TSM500N03CP ROG MOSFET N-Channel 30V 12.5A Equivalent & Substitute Parts

Part Overview

The TSM500N03CP ROG is an N-Channel MOSFET manufactured by Taiwan Semiconductor Corporation, rated for 30V drain-to-source voltage with 12.5A continuous drain current in a Surface Mount TO-252 (DPAK) package. This device is classified as obsolete, making identification of equivalent substitute parts necessary for ongoing design support and procurement continuity. The part operates at a maximum junction temperature of 150°C and complies with RoHS3 and REACH standards.

Substiute Parts

TSM500N03CP ROG

Taiwan Semiconductor CorporationIn Stock: 33270TSM500N03CP ROG Datasheet

Current PartRFQ

DMN3016LK3-13

Diodes IncorporatedIn Stock: 30777DMN3016LK3-13 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TSM500N03CP ROG is determined by strict equivalence across the following critical electrical and mechanical parameters:

Electrical Equivalence Criteria:

• Drain-to-Source Voltage (Vdss): Must equal 30V
• Continuous Drain Current (Id): Must be within the operating range of 12.4A to 12.5A
• On-State Resistance (Rds On): Must support the same voltage and current switching characteristics
• Gate Threshold Voltage (Vgs(th)): Must fall within acceptable gate drive voltage ranges
• Maximum Operating Temperature: Must support 150°C junction temperature operation

Mechanical Equivalence Criteria:

• Package Type: Must be TO-252-3 (DPAK) Surface Mount
• Pin Configuration: Must maintain 2 Leads + Tab configuration
• Mounting Type: Must be Surface Mount compatible with existing PCB layouts

The substitute part DMN3016LK3-13 manufactured by Diodes Incorporated meets these criteria with matching Vdss (30V), equivalent continuous drain current (12.4A), identical package type (TO-252-3), and compatible operating temperature range (-55°C to 150°C).

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute: DMN3016LK3-13

The DMN3016LK3-13 is the qualified substitute for the obsolete TSM500N03CP ROG based on the following factors:

Compliance and Regulatory Status: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory continuity in applications subject to environmental standards. The substitute part carries active product status from Diodes Incorporated, providing long-term availability and manufacturing support.

Electrical Compatibility: The substitute part maintains identical Vdss (30V) and equivalent continuous drain current (12.4A versus 12.5A), ensuring compatibility with existing circuit designs. Both devices operate within the same gate voltage range (±20V) and support identical drive voltage levels (4.5V and 10V).

Mechanical Compatibility: Both parts utilize the TO-252-3 (DPAK) Surface Mount package with identical pin configuration (2 Leads + Tab), enabling direct PCB layout compatibility without redesign.

Temperature Operating Range: The substitute part supports the full operating temperature range of the original part, with extended lower temperature capability (-55°C to 150°C versus 150°C maximum for the original).

Packaging and Handling: Both parts maintain MSL 1 (Unlimited) moisture sensitivity level, requiring identical storage and handling procedures.

Frequently Asked Questions (FAQ)

Q: Can the DMN3016LK3-13 be used as a direct replacement for the TSM500N03CP ROG?

A: Yes. Both parts share identical Vdss (30V), equivalent continuous drain current ratings (12.4A versus 12.5A), matching package type (TO-252-3 DPAK), and compatible operating temperature ranges. The substitute part is electrically and mechanically compatible for direct substitution.

Q: What are the key differences between these two parts?

A: The primary differences are manufacturer (Taiwan Semiconductor Corporation versus Diodes Incorporated) and product status (obsolete versus active). The DMN3016LK3-13 exhibits lower on-state resistance (12 mOhm @ 11A, 10V versus 50 mOhm @ 8A, 10V), lower gate threshold voltage (2.3V versus 3V), and higher input capacitance (1415 pF @ 15V versus 270 pF @ 25V). The substitute part also provides extended lower temperature operation (-55°C minimum).

Q: Are there any package compatibility concerns?

A: No. Both parts use the TO-252-3 (DPAK) Surface Mount package with identical pin configuration. Existing PCB layouts require no modification for substitution.

Q: Do both parts meet the same regulatory standards?

A: Yes. Both the TSM500N03CP ROG and DMN3016LK3-13 are ROHS3 compliant and REACH unaffected, maintaining identical regulatory status for applications subject to environmental standards.

Q: What is the moisture sensitivity level for both parts?

A: Both parts carry MSL 1 (Unlimited) moisture sensitivity level, requiring identical storage, handling, and reflow procedures.

Q: Can the substitute part handle the same power dissipation?

A: The substitute part is rated for 1.6W (Ta) maximum power dissipation compared to 12.5W (Tc) for the original part. Power dissipation capability depends on thermal management conditions and application-specific thermal design. Circuit designers must evaluate thermal requirements based on actual operating conditions.

Q: What is the availability status of each part?

A: The TSM500N03CP ROG is classified as obsolete with 33,188 pieces in stock. The DMN3016LK3-13 is active product with 30,700 pieces in stock, providing long-term procurement continuity.