USB5807T/KD Equivalent & Substitute Parts

Part Overview

The USB5807T/KD is a USB Hub Controller IC manufactured by Microchip Technology, designed for USB 3.1 applications with SPI interface capability. This component is classified as obsolete, which necessitates identification of equivalent substitute parts for ongoing design requirements and production continuity. The part is housed in a 100-VQFN package with exposed pad and operates across a supply voltage range of 1.2V and 3.3V.

Substiute Parts

USB5807T/KD

Microchip TechnologyIn Stock: 3226USB5807T/KD Datasheet

Current PartRFQ

USB5807CT/KD

Microchip TechnologyIn Stock: 7254USB5807CT/KD Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the USB5807T/KD is determined by the following critical parameters:

• Base Product Number: USB5807 (common across main and substitute parts)
• Package Type: 100-VFQFN Exposed Pad (identical physical footprint)
• Protocol: USB 3.1 (maintained across substitutes)
• Function: Hub Controller (core functionality preserved)
• RoHS Compliance: ROHS3 Compliant (regulatory requirement maintained)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements identical)

The USB5807CT/KD qualifies as a direct substitute based on these parameters. The substitute part maintains the same base product number, package configuration, USB 3.1 standard compliance, and environmental specifications. The primary distinction is the addition of I2C interface capability in the substitute part, which represents an enhancement rather than a deviation from the original specification.

Parameter Comparison

Engineering Selection Recommendations

The USB5807CT/KD is the qualified substitute for the obsolete USB5807T/KD. Selection of this substitute is supported by the following factors:

• Product Status: The substitute part maintains Active status, ensuring continued availability and manufacturing support from Microchip Technology.
• Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements.
• Package Compatibility: Identical 100-VFQFN package configuration ensures direct PCB footprint compatibility without layout modifications.
• Functional Equivalence: Both parts perform the USB Hub Controller function with USB 3.1 standard compliance and identical operating temperature range.
• Supply Voltage Range: The substitute part features an expanded supply voltage specification (1.08V ~ 1.32V, 3V ~ 3.6V) that encompasses the original part's voltage requirements (1.2V, 3.3V).

Frequently Asked Questions (FAQ)

Q: Can the USB5807CT/KD be used as a direct replacement for the USB5807T/KD?

A: Yes. Both parts share the same base product number (USB5807), identical package configuration (100-VFQFN), and equivalent functional specifications for USB 3.1 hub controller operation. The substitute part is pin-compatible and footprint-compatible.

Q: What is the difference between the SPI-only interface of the USB5807T/KD and the I2C/SPI interface of the USB5807CT/KD?

A: The USB5807CT/KD adds I2C interface capability in addition to SPI. This represents an enhancement that does not affect compatibility with designs using only the SPI interface. Existing SPI-based implementations will function without modification.

Q: Are there any voltage supply differences that affect circuit design?

A: The USB5807CT/KD specifies a wider supply voltage range (1.08V ~ 1.32V, 3V ~ 3.6V) compared to the USB5807T/KD (1.2V, 3.3V). This expanded range is compatible with the original part's voltage requirements and does not necessitate power supply circuit modifications.

Q: Is the packaging identical between the two parts?

A: Yes. Both parts use the 100-VFQFN package with exposed pad in identical physical dimensions (12x12mm). No PCB layout changes are required for substitution.

Q: What is the moisture sensitivity level, and does it affect handling?

A: Both parts have MSL 3 (168 Hours), indicating identical moisture sensitivity and handling requirements. Standard ESD and moisture control procedures apply to both parts during storage, transport, and assembly.