UDN2982A-T Equivalent & Substitute Parts

Part Overview

The UDN2982A-T is a Power Switch/Driver IC manufactured by Allegro MicroSystems, designed for high-side bipolar switching applications with 1:1 input-to-output ratio and 500mA maximum output current. The device operates across a 5V to 50V load voltage range and features current limiting fault protection. Currently classified as Obsolete, the UDN2982A-T requires identification of functionally equivalent alternatives for ongoing system support and new procurement activities.

Substiute Parts

UDN2982A-T

Allegro MicroSystemsIn Stock: 2997UDN2982A-T Datasheet

Current PartRFQ

A2982SLWTR-T

Allegro MicroSystemsIn Stock: 20879A2982SLWTR-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the UDN2982A-T is determined by strict equivalence across the following critical parameters:

• Functional Architecture: 8-output, 1:1 input-to-output ratio, high-side bipolar switching configuration
• Electrical Performance: 500mA maximum output current, 5V to 50V load voltage range, non-inverting input logic
• Protection Features: Current limiting fault protection capability
• Thermal Operating Range: -20°C to 85°C ambient temperature specification
• Regulatory Compliance: ROHS3 compliance and REACH unaffected status

The A2982SLWTR-T qualifies as a manufacturer-recommended substitute based on identical electrical specifications, functional output configuration, and regulatory compliance. The primary distinction is packaging format: the UDN2982A-T uses through-hole 18-DIP mounting, while the A2982SLWTR-T employs surface-mount 20-SOIC technology. Both devices share the same base product number (UDN2982 vs. A2982) and maintain electrical parameter equivalence.

Parameter Comparison

Engineering Selection Recommendations

The A2982SLWTR-T serves as the manufacturer-designated substitute for the obsolete UDN2982A-T, maintaining full electrical and functional equivalence. Both devices are ROHS3 compliant and REACH unaffected, satisfying regulatory requirements for industrial and commercial applications.

Selection between these parts depends on board-level integration requirements:

• UDN2982A-T (Through-Hole 18-DIP): Suitable for legacy through-hole PCB designs and applications requiring direct socket compatibility with existing board layouts.
• A2982SLWTR-T (Surface-Mount 20-SOIC): Appropriate for modern surface-mount assembly processes and space-constrained designs. The 20-SOIC package provides equivalent electrical performance with reduced board footprint.

Both devices operate identically across the specified load voltage range (5V to 50V) and deliver 500mA maximum output current with current-limiting fault protection. The choice between through-hole and surface-mount packaging should be determined by PCB design constraints and manufacturing capabilities rather than electrical performance considerations.

Frequently Asked Questions (FAQ)

Q: Can the A2982SLWTR-T directly replace the UDN2982A-T in existing designs?

A: Electrical and functional replacement is complete. However, the A2982SLWTR-T uses surface-mount 20-SOIC packaging versus the UDN2982A-T's through-hole 18-DIP format. PCB layout and assembly process modifications are required. Pin configuration differences must be verified against schematic requirements.

Q: What are the key electrical parameters that define substitution eligibility?

A: Substitution is valid when the following parameters match: 8-output configuration, 1:1 input-to-output ratio, high-side bipolar output type, 500mA maximum output current, 5V to 50V load voltage range, non-inverting input logic, and -20°C to 85°C operating temperature specification.

Q: Are there differences in fault protection between these devices?

A: The UDN2982A-T specifies current limiting (fixed) fault protection. The A2982SLWTR-T does not list fault protection in the provided specifications. Verify fault protection requirements against application needs before substitution.

Q: What is the significance of the product status difference?

A: The UDN2982A-T is classified as Obsolete, indicating discontinued manufacturing and limited availability. The A2982SLWTR-T is classified as Not For New Designs, indicating limited production support. For new development, evaluate alternative active-status power driver solutions from Allegro MicroSystems or competing manufacturers.

Q: How do the package dimensions affect board design?

A: The 18-DIP package measures 0.300" (7.62mm) width, while the 20-SOIC package measures 0.295" (7.50mm) width. Surface-mount 20-SOIC provides reduced vertical profile and smaller footprint compared to through-hole 18-DIP, enabling higher component density in modern PCB designs.