USB5807-I/KD Equivalent & Substitute Parts

Part Overview

The USB5807-I/KD is a USB Hub Controller IC manufactured by Microchip Technology, designed for USB 3.1 applications with SPI interface capability. This component operates in the 100-VQFN (12x12) package and supports dual supply voltages of 1.2V and 3.3V. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations.

Substiute Parts

USB5807-I/KD
Microchip TechnologyIn Stock: 1813USB5807-I/KD Datasheet
USB5807-I/KD
Current Part
USB5807C-I/KD
Microchip TechnologyIn Stock: 3348USB5807C-I/KD Datasheet
USB5807C-I/KD
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number USB5807-I/KD
Manufacturer Microchip Technology
Function Hub Controller
Protocol USB
Interface SPI
Standards USB 3.1
Package / Case 100-VFQFN Exposed Pad
Supplier Device Package 100-VQFN (12x12)
Voltage - Supply 1.2V, 3.3V
Operating Temperature -40°C ~ 85°C
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the USB5807-I/KD is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 100-VQFN (12x12) package with exposed pad configuration to ensure PCB footprint compatibility and thermal performance equivalence.

Interface Protocol: The USB5807-I/KD implements SPI interface. Substitute parts must support SPI as a minimum interface requirement. Extended interface support (such as I2C in addition to SPI) does not prevent substitution, as SPI functionality remains available.

USB Standard Compliance: Both parts must comply with USB 3.1 standard to maintain protocol compatibility within the system architecture.

Supply Voltage Ranges: The main part operates at 1.2V and 3.3V. Substitute parts must support these voltage levels or overlapping ranges to ensure power delivery compatibility.

Operating Temperature Range: Both parts must support the -40°C ~ 85°C operating temperature range for thermal environment compatibility.

Base Product Number: Both parts share the USB5807 base product number, indicating they are part of the same product family and design lineage.

Regulatory Compliance: Both parts must maintain ROHS3 compliance and equivalent moisture sensitivity ratings to meet manufacturing and environmental standards.

Parameter Comparison

Parameter USB5807-I/KD (Main Part) USB5807C-I/KD (Substitute)
Manufacturer Microchip Technology Microchip Technology
Base Product Number USB5807 USB5807
Function Hub Controller Hub Controller
Protocol USB USB
Interface SPI I2C, SPI
Standards USB 3.1 USB 3.1
Package / Case 100-VFQFN Exposed Pad 100-VFQFN Exposed Pad
Supplier Device Package 100-VQFN (12x12) 100-VQFN (12x12)
Voltage - Supply 1.2V, 3.3V 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

The USB5807C-I/KD is the designated substitute for the obsolete USB5807-I/KD. Both components share identical package geometry, USB 3.1 compliance, operating temperature range, and regulatory certifications. The USB5807C-I/KD maintains full backward compatibility with SPI interface requirements while adding I2C interface capability. Supply voltage ranges are compatible, with the substitute offering slightly extended voltage tolerance windows. The USB5807C-I/KD holds active product status with established supply chain availability, making it the appropriate selection for replacement applications and new designs requiring USB 3.1 hub controller functionality.

Frequently Asked Questions (FAQ)

Q: Can the USB5807C-I/KD directly replace the USB5807-I/KD in existing designs?

A: Yes. Both parts use identical 100-VQFN (12x12) package geometry with exposed pad configuration, ensuring PCB footprint compatibility. The USB5807C-I/KD supports SPI interface operation, maintaining functional equivalence with the original design. Supply voltage ranges are compatible within the specified operating parameters.

Q: What is the difference between the USB5807-I/KD and USB5807C-I/KD?

A: The primary difference is interface capability. The USB5807-I/KD implements SPI interface only, while the USB5807C-I/KD supports both I2C and SPI interfaces. The USB5807C-I/KD also features extended supply voltage tolerance ranges (1.08V ~ 1.32V for core supply, 3V ~ 3.6V for I/O supply) compared to the fixed 1.2V and 3.3V specifications of the original part. The USB5807C-I/KD holds active product status, whereas the USB5807-I/KD is obsolete.

Q: Are there any thermal or electrical performance differences?

A: Both parts operate within the same -40°C ~ 85°C temperature range and maintain identical moisture sensitivity ratings (MSL 3, 168 hours). Package thermal characteristics are equivalent due to identical physical dimensions and exposed pad configuration.

Q: What packaging options are available for the USB5807C-I/KD?

A: The USB5807C-I/KD is supplied in Tray packaging. Both the main part and substitute maintain the 100-VQFN (12x12) package specification with exposed pad.

Q: Are both parts RoHS compliant?

A: Yes. Both the USB5807-I/KD and USB5807C-I/KD are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

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