VLZ13B-GS08 Equivalent & Substitute Parts

Part Overview

The VLZ13B-GS08 is a Zener Diode rated at 12.88 V with 500 mW power dissipation in a SOD-80 QuadroMELF surface mount package, manufactured by Vishay General Semiconductor - Diodes Division. This component is classified as Obsolete, which necessitates identification of active equivalent parts for ongoing design support and procurement. The part carries AEC-Q101 automotive qualification and ROHS3 compliance.

Substiute Parts

VLZ13B-GS08
Vishay General Semiconductor - Diodes DivisionIn Stock: 753VLZ13B-GS08 Datasheet
VLZ13B-GS08
Current Part
TLZ13B-GS08
Vishay General Semiconductor - Diodes DivisionIn Stock: 49366TLZ13B-GS08 Datasheet
TLZ13B-GS08
Direct
1N4107UR-1
Microchip TechnologyIn Stock: 10241N4107UR-1 Datasheet
1N4107UR-1
MFR Recommended
1N964BUR-1
Microchip TechnologyIn Stock: 7681N964BUR-1 Datasheet
1N964BUR-1
MFR Recommended
BZV55-B13,115
Nexperia USA Inc.In Stock: 6618BZV55-B13,115 Datasheet
BZV55-B13,115
MFR Recommended

Key Parameters

Parameter Value Unit
Voltage - Zener (Nominal) 12.88 V
Power - Maximum 500 mW
Impedance (Maximum) 14 Ohms
Current - Reverse Leakage @ Vr 40 µA @ 11.9 V
Voltage - Forward (Maximum) @ If 1.5 V @ 200 mA
Operating Temperature Range -65 to 175 °C
Mounting Type Surface Mount -
Package / Case SOD-80 Variant -
Grade Automotive -
Qualification AEC-Q101 -
RoHS Status ROHS3 Compliant -

Substitute Part Grouping Explanation

Substitution of the VLZ13B-GS08 is determined by the following critical parameters:

Primary Substitution Criteria:

  • Zener voltage nominal rating within the 12.88 V to 13 V range
  • Power dissipation capacity of 500 mW
  • Surface mount package compatibility (SOD-80 or equivalent MiniMELF variants)
  • Operating temperature range of -65°C to 175°C minimum
  • RoHS3 compliance for regulatory alignment

Secondary Compatibility Factors:

  • Impedance (Zzt) maximum rating
  • Reverse leakage current characteristics
  • Forward voltage drop specifications
  • Automotive qualification or equivalent industrial grade

The substitute parts identified maintain electrical equivalence within the specified voltage and power parameters while offering active product status and improved availability compared to the obsolete VLZ13B-GS08.

Parameter Comparison

Parameter VLZ13B-GS08 (Main) TLZ13B-GS08 1N4107UR-1 1N964BUR-1 BZV55-B13,115
Manufacturer Vishay Vishay Microchip Microchip Nexperia
Voltage - Zener (Nom) 12.88 V 13 V 13 V 13 V 13 V
Power - Max 500 mW 500 mW 500 mW 500 mW 500 mW
Impedance (Max) 14 Ohms 14 Ohms 200 Ohms 13 Ohms 30 Ohms
Current - Reverse Leakage @ Vr 40 µA @ 11.9 V 40 nA @ 11.9 V 50 nA @ 9.9 V 500 nA @ 9.9 V 100 nA @ 8 V
Voltage - Forward (Max) @ If 1.5 V @ 200 mA 1.5 V @ 200 mA 1.1 V @ 200 mA 1.1 V @ 200 mA 900 mV @ 10 mA
Operating Temperature -65 to 175°C -65 to 175°C -65 to 175°C -65 to 175°C -65 to 200°C
Package / Case SOD-80 QuadroMELF SOD-80 MiniMELF DO-213AA DO-213AA LLDS MiniMELF
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant RoHS Non-compliant ROHS3 Compliant ROHS3 Compliant
Inventory Status 678 Pcs 49280 Pcs 940 Pcs 697 Pcs 6560 Pcs

Engineering Selection Recommendations

TLZ13B-GS08 (Vishay) is the primary direct substitute. This part maintains identical electrical specifications (13 V nominal, 500 mW, 14 Ohms impedance) and operates within the same temperature range. Both parts are manufactured by Vishay and carry ROHS3 compliance. The TLZ13B-GS08 is in active production with significantly higher inventory availability (49,280 units). Package compatibility is maintained through SOD-80 MiniMELF configuration. This substitute is suitable for direct replacement in automotive-grade applications.

