USB7050/KDX Equivalent & Substitute Parts

Part Overview

The USB7050/KDX is a 4-port USB 3.1 Gen1 interface controller with Power Delivery upstream capability, manufactured by Microchip Technology. This component is classified as obsolete, which necessitates identification of functionally equivalent alternatives for new designs and ongoing system support. The part is ROHS3 compliant and carries a Moisture Sensitivity Level of 3 (168 hours), indicating standard handling requirements for production environments.

Substiute Parts

USB7050/KDX

Microchip TechnologyIn Stock: 33156USB7050/KDX Datasheet

Current PartRFQ

USB7050P/KDX

Microchip TechnologyIn Stock: 1051USB7050P/KDX Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The USB7050P/KDX qualifies as a manufacturer-recommended substitute based on the following substitution criteria:

Functional Equivalence: Both parts operate as USB hub controllers within the SmartHub™ series from Microchip Technology. The substitute maintains the 4-port architecture and upstream Power Delivery functionality required for the original application.

Protocol Compatibility: Both parts support USB interface standards. The substitute extends capability to USB 3.2 Gen1, which maintains backward compatibility with USB 3.1 Gen1 specifications.

Interface Consistency: Both parts provide GPIO, I2C, I2S, SPI, and UART interfaces, ensuring compatibility with existing firmware and hardware integration.

Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, meeting regulatory requirements for the same application domains.

Packaging Consideration: The substitute is supplied in Tray packaging, whereas the original part number does not specify packaging. Both use the 100-VQFN (12x12) package footprint, ensuring mechanical compatibility on PCB layouts.

Parameter Comparison

Engineering Selection Recommendations

The USB7050P/KDX is the designated manufacturer substitute for the obsolete USB7050/KDX. Selection of the substitute part is based on:

Product Status Transition: The original part is obsolete, making the active-status substitute the appropriate choice for new production and design continuity.

Regulatory Compliance: Both parts maintain ROHS3 and REACH compliance, satisfying environmental and hazardous substance requirements across regulated markets.

Certification Status: The substitute carries AEC-Q100 automotive qualification, providing additional reliability assurance for applications requiring automotive-grade components.

Functional Continuity: The substitute preserves the 4-port USB hub controller architecture with upstream Power Delivery, maintaining system-level compatibility with existing designs.

Frequently Asked Questions (FAQ)

Q: Can the USB7050P/KDX directly replace the USB7050/KDX in existing designs?

A: Yes. Both parts share the same 100-VQFN (12x12) package footprint and provide equivalent 4-port USB hub controller functionality with upstream Power Delivery. PCB layout compatibility is maintained.

Q: What is the primary difference between USB 3.1 Gen1 and USB 3.2 Gen1?

A: USB 3.2 Gen1 is the rebranded designation for the same 5 Gbps data rate previously called USB 3.1 Gen1. The substitute maintains backward compatibility with USB 3.1 Gen1 specifications and applications.

Q: Are there any supply voltage differences that affect circuit design?

A: The substitute specifies dual supply voltage ranges: 1.08V ~ 1.32V and 3V ~ 3.6V. Verify that your power supply design accommodates these ranges. The original part does not specify voltage parameters in the provided data.

Q: Does the automotive qualification of the substitute affect non-automotive applications?

A: No. AEC-Q100 qualification indicates enhanced reliability testing and is applicable to any application. Non-automotive designs may use the substitute without modification.

Q: What is the significance of the Moisture Sensitivity Level 3 rating?

A: MSL 3 (168 hours) indicates the component can be exposed to ambient conditions for up to 168 hours before soldering. Standard moisture control procedures during storage and assembly are required.

Q: Is the Tray packaging of the substitute compatible with automated assembly?

A: Yes. Tray packaging is standard for automated pick-and-place assembly processes. Confirm your assembly equipment supports 100-VQFN component handling.