TZS4697-GS08 Equivalent & Substitute Parts

Part Overview

The TZS4697-GS08 is a Zener diode manufactured by Vishay General Semiconductor - Diodes Division, rated at 10 V nominal with 500 mW power dissipation capability. This component is classified as an active product with automotive-grade qualification (AEC-Q101) and is packaged in SOD-80 QuadroMELF surface mount configuration. The device operates across a temperature range of -65°C to 175°C and maintains RoHS3 compliance with unlimited moisture sensitivity rating (MSL 1).

Equivalent and substitute parts are identified to address supply chain requirements, inventory availability, or specific application constraints while maintaining functional compatibility within the defined electrical and mechanical parameters.

Substiute Parts

TZS4697-GS08

Vishay General Semiconductor - Diodes DivisionIn Stock: 17880TZS4697-GS08 Datasheet

Current PartRFQ

1N4104UR-1

Microchip TechnologyIn Stock: 9591N4104UR-1 Datasheet

MFR RecommendedRFQ

BZV55-B10,115

NXP SemiconductorsIn Stock: 352854BZV55-B10,115 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TZS4697-GS08 are qualified based on the following critical parameters:

Electrical Compatibility Criteria:

• Zener voltage (Vz) of 10 V nominal
• Power dissipation capability of 500 mW minimum
• Voltage tolerance within ±5% or better
• Operating temperature range spanning -65°C minimum to 175°C minimum
• Surface mount mounting type

Mechanical Compatibility Criteria:

• Surface mount package configuration
• Compatible footprint and lead spacing for PCB assembly

Compliance Criteria:

• Active product status
• RoHS compliance status
• REACH unaffected classification

The substitute parts identified (1N4104UR-1 and BZV55-B10,115) meet the core electrical specifications for zener voltage and power rating. Variations in reverse leakage current, forward voltage characteristics, impedance, and package geometry are documented to enable informed selection based on specific circuit requirements and assembly constraints.

Parameter Comparison

Engineering Selection Recommendations

TZS4697-GS08 (Primary Selection)

The TZS4697-GS08 maintains active product status with full RoHS3 compliance and automotive-grade qualification (AEC-Q101). This part is recommended for applications requiring regulatory compliance with RoHS directives and automotive industry standards. The SOD-80 QuadroMELF package provides established thermal performance characteristics. Current inventory of 17,800 pieces supports production requirements.

1N4104UR-1 (Microchip Technology)

The 1N4104UR-1 provides electrical equivalence with 10 V nominal zener voltage and 500 mW power rating. This part exhibits superior reverse leakage characteristics (500 nA versus 1 µA) and lower forward voltage drop (1.1 V @ 200 mA versus 1.5 V @ 100 mA). However, this part carries RoHS non-compliant status, restricting its use in applications subject to RoHS regulatory requirements. The DO-213AA package differs from the SOD-80 QuadroMELF configuration, requiring PCB layout verification. Limited inventory (910 pieces) may constrain high-volume applications.

BZV55-B10,115 (NXP Semiconductors)

The BZV55-B10,115 offers the tightest zener voltage tolerance (±2% versus ±5%) and superior reverse leakage performance (200 nA @ 7 V). Extended operating temperature range to 200°C provides thermal margin beyond the primary part specification. The LLDS MiniMelf package designation indicates compatibility with SOD-80 footprints. Compliance status aligns with REACH unaffected classification. Substantial inventory availability (352,780 pieces) supports supply chain continuity. This part is suitable for applications prioritizing voltage regulation precision and thermal performance.

Frequently Asked Questions (FAQ)

Q: Can the 1N4104UR-1 be used as a direct replacement for the TZS4697-GS08 in automotive applications?

A: The 1N4104UR-1 meets the core electrical specifications (10 V, 500 mW) and operating temperature range. However, RoHS non-compliance status disqualifies this part from applications subject to RoHS regulatory requirements. Automotive applications requiring RoHS3 compliance must use the TZS4697-GS08 or BZV55-B10,115.

Q: What are the package compatibility considerations between these three parts?

A: The TZS4697-GS08 uses SOD-80 QuadroMELF packaging. The 1N4104UR-1 uses DO-213AA packaging, which has different footprint dimensions and requires PCB layout modification. The BZV55-B10,115 is specified in LLDS MiniMelf format with compatibility to SOD-80, DO-213AC, and MINI-MELF packages, offering greater layout flexibility.

Q: How do the reverse leakage characteristics differ among these parts?

A: The TZS4697-GS08 specifies 1 µA reverse leakage at 7.6 V. The 1N4104UR-1 provides 500 nA at 7.6 V, representing a 50% reduction. The BZV55-B10,115 delivers 200 nA at 7 V, the lowest leakage specification. Lower reverse leakage reduces standby current consumption in precision voltage reference applications.

Q: Which substitute part offers the best voltage regulation performance?

A: The BZV55-B10,115 provides ±2% zener voltage tolerance compared to ±5% for both the TZS4697-GS08 and 1N4104UR-1. This tighter tolerance improves voltage regulation accuracy in applications requiring precise reference voltages.

Q: Are there thermal performance differences between these parts?

A: All three parts are rated for 500 mW maximum power dissipation. The BZV55-B10,115 extends the upper operating temperature limit to 200°C versus 175°C for the other two parts, providing additional thermal margin in high-temperature environments.

Q: What inventory considerations should influence part selection?

A: The TZS4697-GS08 has 17,800 pieces in stock. The BZV55-B10,115 offers the largest inventory (352,780 pieces), supporting high-volume production with minimal supply risk. The 1N4104UR-1 has limited availability (910 pieces), which may constrain sustained production.

Q: Can the BZV55-B10,115 be used in place of the TZS4697-GS08 without PCB modification?

A: The BZV55-B10,115 LLDS MiniMelf package is compatible with SOD-80 footprints, enabling direct substitution without PCB layout changes. Verify specific package variant compatibility with your PCB design documentation.