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VLZ10D-GS08 Equivalent & Substitute Parts
Part Overview
The VLZ10D-GS08 is a Zener diode manufactured by Vishay General Semiconductor - Diodes Division, rated at 10.19 V nominal with 500 mW power dissipation in a SOD-80 QuadroMELF surface mount package. This component is classified as Automotive grade with AEC-Q101 qualification and is currently listed as Obsolete product status. Due to its obsolete classification, equivalent and substitute parts from active product lines are necessary for ongoing design support, production continuity, and new application development.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 10.19 | V |
| Power - Max | 500 | mW |
| Impedance (Max) | 8 | Ohms |
| Current - Reverse Leakage @ Vr | 40 µA @ 9.44 V | - |
| Voltage - Forward (Vf) (Max) @ If | 1.5 V @ 200 mA | - |
| Operating Temperature Range | -65°C to 175°C | - |
| Mounting Type | Surface Mount | - |
| Package / Case | SOD-80 QuadroMELF | - |
| Grade | Automotive | - |
| Qualification | AEC-Q101 | - |
| RoHS Status | ROHS3 Compliant | - |
Substitute Part Grouping Explanation
Substitution of the VLZ10D-GS08 is determined by the following critical parameters:
Electrical Parameters:
- Zener voltage nominal rating: 10 V to 10.19 V range
- Power dissipation capacity: 500 mW
- Operating temperature range: -65°C to 175°C
- Forward voltage and reverse leakage characteristics within acceptable tolerance
Mechanical Parameters:
- Surface mount technology
- Package compatibility: SOD-80 variants (QuadroMELF, MiniMELF) or equivalent DO-213AA footprints
Compliance Parameters:
- RoHS3 compliance status
- REACH unaffected status
- Automotive grade or equivalent industrial qualification
The substitute parts are grouped into two categories:
Category 1 - Direct Vishay Equivalent: TLZ10D-GS08 represents the active product line successor with identical electrical specifications and compatible SOD-80 MiniMELF packaging.
Category 2 - Cross-Manufacturer Alternatives: 1N4104DUR-1, 1N4104UR-1, 1N5530BUR-1, and 1N758AUR-1 from Microchip Technology meet the core electrical requirements (10 V nominal, 500 mW) with DO-213AA packaging and active product status, though with variations in impedance and leakage characteristics.
Parameter Comparison
| Parameter | VLZ10D-GS08 | TLZ10D-GS08 | 1N4104DUR-1 | 1N4104UR-1 | 1N5530BUR-1 | 1N758AUR-1 |
|---|---|---|---|---|---|---|
| Manufacturer | Vishay | Vishay | Microchip | Microchip | Microchip | Microchip |
| Voltage - Zener (Nom) | 10.19 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| Tolerance | - | - | ±1% | ±5% | ±5% | ±5% |
| Power - Max | 500 mW | 500 mW | 500 mW | 500 mW | 500 mW | 500 mW |
| Impedance (Max) | 8 Ohms | 8 Ohms | 200 Ohms | 200 Ohms | 60 Ohms | 7 Ohms |
| Current - Reverse Leakage @ Vr | 40 µA @ 9.44 V | 40 nA @ 9.44 V | 500 nA @ 7.6 V | 500 nA @ 7.6 V | 50 nA @ 9.1 V | 1 µA @ 8 V |
| Voltage - Forward (Vf) (Max) @ If | 1.5 V @ 200 mA | 1.5 V @ 200 mA | 1.1 V @ 200 mA | 1.1 V @ 200 mA | 1.1 V @ 200 mA | 1.1 V @ 200 mA |
| Operating Temperature | -65°C to 175°C | -65°C to 175°C | -65°C to 175°C | -65°C to 175°C | -65°C to 175°C | -65°C to 175°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | SOD-80 QuadroMELF | SOD-80 MiniMELF | DO-213AA | DO-213AA | DO-213AA | DO-213AA |
| Product Status | Obsolete | Active | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Primary Substitute - TLZ10D-GS08:
The TLZ10D-GS08 is the recommended direct substitute for the VLZ10D-GS08. Both components are manufactured by Vishay General Semiconductor - Diodes Division and share identical electrical specifications (10 V nominal, 500 mW power rating, 8 Ohms impedance, -65°C to 175°C operating range). The TLZ10D-GS08 is in Active product status with ROHS3 compliance and unlimited moisture sensitivity level. The primary difference is packaging: TLZ10D-GS08 uses SOD-80 MiniMELF versus the original QuadroMELF variant. Both are SOD-80 package family members with compatible footprints for surface mount applications.
