TUSB2551PW Equivalent & Substitute Parts

Part Overview

The TUSB2551PW is a USB 2.0 half-duplex transceiver IC manufactured by Texas Instruments, designed for interface applications requiring single driver/receiver functionality. This component operates across a wide supply voltage range of 1.65V to 3.6V and supports data rates up to 1.5Mbps. The device is currently classified as obsolete, which necessitates identification of active equivalent components to maintain design continuity and ensure long-term supply chain reliability.

Substiute Parts

TUSB2551PW

Texas InstrumentsIn Stock: 991TUSB2551PW Datasheet

Current PartRFQ

TUSB2551ARGTR

Texas InstrumentsIn Stock: 2007TUSB2551ARGTR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TUSB2551PW is determined by strict equivalence across the following critical parameters:

Protocol compatibility: USB 2.0 specification adherence Functional configuration: 1/3 driver/receiver, half-duplex operation Data rate: 1.5Mbps support Receiver hysteresis: 200 mV specification Operating temperature range: -40°C to 85°C Supply voltage compatibility: Overlap within specified ranges Regulatory compliance: ROHS3 and REACH status alignment Moisture sensitivity: MSL 1 classification

The TUSB2551ARGTR qualifies as a manufacturer-recommended substitute based on identical functional parameters and active product status. While the package format differs (16-VQFN versus 14-TSSOP), the electrical specifications and protocol implementation remain equivalent, enabling direct functional replacement in circuit designs.

Parameter Comparison

Engineering Selection Recommendations

The TUSB2551ARGTR is the manufacturer-recommended substitute for the obsolete TUSB2551PW. Selection of this component is justified by the following factors:

Active product status ensures ongoing availability and manufacturing support from Texas Instruments, eliminating supply chain risk associated with obsolete components.

Electrical parameter equivalence across protocol, data rate, duplex configuration, and operating temperature specifications confirms functional interchangeability.

ROHS3 compliance and MSL 1 classification maintain regulatory alignment and handling requirements consistent with the original component.

Supply voltage specification of 3.3V and 5V encompasses the operational range of the original part, ensuring compatibility with existing power supply designs.

Package format change from 14-TSSOP to 16-VQFN (3x3) requires PCB layout modification and footprint redesign. This is a mechanical consideration only and does not affect electrical functionality.

Frequently Asked Questions (FAQ)

Q: Can the TUSB2551ARGTR be used as a direct pin-for-pin replacement for the TUSB2551PW?

A: No. While electrically equivalent, the TUSB2551ARGTR uses a different package format (16-VQFN versus 14-TSSOP). Pin assignments differ, requiring PCB layout and schematic modifications. The component is functionally equivalent but not pin-compatible.

Q: What is the primary reason for substituting the TUSB2551PW?

A: The TUSB2551PW is classified as obsolete. The TUSB2551ARGTR is an active product from the same manufacturer with identical electrical specifications, ensuring long-term supply availability and manufacturing continuity.

Q: Are there differences in supply voltage requirements between these components?

A: The TUSB2551PW operates across 1.65V to 3.6V. The TUSB2551ARGTR is specified for 3.3V and 5V operation. Both ranges overlap at 3.3V, confirming compatibility within this common operating point. Designs operating at voltages below 3.3V require verification against the TUSB2551ARGTR datasheet.

Q: Do both components meet the same regulatory compliance standards?

A: Yes. Both the TUSB2551PW and TUSB2551ARGTR are ROHS3 compliant, REACH unaffected, and classified as MSL 1 (Unlimited moisture sensitivity level). Regulatory requirements are identical.

Q: What packaging format does the substitute component use?

A: The TUSB2551ARGTR is supplied in 16-VQFN (3x3) format with exposed pad, compared to the original 14-TSSOP (0.173", 4.40mm Width) package. This requires PCB footprint redesign and reflow profile adjustment during manufacturing transition.