TSW-103-09-S-D-RA Equivalent & Substitute Parts

Part Overview

The TSW-103-09-S-D-RA is an active rectangular connector header manufactured by Samtec Inc. This through-hole, right-angle connector features 6 positions across 2 rows with 0.100" (2.54mm) pitch spacing. The connector is designed for board-to-board or cable applications with solder termination and push-pull fastening. Finding equivalent and substitute parts is necessary when managing inventory constraints, ensuring supply chain continuity, or matching specific application requirements within compatible electrical and mechanical parameters.

Substiute Parts

TSW-103-09-S-D-RA

Samtec Inc.In Stock: 1203TSW-103-09-S-D-RA Datasheet

Current PartRFQ

HTSW-103-09-S-D-RA

Samtec Inc.In Stock: 1037HTSW-103-09-S-D-RA Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TSW-103-09-S-D-RA is determined by strict alignment of the following critical parameters:

• Pitch - Mating: 0.100" (2.54mm)
• Number of Positions: 6
• Number of Rows: 2
• Row Spacing - Mating: 0.100" (2.54mm)
• Connector Type: Header
• Contact Type: Male Pin
• Mounting Type: Through Hole, Right Angle
• Termination: Solder
• Fastening Type: Push-Pull
• Contact Finish - Mating: Gold
• Contact Material: Phosphor Bronze
• Operating Temperature: -55°C ~ 125°C
• Material Flammability Rating: UL94 V-0
• RoHS Status: ROHS3 Compliant

The HTSW-103-09-S-D-RA meets all critical substitution criteria. Variations in insulation material (LCP versus PBT) and insulation height (0.240" versus 0.219") are within acceptable tolerance ranges for this connector category and do not affect functional compatibility in standard board-to-board applications.

Parameter Comparison

Engineering Selection Recommendations

Both the TSW-103-09-S-D-RA and HTSW-103-09-S-D-RA are active products from Samtec Inc. with identical ROHS3 compliance and UL94 V-0 flammability ratings. The primary differences are insulation material composition and color. The TSW series uses PBT insulation, while the HTSW series uses LCP insulation. Both materials meet the same operating temperature range and flammability standards. Selection between these parts should be based on specific application requirements regarding insulation material properties and inventory availability.

Frequently Asked Questions (FAQ)

Q: Can the HTSW-103-09-S-D-RA be used as a direct replacement for the TSW-103-09-S-D-RA?

A: Yes. Both connectors share identical pitch spacing (0.100"), position count (6), row configuration (2 rows), mounting type (through-hole right-angle), and contact specifications. The insulation material difference (LCP versus PBT) does not affect functional compatibility in standard board-to-board applications.

Q: What is the significance of the insulation material difference?

A: The TSW-103-09-S-D-RA uses Polybutylene Terephthalate (PBT), while the HTSW-103-09-S-D-RA uses Liquid Crystal Polymer (LCP). Both materials are UL94 V-0 rated and operate across the same temperature range (-55°C to 125°C). LCP offers superior dimensional stability and lower moisture absorption compared to PBT. Selection depends on application-specific environmental and mechanical requirements.

Q: Are there any mechanical compatibility concerns due to the insulation height difference?

A: The insulation height difference (0.219" for TSW versus 0.240" for HTSW) is within standard tolerance ranges for this connector category. This variation does not affect mating compatibility or board-level integration in typical applications.

Q: Do both parts have the same compliance certifications?

A: Yes. Both the TSW-103-09-S-D-RA and HTSW-103-09-S-D-RA are ROHS3 compliant, UL94 V-0 rated, and classified under the same ECCN (EAR99) and HTSUS (8536.69.4040) codes.

Q: What factors should determine which part to select?

A: Selection should be based on insulation material requirements, color preference, and current inventory availability. Both parts are active products with equivalent electrical and mechanical performance for standard board-to-board connector applications.