USB5807T-I/KD Equivalent & Substitute Parts

Part Overview

The USB5807T-I/KD is a USB Hub Controller IC manufactured by Microchip Technology, designed for USB 3.1 applications with SPI interface capability. This component operates in the 100-VQFN package format and supports dual supply voltages (1.2V and 3.3V). The product is currently classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations.

Substiute Parts

USB5807T-I/KD

Microchip TechnologyIn Stock: 939USB5807T-I/KD Datasheet

Current PartRFQ

USB5807CT-I/KD

Microchip TechnologyIn Stock: 3507USB5807CT-I/KD Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the USB5807T-I/KD is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 100-VQFN (12x12) package with exposed pad configuration to ensure mechanical and thermal compatibility.

Functional Equivalence: The substitute must perform the USB Hub Controller function and support USB 3.1 standards.

Interface Support: The main part operates with SPI interface. The substitute must support SPI as a minimum interface requirement.

Supply Voltage Compatibility: The main part requires 1.2V and 3.3V supplies. The substitute voltage ranges must encompass or overlap these requirements.

Operating Temperature Range: The substitute must maintain the -40°C to 85°C operating range.

Regulatory Compliance: Both parts must maintain ROHS3 compliance and REACH unaffected status.

The USB5807CT-I/KD qualifies as a direct substitute based on these parameters while offering enhanced interface flexibility and active product status.

Parameter Comparison

Engineering Selection Recommendations

The USB5807CT-I/KD is the manufacturer-recommended substitute for the obsolete USB5807T-I/KD. Both components share identical base product architecture, package specifications, and regulatory compliance certifications. The substitute maintains full backward compatibility with the original part's mechanical footprint and thermal characteristics.

The USB5807CT-I/KD offers extended supply voltage ranges (1.08V ~ 1.32V and 3V ~ 3.6V) compared to the discrete voltage levels of the original part, providing improved design flexibility. The addition of I2C interface capability in the substitute does not affect SPI-based implementations and represents a functional enhancement.

The active product status of the USB5807CT-I/KD ensures long-term availability and ongoing manufacturer support, addressing the obsolescence constraint of the original part.

Frequently Asked Questions (FAQ)

Q: Can the USB5807CT-I/KD directly replace the USB5807T-I/KD in existing designs?

A: Yes. Both parts share identical package specifications (100-VQFN 12x12), functional classification (USB Hub Controller), USB 3.1 standard support, and operating temperature range. The substitute's extended voltage ranges are compatible with the original part's supply requirements.

Q: What is the significance of the interface difference between SPI-only and I2C/SPI?

A: The USB5807T-I/KD operates exclusively with SPI interface. The USB5807CT-I/KD supports both I2C and SPI interfaces. For designs using SPI, the substitute functions identically. The additional I2C capability does not impact SPI-based implementations.

Q: Are there regulatory or compliance differences between these parts?

A: No. Both parts maintain ROHS3 compliance, REACH unaffected status, and identical MSL ratings (3, 168 Hours). Regulatory requirements are equivalent.

Q: Why is the USB5807CT-I/KD classified as active while the original is obsolete?

A: The USB5807CT-I/KD represents the current production variant of the USB5807 controller family. Microchip Technology has transitioned manufacturing to this model, ensuring continued availability and support for new and existing applications.

Q: Are there packaging format differences?

A: Both parts use identical packaging: 100-VQFN (12x12) with exposed pad. Mechanical compatibility is complete, including PCB footprint, thermal interface, and lead configuration.