Equivalent & Substitute Parts Reference: TSM3N100CP ROG

Part Overview

TSM3N100CP ROG is an N-Channel MOSFET with a rated drain-to-source voltage of 1000V and a continuous drain current of 2.5A, presented in a surface-mount TO-252 (DPAK) package. The part is currently discontinued at Digi-Key, though some inventory remains. Due to its discontinuation, it is necessary to identify substitute models that closely match its electrical and mechanical specifications for ongoing designs or replacement needs within the transistors, FETs, MOSFETs category.

Substiute Parts

TSM3N100CP ROG

Taiwan Semiconductor CorporationIn Stock: 799TSM3N100CP ROG Datasheet

Current PartRFQ

STD3NK100Z

STMicroelectronicsIn Stock: 5223STD3NK100Z Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution is strictly based on matching the core electrical and mechanical parameters: FET type, technology, Drain-to-Source Voltage (Vdss), Continuous Drain Current (Id) at 25°C, Drive Voltage, Rds On (Max), Vgs(th) (Max), Gate Charge, Vgs (Max), Input Capacitance (Ciss), Power Dissipation, Operating Temperature Range, Mounting Type, package type, and compliance certifications. Only parts matching these parameters are considered direct equivalents and substitutes.

Parameter Comparison

Engineering Selection Recommendations

The main part, TSM3N100CP ROG, is discontinued at Digi-Key, while the substitute STD3NK100Z is active and available in stock. Both parts are ROHS3 compliant and unaffected by REACH status, with identical package, mounting type, and classification parameters. Substitution is appropriate strictly based on product status and compliance equivalence.

Frequently Asked Questions (FAQ)

Q1: What are the critical parameters for MOSFET substitution in this category?
A1: The critical parameters are FET type, MOSFET technology, Drain-to-Source Voltage (Vdss), Continuous Drain Current (Id), Drive Voltage, Rds On (Max), Vgs(th) (Max), Gate Charge, Vgs (Max), Input Capacitance (Ciss), Power Dissipation, Operating Temperature Range, mounting type, and package form factor.

Q2: Is STD3NK100Z compatible with same footprint and pad layout as TSM3N100CP ROG?
A2: Both parts utilize the TO-252-3, DPAK (2 Leads + Tab), SC-63 package and are intended for surface mount applications.

Q3: Are there environmental or compliance differences that affect substitution?
A3: Both TSM3N100CP ROG and STD3NK100Z are ROHS3 compliant and REACH unaffected, with ECCN EAR99, satisfying environmental and compliance requirements for direct substitution.

Q4: How are substitute parts selected for discontinued MOSFETs?
A4: Substitute parts are matched strictly on shared electrical ratings, mechanical dimensions, compliance certifications, and product availability within the same product and package category.

Q5: Can the substitute be used in all applications of the original?
A5: Substitution is based solely on provided parameters including package, mounting, and electrical ratings. Compatibility with the intended application is determined strictly by these matched specifications.