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TSM60NB900CP ROG Equivalent & Substitute Parts
Part Overview
The TSM60NB900CP ROG is an N-Channel 600V 4A MOSFET manufactured by Taiwan Semiconductor Corporation in TO-252 (DPAK) surface mount packaging. This device is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing production and maintenance applications. The part operates across a temperature range of -55°C to 150°C with a maximum power dissipation of 36.8W and is RoHS3 compliant with MSL 3 rating.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| FET Type | N-Channel | — |
| Drain to Source Voltage (Vdss) | 600 | V |
| Continuous Drain Current (Id) @ 25°C | 4 | A |
| Rds On (Max) @ Id, Vgs | 900 mOhm @ 1.2A, 10V | — |
| Gate Threshold Voltage (Vgs(th)) @ Id | 4 | V @ 250µA |
| Gate Charge (Qg) @ Vgs | 9.6 | nC @ 10V |
| Input Capacitance (Ciss) @ Vds | 315 | pF @ 100V |
| Power Dissipation (Max) | 36.8 | W |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | TO-252 (DPAK) | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution of the TSM60NB900CP ROG is determined by the following critical parameters: FET type (N-Channel), drain-source voltage rating (600V minimum), continuous drain current capability (4A minimum), package compatibility (TO-252/DPAK), and operating temperature range (-55°C to 150°C). Parts are grouped into three categories based on parametric alignment:
Parametric Equivalent: Parts with identical electrical specifications and the same package type, differing only in packaging format (Cut Tape vs. Tape & Reel).
Direct Manufacturer Substitute: Parts from alternative manufacturers with equivalent or superior electrical performance, same package type, and active product status.
Similar Substitute: Parts with comparable core specifications but variations in secondary parameters such as gate charge, input capacitance, or power dissipation that may affect circuit performance in specific applications.
Parameter Comparison
| Parameter | TSM60NB900CP ROG | TSM60NB900CP (TR) | IPD60R950C6ATMA1 | R6004ENDTL | SPD04N50C3ATMA1 | STD8N80K5 |
|---|---|---|---|---|---|---|
| Manufacturer | Taiwan Semiconductor | Taiwan Semiconductor | Infineon Technologies | Rohm Semiconductor | Infineon Technologies | STMicroelectronics |
| FET Type | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel |
| Vdss (V) | 600 | 600 | 600 | 600 | 500 | 800 |
| Id @ 25°C (A) | 4 | 4 | 4.4 | 4 | 4.5 | 6 |
| Rds On (Max) @ 10V (mOhm) | 900 @ 1.2A | 900 @ 1.2A | 950 @ 1.5A | 980 @ 1.5A | 950 @ 2.8A | 950 @ 3A |
| Vgs(th) (V) | 4 @ 250µA | 4 @ 250µA | 3.5 @ 130µA | 4 @ 1mA | 3.9 @ 200µA | 5 @ 100µA |
| Gate Charge Qg (nC) | 9.6 @ 10V | 9.6 @ 10V | 13 @ 10V | 15 @ 10V | 22 @ 10V | 16.5 @ 10V |
| Ciss (pF) | 315 @ 100V | 315 @ 100V | 280 @ 100V | 250 @ 25V | 470 @ 25V | 450 @ 100V |
| Power Dissipation (W) | 36.8 | 36.8 | 37 | 20 | 50 | 110 |
| Operating Temp Range (°C) | -55 to 150 | -55 to 150 | -55 to 150 | to 150 | -55 to 150 | -55 to 150 |
| Package | TO-252 (DPAK) | TO-252 (DPAK) | TO-252 (DPAK) | TO-252 (DPAK) | TO-252 (DPAK) | TO-252 (DPAK) |
| Product Status | Obsolete | Active | Active | Active | Not For New Designs | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
TSM60NB900CP (Tape & Reel Format): This parametric equivalent offers identical electrical specifications to the original part with active product status. Selection is appropriate for direct replacement in existing designs where packaging format change from Cut Tape to Tape & Reel is acceptable. RoHS3 compliance and operating temperature range are maintained.
IPD60R950C6ATMA1 (Infineon CoolMOS™ C6): This direct substitute provides superior current capability (4.4A vs. 4A) and equivalent voltage rating (600V). Active product status and lower moisture sensitivity level (MSL 1 vs. MSL 3) support long-term supply chain stability. Gate charge is slightly elevated (13 nC vs. 9.6 nC), resulting in marginally higher switching losses. Input capacitance is reduced (280 pF vs. 315 pF), improving switching speed. Power dissipation is comparable (37W vs. 36.8W).
