VLF252012MT-150M Equivalent & Substitute Parts

Part Overview

The VLF252012MT-150M is a 15 µH shielded drum core wirewound inductor manufactured by TDK Corporation, designed for surface mount applications in the 1008 (2520 Metric) package. This component is rated for 630 mA continuous current with a maximum DC resistance of 680 mOhm and operates across the temperature range of -40°C to 105°C. The part is currently listed as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production continuity.

Substiute Parts

VLF252012MT-150M

TDK CorporationIn Stock: 1095VLF252012MT-150M Datasheet

Current PartRFQ

VLS252012HBX-150M-1

TDK CorporationIn Stock: 1188VLS252012HBX-150M-1 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the VLF252012MT-150M is determined by the following critical parameters:

• Inductance Value: 15 µH at 1 MHz test frequency
• Current Rating: Minimum 630 mA continuous current capability
• DC Resistance: Maximum 680 mOhm to maintain equivalent power dissipation characteristics
• Package Compatibility: 1008 (2520 Metric) surface mount form factor
• Shielding Requirement: Shielded construction for electromagnetic containment
• Environmental Compliance: Operating temperature range -40°C to 105°C, MSL 1 rating

The VLS252012HBX-150M-1 meets the core inductance and frequency test specifications. However, critical parameters including current saturation rating, DC resistance specification, and shielding confirmation are not provided in the available data for this substitute part, requiring engineering evaluation against the specific application requirements.

Parameter Comparison

Engineering Selection Recommendations

The VLS252012HBX-150M-1 represents an active product alternative from the same manufacturer with matching inductance value and test frequency. The substitute part carries ROHS3 compliance certification, whereas the main part's RoHS status is not specified. Both components maintain identical REACH and ECCN classifications, supporting regulatory continuity.

Selection of the VLS252012HBX-150M-1 requires confirmation that the unspecified electrical parameters (current rating, DC resistance, saturation current, and shielding characteristics) meet or exceed the original VLF252012MT-150M specifications for the intended application. Package compatibility and physical dimensions must be verified against PCB layout constraints.

Frequently Asked Questions (FAQ)

Q: Can the VLS252012HBX-150M-1 directly replace the VLF252012MT-150M in existing designs?

A: Both parts share the same 15 µH inductance value and 1 MHz test frequency. However, direct replacement requires verification that the substitute part's current rating, DC resistance, and shielding characteristics meet the application's electrical requirements. Package dimensions and mounting compatibility must also be confirmed.

Q: What is the significance of the obsolete status of the VLF252012MT-150M?

A: Obsolete status indicates the part is no longer manufactured or supported by TDK Corporation. The VLS252012HBX-150M-1 is an active product, ensuring ongoing availability and supply chain continuity for new production and design revisions.

Q: Are there compliance differences between these parts?

A: Both parts share identical REACH and ECCN classifications. The VLS252012HBX-150M-1 carries explicit ROHS3 compliance certification. The original part's RoHS status is not documented in available specifications.

Q: What parameters are critical for substitution evaluation?

A: Current rating (630 mA minimum), DC resistance (680 mOhm maximum), saturation current, shielding type, and package form factor are the primary parameters determining substitution viability. These must be matched or exceeded in the alternative component.

Q: How does package size affect substitution?

A: The VLF252012MT-150M uses the 1008 (2520 Metric) package with dimensions 2.50mm L × 2.00mm W × 1.20mm H (seated). The substitute part's package specification is not provided. Physical compatibility with PCB footprints and assembly equipment must be independently verified.