USB7051T-I/KDX Equivalent & Substitute Parts

Part Overview

The USB7051T-I/KDX is a USB Hub Controller manufactured by Microchip Technology, designed for USB 3.1 interface applications with I2C communication protocol support. This component is packaged in a 100-VQFN (12x12) form factor with exposed pad configuration.

The USB7051T-I/KDX has reached obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for systems utilizing this controller.

Substiute Parts

USB7051T-I/KDX
Microchip TechnologyIn Stock: 848USB7051T-I/KDX Datasheet
USB7051T-I/KDX
Current Part
USB7050PT-I/KDX
Microchip TechnologyIn Stock: 755USB7050PT-I/KDX Datasheet
USB7050PT-I/KDX
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number USB7051T-I/KDX
Manufacturer Microchip Technology
Category Interface
Function Hub Controller
Protocol USB
Interface I2C
Standards USB 3.1
Package / Case 100-VFQFN Exposed Pad
Supplier Device Package 100-VQFN (12x12)
Operating Temperature -40°C ~ 85°C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the USB7051T-I/KDX is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must utilize the 100-VQFN (12x12) package with exposed pad configuration to ensure PCB layout and thermal management compatibility.

Functional Equivalence: The substitute must perform hub controller functionality with USB protocol support and I2C interface capability.

Thermal and Environmental Specifications: Operating temperature range of -40°C ~ 85°C and MSL rating of 3 (168 Hours) must be maintained.

Compliance Standards: RoHS3 compliance and REACH unaffected status are required for regulatory alignment.

Supply Voltage Compatibility: The substitute must support equivalent or overlapping supply voltage ranges to ensure power delivery system compatibility.

The USB7050PT-I/KDX qualifies as a manufacturer-recommended substitute based on these parameters. While it introduces enhanced interface capabilities (GPIO, I2S, SPI, UART in addition to I2C) and supports USB 2.0 and USB 3.2 standards, it maintains the identical package footprint, thermal specifications, compliance certifications, and operating temperature range.

Parameter Comparison

Parameter USB7051T-I/KDX (Main Part) USB7050PT-I/KDX (Substitute)
Manufacturer Microchip Technology Microchip Technology
Category Interface Interface
Function Hub Controller Hub Controller
Protocol USB USB
Interface I2C GPIO, I2C, I2S, SPI, UART, USB
Standards USB 3.1 USB 2.0, USB 3.2
Package / Case 100-VFQFN Exposed Pad 100-VFQFN Exposed Pad
Supplier Device Package 100-VQFN (12x12) 100-VQFN (12x12)
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Active
Packaging Type Not specified Tape & Reel (TR)
Grade Not specified Automotive
Qualification Not specified AEC-Q100

Engineering Selection Recommendations

The USB7050PT-I/KDX is the manufacturer-recommended substitute for the obsolete USB7051T-I/KDX. Selection of this substitute is supported by the following engineering criteria:

Product Status: The substitute maintains active product status with current manufacturing support, ensuring long-term availability and supply chain stability compared to the obsolete main part.

Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements without modification to existing compliance documentation.

Package and Thermal Compatibility: Identical 100-VQFN (12x12) package footprint and operating temperature range (-40°C ~ 85°C) ensure direct PCB layout compatibility and thermal management equivalence.

Automotive Qualification: The substitute carries AEC-Q100 qualification and automotive grade designation, providing enhanced reliability assurance for applications requiring automotive-level component qualification.

Interface Expansion: The substitute provides extended interface support (GPIO, I2S, SPI, UART) beyond the main part's I2C interface, offering design flexibility for future feature integration without package or thermal constraints.

Frequently Asked Questions (FAQ)

Q: Can the USB7050PT-I/KDX be used as a direct replacement for the USB7051T-I/KDX?

A: Yes. Both components share identical package geometry (100-VQFN 12x12), operating temperature range (-40°C ~ 85°C), MSL rating (3), and compliance certifications (ROHS3, REACH). The substitute is the manufacturer-recommended equivalent.

Q: What are the key differences between these two parts?

A: The USB7050PT-I/KDX supports additional interface protocols (GPIO, I2S, SPI, UART) and USB standards (USB 2.0, USB 3.2) compared to the USB7051T-I/KDX (I2C interface, USB 3.1). The substitute also carries automotive grade and AEC-Q100 qualification. Both maintain identical package footprint and thermal specifications.

Q: Does the substitute require PCB layout modifications?

A: No. The 100-VQFN (12x12) package footprint is identical, eliminating the need for PCB redesign or layout changes.

Q: Are there supply voltage compatibility concerns?

A: The USB7050PT-I/KDX supports supply voltages of 1.08V ~ 1.32V and 3V ~ 3.6V. Verify that your power delivery system can accommodate these voltage ranges. The main part's supply voltage specifications were not provided for direct comparison.

Q: What is the significance of the automotive grade and AEC-Q100 qualification on the substitute?

A: AEC-Q100 qualification indicates the component meets automotive industry reliability and quality standards. This provides enhanced assurance for applications requiring automotive-level component qualification, though it does not restrict use in non-automotive applications.

Q: Is the Tape & Reel (TR) packaging of the substitute compatible with existing assembly processes?

A: Tape & Reel packaging is standard for automated assembly processes. Verify compatibility with your specific pick-and-place equipment and assembly workflow. The main part's packaging type was not specified.

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