference must be confirmed for the specific application.
Q: What is the difference between SOD-80 QuadroMELF and SOD-80 MiniMELF packages?
A: Both designations refer to the SOD-80 package standard. The QuadroMELF and MiniMELF variants represent different physical implementations within the SOD-80 specification. PCB footprint compatibility must be verified against design documentation to ensure proper component placement and soldering.
Q: Why is the reverse leakage current significantly lower in the TLZ39C-GS18?
A: The TLZ39C-GS18 exhibits reverse leakage current of 40 nanoamperes compared to 40 microamperes in the VLZ39C-GS18. This 1000-fold reduction represents improved device performance and is a result of manufacturing process differences between the VLZ and TLZ series. This improvement does not negatively impact circuit performance.
Q: Are both parts qualified for automotive applications?
A: Yes. Both the VLZ39C-GS18 and TLZ39C-GS18 carry Automotive grade classification and AEC-Q101 qualification, meeting automotive industry reliability and quality standards.
Q: What is the significance of the Active product status for the TLZ39C-GS18?
A: Active product status indicates that the TLZ39C-GS18 is currently manufactured and supported by Vishay General Semiconductor - Diodes Division. This ensures ongoing availability, consistent supply chain access, and manufacturer technical support, contrasting with the Obsolete status of the VLZ39C-GS18.
Q: Are there any moisture sensitivity concerns with these parts?
A: Both parts carry MSL rating 1 (Unlimited), indicating no moisture sensitivity limitations. These components can be stored and handled without moisture barrier packaging requirements or bake-out procedures prior to soldering.
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