TSW-150-26-L-D Equivalent & Substitute Parts

Part Overview

The TSW-150-26-L-D is an active rectangular connector header manufactured by Samtec Inc., designed for through-hole mounting applications. This vertical connector accommodates 100 positions across 2 rows with 0.100" (2.54mm) pitch spacing, suitable for board-to-board or cable interconnection. The part is ROHS3 compliant and maintains an operating temperature range of -55°C to 125°C. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate specific application requirements while maintaining electrical and mechanical compatibility.

Substiute Parts

TSW-150-26-L-D
Samtec Inc.In Stock: 807TSW-150-26-L-D Datasheet
TSW-150-26-L-D
Current Part
HTSW-150-26-L-D
Samtec Inc.In Stock: 1057HTSW-150-26-L-D Datasheet
HTSW-150-26-L-D
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Key Parameters

Parameter Value
Connector Type Header
Contact Type Male Pin
Number of Positions 100
Number of Rows 2
Pitch - Mating 0.100" (2.54mm)
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Contact Length - Mating 0.230" (5.84mm)
Contact Length - Post 0.126" (3.20mm)
Overall Contact Length 0.456" (11.58mm)
Insulation Height 0.100" (2.54mm)
Contact Shape Square
Contact Finish - Mating Gold
Contact Finish - Post Tin
Contact Material Phosphor Bronze
Operating Temperature -55°C ~ 125°C
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the TSW-150-26-L-D is determined by strict alignment of critical electrical and mechanical parameters. The following parameters must match identically for a part to function as a direct substitute:

  • Connector Type: Header
  • Contact Type: Male Pin
  • Number of Positions: 100
  • Number of Rows: 2
  • Pitch - Mating: 0.100" (2.54mm)
  • Row Spacing - Mating: 0.100" (2.54mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Length - Mating: 0.230" (5.84mm)
  • Contact Length - Post: 0.126" (3.20mm)
  • Overall Contact Length: 0.456" (11.58mm)
  • Insulation Height: 0.100" (2.54mm)
  • Contact Shape: Square
  • Contact Finish - Mating: Gold
  • Contact Finish - Post: Tin
  • Contact Material: Phosphor Bronze
  • Operating Temperature: -55°C ~ 125°C
  • Material Flammability Rating: UL94 V-0

The HTSW-150-26-L-D meets all critical substitution criteria and is classified as a direct equivalent part.

Parameter Comparison

Parameter TSW-150-26-L-D HTSW-150-26-L-D
Manufacturer Samtec Inc. Samtec Inc.
Series TSW HTSW
Product Status Active Active
Connector Type Header Header
Contact Type Male Pin Male Pin
Number of Positions 100 100
Number of Rows 2 2
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Row Spacing - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Mounting Type Through Hole Through Hole
Termination Solder Solder
Contact Length - Mating 0.230" (5.84mm) 0.230" (5.84mm)
Contact Length - Post 0.126" (3.20mm) 0.126" (3.20mm)
Overall Contact Length 0.456" (11.58mm) 0.456" (11.58mm)
Insulation Height 0.100" (2.54mm) 0.100" (2.54mm)
Contact Shape Square Square
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Finish - Post Tin Tin
Contact Material Phosphor Bronze Phosphor Bronze
Insulation Material Polybutylene Terephthalate (PBT) Liquid Crystal Polymer (LCP)
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C
Material Flammability Rating UL94 V-0 UL94 V-0
Insulation Color Black Natural
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) Not Applicable
ECCN EAR99 EAR99
HTSUS 8536.69.4040 8536.69.4040

Engineering Selection Recommendations

Both the TSW-150-26-L-D and HTSW-150-26-L-D are active products manufactured by Samtec Inc. and maintain identical electrical and mechanical specifications for mating and post contact dimensions, pitch spacing, and operating temperature range. Both parts are ROHS3 compliant and carry UL94 V-0 flammability ratings.

The primary difference between these parts is the insulation material composition: the TSW-150-26-L-D uses Polybutylene Terephthalate (PBT), while the HTSW-150-26-L-D uses Liquid Crystal Polymer (LCP). This material distinction does not affect the core electrical or mechanical compatibility for standard through-hole solder applications. Selection between these parts should be based on specific application requirements related to insulation material properties and availability.

Frequently Asked Questions (FAQ)

Q: Can the HTSW-150-26-L-D be used as a direct replacement for the TSW-150-26-L-D?

A: Yes. Both parts share identical contact dimensions, pitch spacing, row configuration, mounting type, and operating temperature range. The insulation material differs (LCP versus PBT), but this does not affect electrical or mechanical compatibility for standard board-to-board or cable interconnection applications.

Q: What are the critical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by matching: connector type, contact type, number of positions and rows, mating pitch, row spacing, contact dimensions (mating and post lengths), insulation height, contact shape, contact finish specifications, contact material, operating temperature range, and flammability rating.

Q: Does the insulation material difference affect performance?

A: The insulation material difference between PBT and LCP does not affect the electrical or mechanical performance of the connector in standard applications. Both materials meet UL94 V-0 flammability requirements and operate across the same temperature range.

Q: Are both parts RoHS compliant?

A: Yes. Both the TSW-150-26-L-D and HTSW-150-26-L-D are ROHS3 compliant and carry EAR99 ECCN classification.

Q: What is the difference in moisture sensitivity between these parts?

A: The TSW-150-26-L-D has a Moisture Sensitivity Level (MSL) of 1 (Unlimited), while the HTSW-150-26-L-D is listed as Not Applicable. This reflects differences in packaging and handling requirements, but does not affect the connector's functional performance in the application.

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