TZM5259B-GS08 Equivalent & Substitute Parts

Part Overview

The TZM5259B-GS08 is a Zener diode manufactured by Vishay General Semiconductor - Diodes Division, rated at 39 V nominal with 500 mW power dissipation capability. This surface mount component operates across the temperature range of -65°C to 175°C and is packaged in SOD-80 MiniMELF format. The device is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1). Equivalent substitute parts are identified to support design flexibility, inventory management, and supply chain continuity for applications requiring 39 V Zener diodes with matching electrical specifications.

Substiute Parts

TZM5259B-GS08
Vishay General Semiconductor - Diodes DivisionIn Stock: 1026TZM5259B-GS08 Datasheet
TZM5259B-GS08
Current Part
BZV55-C39,115
NXP SemiconductorsIn Stock: 838039BZV55-C39,115 Datasheet
BZV55-C39,115
MFR Recommended

Key Parameters

Parameter Value Unit
Voltage - Zener (Nom) 39 V
Tolerance ±5% %
Power - Max 500 mW
Impedance (Max) 80 Ohms
Current - Reverse Leakage @ Vr 100 nA @ 30 V nA
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 200 mA V
Operating Temperature Range -65 to 175 °C
Mounting Type Surface Mount -
Package / Case DO-213AC, MINI-MELF, SOD-80 -
RoHS Status ROHS3 Compliant -
MSL Rating 1 (Unlimited) -

Substitute Part Grouping Explanation

Substitution of the TZM5259B-GS08 is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

  • Zener voltage rating: 39 V nominal with ±5% tolerance
  • Power dissipation capability: 500 mW maximum
  • Package format: SOD-80 MiniMELF (DO-213AC)
  • Mounting technology: Surface mount
  • Environmental compliance: ROHS3 and REACH status

Secondary Compatibility Factors:

  • Operating temperature range (minimum -65°C, maximum ≥175°C)
  • Reverse leakage current characteristics
  • Forward voltage characteristics
  • Impedance specifications

The BZV55-C39,115 manufactured by NXP Semiconductors meets all primary substitution criteria and maintains functional equivalence for 39 V Zener diode applications. Both devices share identical nominal voltage, power rating, tolerance, and physical package specifications. Differences in secondary parameters (impedance, leakage current, forward voltage) remain within acceptable ranges for standard circuit applications.

Parameter Comparison

Parameter TZM5259B-GS08 (Vishay) BZV55-C39,115 (NXP) Compatibility
Voltage - Zener (Nom) 39 V 39 V Equivalent
Tolerance ±5% ±5% Equivalent
Power - Max 500 mW 500 mW Equivalent
Impedance (Max) 80 Ohms 130 Ohms Compatible
Current - Reverse Leakage @ Vr 100 nA @ 30 V 50 nA @ 27.3 V Compatible
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 200 mA 900 mV @ 10 mA Compatible
Operating Temperature Range -65°C to 175°C -65°C to 200°C Compatible
Mounting Type Surface Mount Surface Mount Equivalent
Package / Case DO-213AC, MINI-MELF, SOD-80 DO-213AC, MINI-MELF, SOD-80 Equivalent
RoHS Status ROHS3 Compliant REACH Unaffected Compatible
MSL Rating 1 (Unlimited) 1 (Unlimited) Equivalent

Engineering Selection Recommendations

Primary Selection (TZM5259B-GS08): The Vishay TZM5259B-GS08 is the specified component for original design implementation. This device maintains active production status with ROHS3 compliance and established supply availability (972 pcs in stock). Selection of this part is appropriate for new designs and applications where Vishay component qualification is required.

Substitute Selection (BZV55-C39,115): The NXP BZV55-C39,115 serves as a direct functional equivalent for applications requiring component substitution. This device meets all critical electrical specifications (39 V, 500 mW, ±5% tolerance) and maintains identical physical packaging (SOD-80 MiniMELF). The extended operating temperature range (-65°C to 200°C) provides additional thermal margin compared to the primary part. NXP component qualification and REACH compliance status support use in regulated applications. Significantly higher inventory availability (837,966 pcs) supports rapid procurement for high-volume production or emergency supply situations.

Compliance Considerations: Both devices maintain ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1), supporting deployment in standard surface mount assembly processes without special handling requirements. The BZV55-C39,115 carries REACH Unaffected status, confirming regulatory compliance for European market applications.

Frequently Asked Questions (FAQ)

Q: Can the BZV55-C39,115 be used as a direct replacement for the TZM5259B-GS08 in existing designs?

A: Yes. Both devices share identical nominal Zener voltage (39 V), power rating (500 mW), tolerance (±5%), and physical package format (SOD-80 MiniMELF). The electrical characteristics remain compatible for standard circuit applications. No circuit modifications are required for substitution.

Q: What are the differences in impedance between these two devices?

A: The TZM5259B-GS08 specifies maximum impedance of 80 Ohms, while the BZV55-C39,115 specifies 130 Ohms maximum. This difference reflects manufacturing process variations between manufacturers but does not affect functional equivalence in typical Zener diode applications. Both values remain within acceptable ranges for voltage regulation and transient suppression circuits.

Q: Are there temperature range differences that affect substitution?

A: The BZV55-C39,115 operates across -65°C to 200°C, providing a 25°C higher maximum temperature rating compared to the TZM5259B-GS08 (-65°C to 175°C). This extended range offers additional thermal margin for high-temperature applications. For standard operating conditions within -65°C to 175°C, both devices perform equivalently.

Q: Do both devices require identical PCB footprints?

A: Yes. Both the TZM5259B-GS08 and BZV55-C39,115 use the DO-213AC MiniMELF package format with SOD-80 designation. PCB footprints, land patterns, and assembly processes remain identical. No layout modifications are necessary for component substitution.

Q: What is the reverse leakage current difference, and does it matter?

A: The TZM5259B-GS08 specifies 100 nA maximum reverse leakage at 30 V, while the BZV55-C39,115 specifies 50 nA maximum at 27.3 V. The NXP device exhibits lower leakage characteristics. For most applications, this difference is negligible. High-impedance circuits requiring minimal leakage current may benefit from the BZV55-C39,115 specification.

Q: Are both devices suitable for high-volume production?

A: Yes. Both devices maintain active production status with established supply chains. The BZV55-C39,115 offers significantly higher inventory availability (837,966 pcs versus 972 pcs), supporting large-scale manufacturing programs and reducing supply chain risk for extended production runs.

Q: Do these devices require different soldering or assembly processes?

A: No. Both devices use identical surface mount technology and MiniMELF packaging. Standard reflow soldering processes, thermal profiles, and assembly equipment apply to both components. No process modifications are required for substitution.

Q: What compliance certifications apply to both devices?

A: Both devices maintain ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1). The BZV55-C39,115 carries additional REACH Unaffected status. Both devices support deployment in regulated markets without special compliance considerations.

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