1N964BUR-1 (Microchip) provides electrical equivalence with 13 V nominal rating and 500 mW power capacity. This part carries ROHS3 compliance and maintains the -65°C to 175°C operating range. The impedance specification (13 Ohms) is comparable to the main part. However, the DO-213AA package differs from the SOD-80 QuadroMELF, requiring PCB layout verification. This substitute is suitable for applications where package footprint compatibility can be accommodated.

BZV55-B13,115 (Nexperia) offers 13 V nominal rating with 500 mW power dissipation and ROHS3 compliance. This part features an extended operating temperature range to 200°C and improved impedance characteristics (30 Ohms). The LLDS MiniMELF package is compatible with SOD-80 footprints. This substitute is suitable for high-temperature automotive applications.

1N4107UR-1 (Microchip) meets the 13 V and 500 mW electrical requirements but carries RoHS non-compliance status, which may restrict use in regulated applications. The DO-213AA package requires layout verification. This substitute is not recommended for new automotive designs requiring ROHS3 compliance.

Frequently Asked Questions (FAQ)

Q: Can the TLZ13B-GS08 be used as a direct replacement for the VLZ13B-GS08?

A: Yes. Both parts are manufactured by Vishay, operate at 13 V nominal (within the 12.88 V specification tolerance), dissipate 500 mW, and maintain identical impedance (14 Ohms) and operating temperature range (-65°C to 175°C). Both carry ROHS3 compliance and automotive qualification. The primary difference is package designation (QuadroMELF versus MiniMELF), which are both SOD-80 variants with compatible footprints.

Q: What is the voltage difference between the VLZ13B-GS08 (12.88 V) and substitute parts rated at 13 V?

A: The 0.12 V difference represents a 0.93% variance. This falls within typical zener diode tolerance specifications and is acceptable for voltage regulation and protection circuits where the nominal voltage is the design target. Circuit performance impact depends on the specific application tolerance requirements.

Q: Are all substitute parts automotive-grade?

A: The VLZ13B-GS08 carries AEC-Q101 automotive qualification. The TLZ13B-GS08 and BZV55-B13,115 are suitable for automotive applications based on their ROHS3 compliance and operating specifications. The Microchip parts (1N4107UR-1 and 1N964BUR-1) do not carry explicit automotive qualification in the provided specifications.

Q: What are the package compatibility considerations?

A: The VLZ13B-GS08 uses SOD-80 QuadroMELF packaging. The TLZ13B-GS08 and BZV55-B13,115 use SOD-80 MiniMELF or LLDS variants, which are mechanically compatible with SOD-80 footprints. The Microchip parts use DO-213AA packaging, which requires PCB layout verification for footprint compatibility before substitution.

Q: Why is the 1N4107UR-1 not recommended despite meeting electrical specifications?

A: The 1N4107UR-1 carries RoHS non-compliant status, which conflicts with the ROHS3 compliance requirement of the original VLZ13B-GS08. This restriction applies to applications subject to RoHS regulations and automotive supply chain requirements.

Q: How do reverse leakage current differences affect substitution?

A: The VLZ13B-GS08 specifies 40 µA reverse leakage at 11.9 V, while substitutes range from 40 nA to 500 nA. Lower leakage current in substitute parts indicates improved performance characteristics. This difference is significant in precision voltage regulation circuits but acceptable for standard protection applications.

Q: Can the BZV55-B13,115 be used in applications requiring operation above 175°C?

A: The BZV55-B13,115 extends the operating temperature range to 200°C, providing additional thermal margin compared to the VLZ13B-GS08 specification of -65°C to 175°C. This extended range is suitable for high-temperature automotive engine compartment applications.

Request Quote (Ships tomorrow)