R6004ENDTL (Rohm Semiconductor): This similar substitute maintains 600V/4A specifications with active product status. Power dissipation is significantly reduced (20W vs. 36.8W), indicating improved thermal efficiency. Gate charge is elevated (15 nC vs. 9.6 nC). Input capacitance is lower (250 pF vs. 315 pF). Operating temperature maximum is specified at 150°C without lower bound documentation. MSL 1 rating provides superior moisture handling.
SPD04N50C3ATMA1 (Infineon CoolMOS™): This similar substitute operates at reduced voltage rating (500V vs. 600V) and is designated "Not For New Designs," limiting suitability for new applications. Current capability is superior (4.5A vs. 4A). Gate charge is significantly elevated (22 nC vs. 9.6 nC), increasing switching losses. Input capacitance is substantially higher (470 pF vs. 315 pF), reducing switching speed. Power dissipation is elevated (50W vs. 36.8W). Selection is restricted to legacy system maintenance where 500V rating is acceptable.
STD8N80K5 (STMicroelectronics SuperMESH5™): This similar substitute provides elevated voltage rating (800V vs. 600V) and superior current capability (6A vs. 4A). Active product status supports supply continuity. Gate charge is elevated (16.5 nC vs. 9.6 nC). Input capacitance is higher (450 pF vs. 315 pF). Power dissipation is substantially increased (110W vs. 36.8W), requiring thermal management evaluation. Selection is appropriate for applications requiring higher voltage or current margins.
Frequently Asked Questions (FAQ)
Q: Can TSM60NB900CP ROG be directly replaced with TSM60NB900CP in Tape & Reel format?
A: Yes. Both parts are manufactured by Taiwan Semiconductor Corporation with identical electrical specifications, operating temperature range, and RoHS3 compliance. The difference is packaging format: Cut Tape (CT) & Digi-Reel® versus Tape & Reel (TR). Electrical performance and pin configuration are unchanged.
Q: What is the primary advantage of IPD60R950C6ATMA1 over the original TSM60NB900CP ROG?
A: The IPD60R950C6ATMA1 offers active product status with established long-term availability, superior current rating (4.4A vs. 4A), and lower moisture sensitivity level (MSL 1 vs. MSL 3). These factors support supply chain reliability and reduced handling requirements. Gate charge is slightly higher, resulting in marginally increased switching losses in high-frequency applications.
Q: Is R6004ENDTL suitable for high-power applications?
A: R6004ENDTL has reduced power dissipation capability (20W vs. 36.8W) compared to the original part. Applications requiring sustained power dissipation above 20W require thermal analysis or selection of alternatives with higher power ratings such as STD8N80K5 (110W) or SPD04N50C3ATMA1 (50W).
Q: Why is SPD04N50C3ATMA1 marked "Not For New Designs"?
A: SPD04N50C3ATMA1 carries this designation due to reduced voltage rating (500V vs. 600V) and elevated gate charge (22 nC vs. 9.6 nC), which increase switching losses and thermal stress. This part is retained for legacy system support only. New designs should select alternatives with active status such as IPD60R950C6ATMA1 or TSM60NB900CP (TR).
Q: Can STD8N80K5 be used in applications designed for 600V operation?
A: STD8N80K5 has an 800V rating, which exceeds the 600V requirement. The part is electrically compatible and provides voltage margin. However, elevated gate charge (16.5 nC vs. 9.6 nC) and input capacitance (450 pF vs. 315 pF) increase switching losses and may require gate driver adjustment. Power dissipation is substantially higher (110W vs. 36.8W), requiring thermal management evaluation.
Q: Are all substitute parts available in TO-252 (DPAK) package?
A: Yes. All substitute parts listed are available in TO-252 (DPAK) surface mount package, ensuring mechanical and thermal interface compatibility with the original TSM60NB900CP ROG.
Q: What is the significance of MSL rating differences between parts?
A: MSL 3 (TSM60NB900CP ROG) requires storage at controlled humidity with a 168-hour shelf life limit before reflow. MSL 1 parts (IPD60R950C6ATMA1, R6004ENDTL, SPD04N50C3ATMA1, STD8N80K5) have unlimited shelf life and reduced moisture sensitivity, lowering handling and storage costs in manufacturing environments.
Q: Which substitute part provides the closest electrical match to TSM60NB900CP ROG?
A: TSM60NB900CP (Tape & Reel format) provides identical electrical specifications. For alternative manufacturers, IPD60R950C6ATMA1 offers the closest match with equivalent 600V/4A+ ratings, comparable power dissipation (37W vs. 36.8W), and active product status.
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