TWM5J560 Equivalent & Substitute Parts

Part Overview

The TWM5J560 is a 560 Ohm, 5W through-hole resistor manufactured by Ohmite with metal oxide film composition. This component is classified as obsolete, which necessitates identification of active equivalent parts for ongoing design and procurement requirements. The part features flame-proof and safety characteristics suitable for industrial and high-reliability applications requiring thermal stability across extended temperature ranges.

Substiute Parts

TWM5J560
OhmiteIn Stock: 814TWM5J560 Datasheet
TWM5J560
Current Part
TWM5J560E
OhmiteIn Stock: 912TWM5J560E Datasheet
TWM5J560E
Direct

Key Parameters

Parameter Value
Resistance 560 Ohms
Tolerance ±5%
Power Rating 5W
Composition Metal Oxide Film
Package Type Radial
Operating Temperature Range -55°C to 275°C
Temperature Coefficient ±350ppm/°C
Features Flame Proof, Safety
Dimensions 12.50mm L × 9.00mm W, 26.00mm Height (Seated)

Substitute Part Grouping Explanation

Substitution of the TWM5J560 is based on electrical and mechanical parameter equivalence within the TWM series. The substitute part TWM5J560E maintains identical electrical specifications: 560 Ohm resistance value, ±5% tolerance, 5W power rating, and metal oxide film composition. Mechanical compatibility is preserved through identical radial package configuration and physical dimensions (12.50mm × 9.00mm × 26.00mm seated height). Both parts operate across the same temperature range (-55°C to 275°C) with matching temperature coefficient (±350ppm/°C) and feature identical flame-proof and safety characteristics. The primary distinction is product status and compliance certification.

Parameter Comparison

Parameter TWM5J560 (Main) TWM5J560E (Substitute)
Manufacturer Ohmite Ohmite
Resistance 560 Ohms 560 Ohms
Tolerance ±5% ±5%
Power Rating 5W 5W
Composition Metal Oxide Film Metal Oxide Film
Package Radial Radial
Operating Temperature -55°C to 275°C -55°C to 275°C
Temperature Coefficient ±350ppm/°C ±350ppm/°C
Features Flame Proof, Safety Flame Proof, Safety
Dimensions 12.50mm L × 9.00mm W × 26.00mm H 12.50mm L × 9.00mm W × 26.00mm H
Product Status Obsolete Active
RoHS Compliance Non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The TWM5J560E is the direct functional equivalent for applications currently using the obsolete TWM5J560. Both parts are electrically and mechanically identical across all specified parameters. The TWM5J560E offers the advantage of active product status, ensuring continued availability and supply chain reliability. Additionally, the TWM5J560E meets ROHS3 compliance requirements, making it suitable for applications subject to environmental and regulatory restrictions. For new designs or component refresh cycles, the TWM5J560E is the appropriate selection based on product lifecycle and compliance status.

Frequently Asked Questions (FAQ)

Q: Can TWM5J560E be used as a direct replacement for TWM5J560? A: Yes. Both parts share identical electrical specifications (560 Ohms, ±5%, 5W), composition (metal oxide film), and mechanical configuration (radial package, 12.50mm × 9.00mm × 26.00mm). Pin-to-pin and footprint compatibility is maintained.

Q: What is the primary reason to transition from TWM5J560 to TWM5J560E? A: The TWM5J560 is classified as obsolete, while TWM5J560E maintains active product status. This ensures long-term component availability and supply chain continuity.

Q: Are there compliance differences between these parts? A: Yes. The TWM5J560E is ROHS3 compliant, whereas the TWM5J560 is non-compliant. For applications requiring environmental compliance certification, the TWM5J560E is required.

Q: Do these parts have identical thermal characteristics? A: Yes. Both parts operate across -55°C to 275°C with a temperature coefficient of ±350ppm/°C, ensuring equivalent performance in thermal cycling and high-temperature applications.

Q: Is the radial package configuration identical between both parts? A: Yes. Both parts use radial through-hole packaging with identical physical dimensions and seated height, ensuring compatibility with existing PCB layouts and assembly processes.

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