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TZMB11-GS18 Equivalent & Substitute Parts
Part Overview
The TZMB11-GS18 is a Zener diode rated at 11 V nominal with 500 mW power dissipation, manufactured by Vishay General Semiconductor - Diodes Division. This surface mount component is specified in SOD-80 MiniMELF packaging and is qualified to AEC-Q101 automotive standards. The part is currently active in production with 1083 pieces in stock inventory.
Equivalent and substitute parts are identified when component availability is limited, supply chain disruptions occur, or when design flexibility permits selection from qualified alternatives that maintain identical or superior electrical and mechanical performance within specified operating parameters.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nominal) | 11 | V |
| Tolerance | ±2% | — |
| Power - Maximum | 500 | mW |
| Impedance (Maximum) | 20 | Ohms |
| Current - Reverse Leakage @ Vr | 100 | nA @ 8.2 V |
| Voltage - Forward (Maximum) @ If | 1.5 | V @ 200 mA |
| Operating Temperature Range | -65 to 175 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | — |
| Grade | Automotive | — |
| Qualification | AEC-Q101 | — |
Substitute Part Grouping Explanation
Substitution of the TZMB11-GS18 is determined by strict equivalence across the following critical parameters:
Electrical Equivalence Criteria:
- Zener voltage (nominal): 11 V
- Tolerance: ±2%
- Maximum power dissipation: 500 mW
- Maximum impedance: 20 Ohms
- Reverse leakage current: 100 nA @ specified voltage
- Forward voltage characteristics
Mechanical Equivalence Criteria:
- Package type: SOD-80 MiniMELF (DO-213AC)
- Mounting type: Surface Mount
- Operating temperature range: minimum -65°C to 175°C
Compliance Criteria:
- Automotive grade qualification (AEC-Q101)
- RoHS3 compliance
- REACH unaffected status
Substitute parts are grouped into two categories:
Parametric Equivalent (Direct Replacement): TZMB11-GS08 maintains identical electrical specifications and automotive qualification, differing only in tape reel configuration code.
Upgrade Alternatives (Functional Equivalents): BZV55-B11,115 and BZV55-B11,135 (NXP Semiconductors) meet all electrical and mechanical requirements with extended operating temperature range (-65°C to 200°C) and alternative packaging configuration (LLDS; MiniMelf).
Parameter Comparison
| Parameter | TZMB11-GS18 | TZMB11-GS08 | BZV55-B11,115 | BZV55-B11,135 |
|---|---|---|---|---|
| Manufacturer | Vishay | Vishay | NXP Semiconductors | NXP Semiconductors |
| Voltage - Zener (Nom) | 11 V | 11 V | 11 V | 11 V |
| Tolerance | ±2% | ±2% | ±2% | ±2% |
| Power - Max | 500 mW | 500 mW | 500 mW | 500 mW |
| Impedance (Max) | 20 Ohms | 20 Ohms | 20 Ohms | 20 Ohms |
| Current - Reverse Leakage @ Vr | 100 nA @ 8.2 V | 100 nA @ 8.2 V | 100 nA @ 8 V | 100 nA @ 8 V |
| Voltage - Forward (Max) @ If | 1.5 V @ 200 mA | 1.5 V @ 200 mA | 900 mV @ 10 mA | 900 mV @ 10 mA |
| Operating Temperature Range | -65°C to 175°C | -65°C to 175°C | -65°C to 200°C | -65°C to 200°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 |
| Grade | Automotive | Automotive | — | — |
| Qualification | AEC-Q101 | AEC-Q101 | — | — |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | — | — |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
| Inventory Status | 1083 Pcs | 17984 Pcs | 64745 Pcs | 30898 Pcs |
Engineering Selection Recommendations
TZMB11-GS08 Selection Rationale:
The TZMB11-GS08 is the primary parametric equivalent to the TZMB11-GS18. Both parts are manufactured by Vishay General Semiconductor - Diodes Division, carry identical electrical specifications, and hold AEC-Q101 automotive qualification. The difference between these part numbers reflects tape reel configuration only. Selection of TZMB11-GS08 is appropriate for applications requiring Vishay sourcing continuity or when existing supply chain relationships with Vishay are established. Inventory availability of 17984 pieces provides supply security.
BZV55-B11,115 and BZV55-B11,135 Selection Rationale:
The NXP Semiconductors BZV55-B11 series (variants ,115 and ,135) meet all electrical and mechanical requirements of the TZMB11-GS18. These parts provide extended operating temperature range to 200°C, which exceeds the TZMB11-GS18 specification of 175°C. Selection of NXP alternatives is appropriate when:
- Extended temperature performance is beneficial to system reliability
- Multi-source component strategy is required
- NXP supply chain relationships are preferred
- Higher inventory availability (64745 and 30898 pieces respectively) supports procurement timelines
Both NXP variants maintain REACH unaffected status. Automotive grade and AEC-Q101 qualification status are not specified for NXP parts in provided data; verification against application requirements is necessary if automotive qualification is mandatory.
Frequently Asked Questions (FAQ)
Q: Can TZMB11-GS08 be used as a direct replacement for TZMB11-GS18?
A: Yes. The TZMB11-GS08 is a parametric equivalent with identical electrical specifications, power rating, impedance, temperature range, and automotive qualification. The difference in part number reflects tape reel configuration only and does not affect component performance or functionality.
Q: What is the difference between the Vishay TZMB11 series and the NXP BZV55-B11 series?
A: Both series meet the 11 V nominal zener voltage, 500 mW power rating, and ±2% tolerance requirements. The primary differences are: (1) NXP parts offer extended operating temperature range to 200°C versus 175°C for Vishay; (2) Forward voltage characteristics differ at different test currents; (3) Automotive qualification status is specified for Vishay but not provided for NXP in available data.
Q: Are the NXP BZV55-B11,115 and BZV55-B11,135 variants interchangeable?
A: Yes. Both NXP variants maintain identical electrical specifications and package configuration. The difference in part number reflects internal packaging or reel configuration. Selection between these variants is determined by procurement or inventory requirements rather than electrical performance.
Q: Does package compatibility exist across all substitute parts?
A: Yes. All listed parts use SOD-80 MiniMELF (DO-213AC) surface mount packaging. PCB footprints and reflow soldering profiles are compatible across TZMB11-GS18, TZMB11-GS08, BZV55-B11,115, and BZV55-B11,135.
Q: What compliance certifications apply to each substitute part?
A: TZMB11-GS18 and TZMB11-GS08 carry AEC-Q101 automotive qualification and ROHS3 compliance. All four parts maintain REACH unaffected status. Automotive qualification status for NXP BZV55-B11 variants is not specified in provided documentation.
Q: Which substitute part offers the best inventory availability?
A: BZV55-B11,115 (NXP) provides the highest inventory with 64745 pieces in stock, followed by BZV55-B11,135 (30898 pieces) and TZMB11-GS08 (17984 pieces). The original TZMB11-GS18 has 1083 pieces available.
Q: Can substitution occur if the application requires AEC-Q101 qualification?
A: TZMB11-GS08 maintains AEC-Q101 qualification and is suitable for automotive applications requiring this certification. NXP BZV55-B11 variants do not specify AEC-Q101 qualification in provided data; confirmation of automotive qualification status is required before substitution in applications with this requirement.
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