UPD78F0750MA-FAA-AX Equivalent & Substitute Parts

Part Overview

The UPD78F0750MA-FAA-AX is an 8-bit microcontroller from Renesas Electronics Corporation's 78K0/Ix2 series, featuring 4KB FLASH program memory and operating at 10MHz. This device is classified as Active product status with full RoHS3 compliance. Substitute parts are identified when design requirements necessitate alternative performance characteristics, expanded memory capacity, or different package configurations while maintaining functional compatibility within embedded control applications.

Substiute Parts

UPD78F0750MA-FAA-AX
Renesas Electronics CorporationIn Stock: 752UPD78F0750MA-FAA-AX Datasheet
UPD78F0750MA-FAA-AX
Current Part
R5F11768GSP#30
Renesas Electronics CorporationIn Stock: 1122R5F11768GSP#30 Datasheet
R5F11768GSP#30
Similar

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series 78K0/Ix2
Core Processor 78K/0
Core Size 8-Bit
Speed 10MHz
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
RAM Size 384 x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 5x10b
Number of I/O 9
Peripherals LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 16-SSOP (0.173", 4.40mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)
Product Status Active

Substitute Part Grouping Explanation

The R5F11768GSP#30 is identified as a substitute based on the following substitution criteria:

Allowed Substitution Parameters:

  • Manufacturer: Renesas Electronics Corporation (same manufacturer)
  • Product Status: Active (both parts maintain active production status)
  • RoHS Compliance: ROHS3 Compliant (equivalent environmental standard)
  • MSL Rating: 3 (168 Hours) (identical moisture sensitivity level)
  • Operating Temperature Range: -40°C ~ 105°C (TA) (identical thermal operating window)
  • Mounting Type: Surface Mount (same mounting technology)

Functional Differences Permitted in Substitution:

  • Core Architecture: 16-Bit (upgraded from 8-Bit)
  • Processing Speed: 24MHz (upgraded from 10MHz)
  • Program Memory: 8KB FLASH (upgraded from 4KB)
  • RAM: 768 x 8 (upgraded from 384 x 8)
  • EEPROM: 2K x 8 (added feature)
  • Data Converters: A/D 6x8/12b (enhanced from 5x10b)
  • I/O Count: 11 (increased from 9)
  • Connectivity: CSI, I2C, UART/USART (added interfaces)
  • Package: 20-LSSOP (different from 16-SSOP)
  • Voltage Supply: 1.6V ~ 3.6V (narrower range than 2.7V ~ 5.5V)

Parameter Comparison

Parameter UPD78F0750MA-FAA-AX R5F11768GSP#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Product Status Active Active
Core Size 8-Bit 16-Bit
Speed 10MHz 24MHz
Program Memory Size 4KB (4K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 384 x 8 768 x 8
EEPROM Size Not specified 2K x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V 1.6V ~ 3.6V
Data Converters A/D 5x10b A/D 6x8/12b
Number of I/O 9 11
Peripherals LVD, POR, PWM, WDT LVD, POR, WDT
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 16-SSOP (0.173", 4.40mm Width) 20-LSSOP (0.173", 4.40mm Width)
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

Selection between UPD78F0750MA-FAA-AX and R5F11768GSP#30 is determined by application memory and processing requirements:

UPD78F0750MA-FAA-AX Selection Criteria:

  • Applications requiring 4KB program memory capacity are sufficient
  • 10MHz processing speed meets application timing requirements
  • 9 I/O pins satisfy interface requirements
  • 16-SSOP package footprint is compatible with PCB layout constraints
  • Supply voltage range 2.7V ~ 5.5V accommodates power supply design
  • PWM peripheral availability is required

R5F11768GSP#30 Selection Criteria:

  • Applications requiring 8KB program memory capacity
  • 24MHz processing speed is necessary for performance requirements
  • 11 I/O pins are required for expanded interface connectivity
  • 20-LSSOP package footprint is compatible with PCB layout constraints
  • Supply voltage range 1.6V ~ 3.6V is compatible with power supply design
  • EEPROM storage and enhanced data converter resolution are required
  • CSI, I2C, UART/USART connectivity is necessary

Both parts maintain Active product status, ROHS3 compliance, identical MSL ratings, and identical operating temperature ranges. Package differences (16-SSOP versus 20-LSSOP) require PCB redesign consideration.

Frequently Asked Questions (FAQ)

Q: Can R5F11768GSP#30 directly replace UPD78F0750MA-FAA-AX without firmware modification?

A: Direct replacement requires firmware evaluation. The R5F11768GSP#30 operates at 24MHz versus 10MHz, uses 16-Bit architecture versus 8-Bit, and features different peripheral configurations. Timing-dependent code and peripheral initialization routines require validation. Package differences (16-SSOP to 20-LSSOP) necessitate PCB redesign.

Q: What are the voltage supply compatibility considerations?

A: UPD78F0750MA-FAA-AX operates at 2.7V ~ 5.5V. R5F11768GSP#30 operates at 1.6V ~ 3.6V. Applications using supply voltages above 3.6V cannot use R5F11768GSP#30. Applications using supply voltages below 2.7V cannot use UPD78F0750MA-FAA-AX.

Q: Are the package dimensions compatible for PCB layout?

A: Both packages maintain 0.173" (4.40mm) width. UPD78F0750MA-FAA-AX uses 16-SSOP configuration. R5F11768GSP#30 uses 20-LSSOP configuration. Pin count and footprint differ, requiring PCB layout modification.

Q: Do both parts meet the same environmental compliance standards?

A: Both parts are ROHS3 Compliant with MSL Rating 3 (168 Hours) and identical operating temperature range -40°C ~ 105°C (TA). R5F11768GSP#30 carries REACH Affected status while UPD78F0750MA-FAA-AX carries REACH Unaffected status.

Q: What peripheral differences affect application design?

A: UPD78F0750MA-FAA-AX includes PWM peripheral. R5F11768GSP#30 does not list PWM but includes CSI, I2C, and UART/USART connectivity. Application requirements for PWM functionality or serial communication interfaces determine part selection.

Q: Is the increased memory in R5F11768GSP#30 backward compatible?

A: Increased program memory (8KB versus 4KB), RAM (768 x 8 versus 384 x 8), and added EEPROM (2K x 8) provide expanded capacity. Firmware designed for 4KB memory operates within 8KB capacity. However, architectural differences (8-Bit versus 16-Bit) and peripheral variations require code validation.

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