VLZ18-GS18 Equivalent & Substitute Parts

Part Overview

The VLZ18-GS18 is a Zener Diode rated at 18 V with 500 mW power dissipation in a Surface Mount SOD-80 QuadroMELF package. Manufactured by Vishay General Semiconductor - Diodes Division, this component is classified as Automotive grade with AEC-Q101 qualification. The part is currently listed as Obsolete, necessitating identification of equivalent substitute components that maintain identical electrical performance and compliance requirements for ongoing production and repair applications.

Substiute Parts

VLZ18-GS18

Vishay General Semiconductor - Diodes DivisionIn Stock: 1110VLZ18-GS18 Datasheet

Current PartRFQ

TLZ18-GS18

Vishay General Semiconductor - Diodes DivisionIn Stock: 1102TLZ18-GS18 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the VLZ18-GS18 is determined by strict equivalence across the following electrical and mechanical parameters:

Electrical Equivalence Criteria:

• Zener voltage: 18 V nominal
• Maximum power dissipation: 500 mW
• Maximum impedance: 23 Ohms
• Forward voltage: 1.5 V maximum at 200 mA
• Operating temperature range: -65°C to 175°C

Mechanical and Compliance Criteria:

• Surface Mount technology
• Automotive grade classification
• AEC-Q101 qualification
• ROHS3 compliance
• Moisture Sensitivity Level 1

The TLZ18-GS18 meets all electrical specifications and compliance requirements. The primary distinction is the package variant designation (MiniMELF versus QuadroMELF) and packaging format (Tape & Reel versus bulk), both of which are compatible with the functional requirements of the VLZ18-GS18 application.

Parameter Comparison

Engineering Selection Recommendations

The TLZ18-GS18 is a direct electrical and functional equivalent to the VLZ18-GS18. Both components share identical electrical specifications, automotive qualification, and compliance certifications. The TLZ18-GS18 holds Active product status, ensuring continued availability and supply chain support compared to the Obsolete VLZ18-GS18.

The package variant difference (MiniMELF versus QuadroMELF) does not affect electrical performance. Both are SOD-80 Surface Mount packages suitable for automated assembly processes. The TLZ18-GS18 is supplied in Tape & Reel format, which is standard for high-volume production environments.

For applications currently using the VLZ18-GS18, transition to the TLZ18-GS18 requires only verification of PCB footprint compatibility with the MiniMELF package variant. No circuit redesign or electrical re-qualification is necessary.

Frequently Asked Questions (FAQ)

Q: Can the TLZ18-GS18 directly replace the VLZ18-GS18 in existing designs?

A: Yes. The TLZ18-GS18 provides identical electrical performance across all specified parameters: 18 V zener voltage, 500 mW power rating, 23 Ohms maximum impedance, and identical forward voltage characteristics. Both components meet Automotive grade and AEC-Q101 requirements.

Q: What is the difference between QuadroMELF and MiniMELF packages?

A: Both are SOD-80 Surface Mount packages. The primary difference is physical size and footprint geometry. QuadroMELF and MiniMELF variants have different dimensional specifications. PCB layout compatibility must be confirmed before substitution.

Q: Are there compliance or certification differences between these parts?

A: No. Both the VLZ18-GS18 and TLZ18-GS18 are ROHS3 compliant, AEC-Q101 qualified, and carry identical Moisture Sensitivity Level 1 ratings. Compliance requirements are fully satisfied by either component.

Q: Why is the VLZ18-GS18 listed as Obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The TLZ18-GS18 remains in Active production status, providing a viable path for continued component sourcing and supply chain continuity.

Q: Does packaging format (Tape & Reel versus bulk) affect electrical performance?

A: No. Packaging format affects logistics and handling only. Electrical specifications and performance are independent of whether components are supplied in Tape & Reel or bulk packaging.

Q: What should be verified before implementing the TLZ18-GS18 as a substitute?

A: Confirm PCB footprint compatibility with the MiniMELF package variant. Verify that the physical dimensions and lead spacing of the MiniMELF package align with existing PCB design. No electrical re-testing is required due to identical electrical specifications.