UB3C-68RF8 Equivalent & Substitute Parts

Part Overview

The UB3C-68RF8 is a 68 Ohm ±1% 3W axial wirewound resistor manufactured by Riedon. This through-hole component is designed for current sensing applications and features flame proof, moisture resistant, pulse withstanding, and safety certifications. The part is currently active in production with 1017 units in stock. Equivalent and substitute parts are identified when component availability is limited, supply chain disruptions occur, or design flexibility permits alternative sourcing while maintaining electrical and mechanical compatibility.

Substiute Parts

UB3C-68RF8

RiedonIn Stock: 1107UB3C-68RF8 Datasheet

Current PartRFQ

WW3FT68R0

Stackpole Electronics IncIn Stock: 7687WW3FT68R0 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the UB3C-68RF8 is permissible when the alternative component meets the following criteria:

Resistance value of 68 Ohms with ±1% tolerance ensures electrical equivalence in current sensing circuits. Power rating of 3W maintains thermal performance under specified operating conditions. Wirewound composition preserves the electrical characteristics and reliability profile. Axial package type ensures mechanical compatibility with through-hole PCB layouts. Temperature coefficient of ±20ppm/°C and operating temperature range support the thermal environment of the application. RoHS3 compliance and REACH unaffected status maintain regulatory alignment. Moisture Sensitivity Level 1 or Not Applicable ensures reliability in moisture-prone environments.

The WW3FT68R0 from Stackpole Electronics Inc satisfies all substitution criteria and is classified as a manufacturer-recommended equivalent.

Parameter Comparison

Engineering Selection Recommendations

The WW3FT68R0 is suitable as a direct substitute for the UB3C-68RF8 based on electrical and mechanical parameter equivalence. Both components are ROHS3 compliant and REACH unaffected, meeting regulatory requirements. The WW3FT68R0 provides an extended operating temperature range (-55°C ~ 350°C) compared to the UB3C-68RF8 (-55°C ~ 250°C), offering additional thermal margin in high-temperature applications. Packaging format differs (Cut Tape versus Tape & Reel), which may affect procurement and assembly workflows but does not impact electrical performance or mechanical fit in through-hole applications.

Frequently Asked Questions (FAQ)

Q: Can the WW3FT68R0 replace the UB3C-68RF8 in all applications?

A: Yes, the WW3FT68R0 meets all electrical and mechanical substitution criteria. The extended operating temperature range of the WW3FT68R0 provides additional design margin. Packaging format differs but does not affect circuit performance or PCB mounting compatibility.

Q: What are the key parameters that determine substitution eligibility?

A: Resistance value (68 Ohms), tolerance (±1%), power rating (3W), composition (wirewound), package type (axial), temperature coefficient (±20ppm/°C), and regulatory compliance (RoHS3, REACH unaffected) are the primary criteria. Operating temperature range and moisture sensitivity level must be compatible with application requirements.

Q: Does the difference in physical dimensions affect PCB layout?

A: The UB3C-68RF8 measures 0.157" Dia x 0.350" L (4.00mm x 8.90mm). The WW3FT68R0 measures 0.187" Dia x 0.560" L (4.75mm x 14.22mm). Both are axial through-hole components with 2 terminations. Physical dimension differences may require PCB layout verification for tight spacing applications, but standard through-hole footprints accommodate both components.

Q: Are there regulatory or compliance differences between the two parts?

A: Both components are ROHS3 compliant and REACH unaffected. No regulatory differences exist. ECCN and HTSUS classifications are identical.

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel (TR) packaging provides components on continuous tape suitable for automated pick-and-place assembly. Cut Tape (CT) packaging provides components on tape segments suitable for manual or semi-automated assembly. Both formats contain the same component; packaging format selection depends on assembly process requirements.