TSW-114-14-S-D Equivalent & Substitute Parts

Part Overview

The TSW-114-14-S-D is a rectangular connector header manufactured by Samtec Inc., designed for through-hole board-to-board or cable applications. This vertical header features 28 positions arranged in 2 rows with 0.100" (2.54mm) pitch spacing. The connector is currently in active product status with full inventory availability.

Substitute parts become necessary when the primary part reaches end-of-life status, when design requirements shift toward different position counts or mechanical configurations, or when supply chain constraints require alternative sourcing from qualified manufacturers.

Substiute Parts

TSW-114-14-S-D
Samtec Inc.In Stock: 1101TSW-114-14-S-D Datasheet
TSW-114-14-S-D
Current Part
4-102973-0
TE Connectivity AMP ConnectorsIn Stock: 18614-102973-0 Datasheet
4-102973-0
MFR Recommended

Key Parameters

Parameter Value
Connector Type Header
Contact Type Male Pin
Pitch - Mating 0.100" (2.54mm)
Number of Positions 28
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Contact Finish - Mating Gold
Insulation Material Polybutylene Terephthalate (PBT)
Operating Temperature -55°C ~ 125°C
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the TSW-114-14-S-D is determined by the following critical parameters:

  • Pitch spacing: 0.100" (2.54mm) mating pitch is mandatory for mechanical and electrical compatibility
  • Row configuration: 2-row arrangement with 0.100" row spacing
  • Contact type: Male pin headers for board-to-board or cable connections
  • Mounting method: Through-hole solder termination
  • Shrouding: Unshrouded design
  • Contact finish: Gold-plated mating surface

The substitute part 4-102973-0 (TE Connectivity AMP Connectors AMPMODU Mod II series) shares the core pitch and row spacing specifications. However, this substitute differs significantly in position count (80 positions versus 28 positions), insulation material composition, contact finish thickness specifications, and operating temperature range. These differences indicate that direct one-to-one substitution is not applicable for applications requiring the exact 28-position configuration.

Parameter Comparison

Parameter TSW-114-14-S-D (Samtec) 4-102973-0 (TE Connectivity)
Manufacturer Samtec Inc. TE Connectivity AMP Connectors
Series TSW AMPMODU Mod II
Product Status Active Obsolete
Connector Type Header Header, Breakaway
Contact Type Male Pin Male Pin
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Number of Positions 28 80
Number of Rows 2 2
Row Spacing - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Mounting Type Through Hole Through Hole
Termination Solder Solder
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 15.0µin (0.38µm)
Insulation Material Polybutylene Terephthalate (PBT) Thermoplastic
Operating Temperature -55°C ~ 125°C -65°C ~ 105°C
Material Flammability Rating UL94 V-0 UL94 V-0
RoHS Status ROHS3 Compliant RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

The TSW-114-14-S-D maintains active product status with ROHS3 compliance and current manufacturing availability. The substitute part 4-102973-0 carries obsolete product status and RoHS non-compliance, which restricts its use in applications subject to regulatory requirements or long-term supply chain planning.

Position count disparity (28 versus 80) represents a fundamental design difference. Selection between these parts must align with the specific application's connector interface requirements. The TSW-114-14-S-D is appropriate for applications requiring exactly 28 positions. The 4-102973-0 is suitable only for applications designed around 80-position configurations and where RoHS non-compliance is acceptable.

Operating temperature range differences (-55°C to 125°C for TSW-114-14-S-D versus -65°C to 105°C for 4-102973-0) must be evaluated against application thermal requirements. Contact finish thickness variation (30.0µin versus 15.0µin) affects contact durability and mating cycle performance.

Frequently Asked Questions (FAQ)

Q: Can the 4-102973-0 directly replace the TSW-114-14-S-D in existing designs?

A: No. The 4-102973-0 has 80 positions compared to the 28 positions of the TSW-114-14-S-D. Direct substitution is not possible without redesigning the mating interface and PCB layout.

Q: What makes these parts substitutable despite position count differences?

A: Both parts share identical mating pitch (0.100"), row spacing (0.100"), mounting method (through-hole solder), and contact type (male pin header). These parameters define the fundamental connector family. However, position count is an application-specific parameter that must match the design requirement.

Q: Are there compliance concerns with the 4-102973-0?

A: Yes. The 4-102973-0 is RoHS non-compliant and carries obsolete product status. Applications subject to RoHS directives or requiring long-term component availability should prioritize the active, compliant TSW-114-14-S-D.

Q: How do contact finish thickness differences affect performance?

A: The TSW-114-14-S-D provides 30.0µin gold plating on mating contacts compared to 15.0µin on the 4-102973-0. Thicker plating generally provides extended mating cycle life and improved corrosion resistance in demanding environments.

Q: What is the significance of the breakaway feature on the 4-102973-0?

A: The breakaway feature allows individual connector sections to be separated from the main header assembly. This design characteristic is specific to the AMPMODU Mod II series and is not present on the TSW series.

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