Secondary Substitutes - Microchip Technology 1N Series:
The 1N4104DUR-1, 1N4104UR-1, 1N5530BUR-1, and 1N758AUR-1 are cross-manufacturer alternatives from Microchip Technology. All four parts meet the core electrical requirements: 10 V nominal zener voltage, 500 mW power dissipation, and -65°C to 175°C operating temperature range. These parts use DO-213AA packaging, which differs from the original SOD-80 package.
Compliance Considerations:
- TLZ10D-GS08 maintains ROHS3 compliance matching the original part
- 1N4104DUR-1 maintains ROHS3 compliance
- 1N4104UR-1, 1N5530BUR-1, and 1N758AUR-1 are RoHS non-compliant and should be selected only when RoHS compliance is not a design requirement
Electrical Performance Variations:
The Microchip alternatives exhibit different impedance and leakage characteristics. The 1N758AUR-1 provides the closest impedance match (7 Ohms) to the original 8 Ohms specification. The 1N5530BUR-1 offers moderate impedance (60 Ohms) with low leakage (50 nA @ 9.1 V). The 1N4104 variants have higher impedance (200 Ohms) but lower forward voltage drop (1.1 V versus 1.5 V).
Frequently Asked Questions (FAQ)
Q: Can TLZ10D-GS08 be used as a direct replacement for VLZ10D-GS08?
A: Yes. The TLZ10D-GS08 shares identical electrical specifications with the VLZ10D-GS08 and is the active product line equivalent from the same manufacturer. Both operate at 10 V nominal with 500 mW power dissipation and 8 Ohms impedance. The packaging is SOD-80 family compatible (MiniMELF versus QuadroMELF), suitable for surface mount applications with equivalent footprint considerations.
Q: What are the key differences between SOD-80 QuadroMELF and SOD-80 MiniMELF packages?
A: Both are SOD-80 package variants for surface mount applications. QuadroMELF and MiniMELF differ in physical dimensions and lead configuration but maintain electrical equivalence. PCB layout and footprint design must accommodate the specific variant selected. Consult package datasheets for precise dimensional specifications.
Q: Can Microchip 1N series parts replace the Vishay VLZ10D-GS08?
A: The Microchip 1N series parts (1N4104DUR-1, 1N4104UR-1, 1N5530BUR-1, 1N758AUR-1) meet the core electrical requirements of 10 V nominal zener voltage and 500 mW power dissipation. However, they use DO-213AA packaging instead of SOD-80, requiring PCB layout modification. Impedance and leakage characteristics vary among the alternatives. Selection depends on specific circuit requirements and package compatibility constraints.
Q: Which substitute part has the lowest impedance?
A: The 1N758AUR-1 provides the lowest impedance at 7 Ohms, closely matching the original VLZ10D-GS08 specification of 8 Ohms. The TLZ10D-GS08 also maintains 8 Ohms impedance.
Q: Are all substitute parts RoHS compliant?
A: No. The TLZ10D-GS08 and 1N4104DUR-1 are ROHS3 compliant. The 1N4104UR-1, 1N5530BUR-1, and 1N758AUR-1 are RoHS non-compliant. Design requirements for RoHS compliance determine which substitutes are acceptable.
Q: What is the difference between ±1% and ±5% tolerance specifications?
A: Tolerance specifies the allowable deviation from the nominal zener voltage. The 1N4104DUR-1 with ±1% tolerance provides tighter voltage regulation (±0.1 V at 10 V nominal) compared to ±5% tolerance parts (±0.5 V at 10 V nominal). Circuit applications requiring precise voltage regulation benefit from tighter tolerance specifications.
Q: Can I use a substitute part with different impedance in my circuit?
A: Impedance affects dynamic resistance and voltage regulation characteristics. Parts with significantly different impedance (such as 200 Ohms versus 8 Ohms) alter circuit behavior. Circuit analysis is necessary to determine if impedance variation is acceptable for the specific application.
Q: What is the significance of reverse leakage current specifications?
A: Reverse leakage current indicates the diode's off-state performance. Lower leakage current (measured in nanoamperes) represents better isolation characteristics. The original VLZ10D-GS08 specifies 40 µA leakage, while TLZ10D-GS08 specifies 40 nA, representing a significant improvement. Applications sensitive to leakage current should account for these differences.
Q: Are all substitute parts available in the same packaging options?
A: No. The VLZ10D-GS08 and TLZ10D-GS08 use SOD-80 variants. The Microchip 1N series parts use DO-213AA packaging. Packaging differences require PCB footprint modifications. Verify packaging compatibility with your PCB design before component selection.
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