TSW-113-17-S-D Equivalent & Substitute Parts

Part Overview

The TSW-113-17-S-D is a rectangular connector header manufactured by Samtec Inc., designed for through-hole mounting applications. This vertical header connector features 26 positions arranged in 2 rows with 0.100" (2.54mm) pitch spacing, suitable for board-to-board or cable interconnections. The part is currently active in production with full inventory availability. Identifying equivalent substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate alternative sourcing requirements while maintaining electrical and mechanical compatibility.

Substiute Parts

TSW-113-17-S-D
Samtec Inc.In Stock: 912TSW-113-17-S-D Datasheet
TSW-113-17-S-D
Current Part
HTSW-113-17-S-D
Samtec Inc.In Stock: 946HTSW-113-17-S-D Datasheet
HTSW-113-17-S-D
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Key Parameters

Parameter Value
Connector Type Header
Contact Type Male Pin
Number of Positions 26
Number of Rows 2
Pitch - Mating 0.100" (2.54mm)
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Contact Length - Mating 0.620" (15.75mm)
Contact Length - Post 0.110" (2.79mm)
Overall Contact Length 0.830" (21.08mm)
Insulation Height 0.100" (2.54mm)
Contact Shape Square
Contact Finish - Mating Gold
Contact Finish - Post Tin
Contact Material Phosphor Bronze
Operating Temperature Range -55°C ~ 125°C
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the TSW-113-17-S-D is determined by strict alignment of the following critical parameters:

  • Connector Type & Contact Configuration: Header with male pin contacts
  • Position Count & Row Configuration: 26 positions in 2-row arrangement
  • Pitch Specifications: 0.100" (2.54mm) mating pitch and row spacing
  • Mounting & Termination: Through-hole solder termination
  • Contact Dimensions: Mating contact length of 0.620" (15.75mm) and post length of 0.110" (2.79mm)
  • Contact Finish: Gold-plated mating surface with tin-plated posts
  • Contact Material: Phosphor bronze construction
  • Operating Temperature: -55°C ~ 125°C range
  • Compliance: UL94 V-0 flammability rating and ROHS3 compliance

The HTSW-113-17-S-D meets all critical substitution criteria. Variations in insulation material (LCP versus PBT) and insulation color do not affect electrical or mechanical compatibility for standard interconnection applications.

Parameter Comparison

Parameter TSW-113-17-S-D HTSW-113-17-S-D Compatibility
Manufacturer Samtec Inc. Samtec Inc. Match
Connector Type Header Header Match
Contact Type Male Pin Male Pin Match
Number of Positions 26 26 Match
Number of Rows 2 2 Match
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) Match
Row Spacing - Mating 0.100" (2.54mm) 0.100" (2.54mm) Match
Mounting Type Through Hole Through Hole Match
Termination Solder Solder Match
Contact Length - Mating 0.620" (15.75mm) 0.620" (15.75mm) Match
Contact Length - Post 0.110" (2.79mm) 0.110" (2.79mm) Match
Overall Contact Length 0.830" (21.08mm) 0.830" (21.08mm) Match
Insulation Height 0.100" (2.54mm) 0.100" (2.54mm) Match
Contact Shape Square Square Match
Contact Finish - Mating Gold Gold Match
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) Match
Contact Finish - Post Tin Tin Match
Contact Material Phosphor Bronze Phosphor Bronze Match
Insulation Material Polybutylene Terephthalate (PBT) Liquid Crystal Polymer (LCP) Functionally Equivalent
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C Match
Material Flammability Rating UL94 V-0 UL94 V-0 Match
RoHS Status ROHS3 Compliant ROHS3 Compliant Match
Product Status Active Active Match

Engineering Selection Recommendations

Both the TSW-113-17-S-D and HTSW-113-17-S-D are active production parts from Samtec Inc. with full ROHS3 compliance and UL94 V-0 flammability certification. The parts are electrically and mechanically interchangeable for standard through-hole solder applications requiring 26-position, 2-row header connectors with 0.100" pitch spacing.

The primary distinction between these parts is the insulation material composition: the TSW series uses polybutylene terephthalate (PBT), while the HTSW series uses liquid crystal polymer (LCP). Both materials meet the specified operating temperature range of -55°C to 125°C and flammability requirements. Material selection should be based on application-specific environmental conditions and mechanical requirements.

Frequently Asked Questions (FAQ)

Q: Are TSW-113-17-S-D and HTSW-113-17-S-D directly interchangeable?

A: Yes. Both parts share identical electrical and mechanical specifications including connector type, position count, pitch spacing, contact dimensions, contact finishes, and operating temperature range. They are suitable for direct substitution in through-hole solder applications.

Q: What is the difference between PBT and LCP insulation materials?

A: PBT (polybutylene terephthalate) and LCP (liquid crystal polymer) are both thermoplastic materials meeting UL94 V-0 flammability standards. LCP offers superior dimensional stability and lower moisture absorption compared to PBT. Material selection depends on specific application requirements for thermal cycling, humidity exposure, and mechanical stress.

Q: Do these connectors require mating with specific receptacle types?

A: These are header connectors with male pin contacts. They mate with receptacle connectors or sockets designed for 0.100" (2.54mm) pitch, 26-position, 2-row configurations. Mating component specifications must match the contact pitch, row spacing, and position count.

Q: Are there any compliance or certification differences between these parts?

A: Both parts are ROHS3 compliant, UL94 V-0 rated, and carry EAR99 ECCN classification. Compliance profiles are identical.

Q: What is the moisture sensitivity level for these connectors?

A: The TSW-113-17-S-D has MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. The HTSW-113-17-S-D is listed as Not Applicable for MSL, which is consistent with through-hole solder termination components that do not require moisture-controlled storage.

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