TSM35N10CP ROG Equivalent & Substitute Parts

Part Overview

The TSM35N10CP ROG is an N-Channel MOSFET manufactured by Taiwan Semiconductor Corporation, rated for 100V drain-to-source voltage and 32A continuous drain current in a surface mount TO-252 (DPAK) package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity. The TSM35N10CP ROG serves applications requiring moderate-current switching at 100V operation levels with thermal management via the DPAK package format.

Substiute Parts

TSM35N10CP ROG
Taiwan Semiconductor CorporationIn Stock: 1107TSM35N10CP ROG Datasheet
TSM35N10CP ROG
Current Part
BUK9240-100A,118
Nexperia USA Inc.In Stock: 30561BUK9240-100A,118 Datasheet
BUK9240-100A,118
Similar
STD26NF10
STMicroelectronicsIn Stock: 22979STD26NF10 Datasheet
STD26NF10
Similar

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 100 V
Continuous Drain Current (Id) @ 25°C 32 A
Rds On (Max) @ 10A, 10V 37 mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA 3 V
Gate Charge (Qg) @ 10V 34 nC
Input Capacitance (Ciss) @ 30V 1598 pF
Power Dissipation (Max) 83.3 W
Operating Temperature Range -55 to 150 °C
Package Type TO-252 (DPAK)
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution of the TSM35N10CP ROG is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 100V
  • Continuous Drain Current (Id): Must equal or exceed 32A at 25°C
  • Package Type: Must be TO-252 (DPAK) surface mount
  • On-State Resistance (Rds On): Should be comparable to 37mOhm to maintain thermal and switching performance
  • Gate Threshold Voltage (Vgs(th)): Must be within acceptable switching logic levels
  • Operating Temperature Range: Must support the application's thermal requirements

Substitute parts identified:

  • BUK9240-100A,118 (Nexperia USA Inc.): Meets voltage and current ratings with enhanced current capability (33A) and improved thermal performance (114W)
  • STD26NF10 (STMicroelectronics): Meets voltage rating with reduced current rating (25A) and comparable thermal performance (100W)

Parameter Comparison

Parameter TSM35N10CP ROG BUK9240-100A,118 STD26NF10 Unit
Manufacturer Taiwan Semiconductor Corporation Nexperia USA Inc. STMicroelectronics
Drain to Source Voltage (Vdss) 100 100 100 V
Continuous Drain Current (Id) @ 25°C 32 33 25 A
Rds On (Max) 37 @ 10A, 10V 38.6 @ 25A, 10V 38 @ 12.5A, 10V mOhm
Gate Threshold Voltage (Vgs(th)) 3 @ 250µA 2 @ 1mA 4 @ 250µA V
Gate Charge (Qg) @ 10V 34 55 nC
Input Capacitance (Ciss) 1598 @ 30V 3072 @ 25V 1550 @ 25V pF
Power Dissipation (Max) 83.3 114 100 W
Operating Temperature Range -55 to 150 -55 to 175 -55 to 175 °C
Package Type TO-252 (DPAK) DPAK TO-252 (DPAK)
Mounting Type Surface Mount Surface Mount Surface Mount
Product Status Obsolete Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

BUK9240-100A,118 (Nexperia USA Inc.): This substitute provides direct electrical compatibility with the TSM35N10CP ROG. The BUK9240-100A,118 exceeds the original part's current rating (33A vs. 32A) and offers superior power dissipation capability (114W vs. 83.3W). The device maintains the same 100V voltage rating and DPAK package format. The BUK9240-100A,118 carries AEC-Q101 automotive qualification and operates across an extended temperature range (-55°C to 175°C). Moisture sensitivity is improved to MSL 1 (Unlimited). This part is classified as obsolete but remains suitable for applications requiring the original performance envelope with enhanced thermal headroom.

STD26NF10 (STMicroelectronics): This substitute maintains the 100V voltage rating and DPAK package compatibility with the TSM35N10CP ROG. The STD26NF10 is rated for 25A continuous drain current, which is lower than the original 32A specification. This part is classified as active product status, ensuring long-term availability and supply continuity. The device operates across an extended temperature range (-55°C to 175°C) and features improved moisture sensitivity (MSL 1, Unlimited). The STD26NF10 is suitable for applications where the 25A current rating is sufficient and where active product status is required for procurement assurance.

Both substitute parts maintain RoHS3 compliance and REACH unaffected status consistent with the original device.

Frequently Asked Questions (FAQ)

Q: Can the BUK9240-100A,118 directly replace the TSM35N10CP ROG in all applications?

A: The BUK9240-100A,118 provides direct electrical substitution for applications operating at or below 32A continuous drain current. The higher current rating (33A) and improved power dissipation (114W) make it suitable for the original design envelope. Pin configuration and package footprint (DPAK) are identical. Verify that the application does not depend on the specific gate charge or input capacitance characteristics of the original part.

Q: Is the STD26NF10 suitable for applications requiring 32A continuous drain current?

A: The STD26NF10 is rated for 25A continuous drain current, which is below the TSM35N10CP ROG specification of 32A. This part is suitable only for applications where the actual operating current does not exceed 25A. If the design requires 32A operation, the BUK9240-100A,118 is the appropriate substitute.

Q: What is the significance of the different gate threshold voltages among these parts?

A: Gate threshold voltage (Vgs(th)) determines the gate voltage required to initiate conduction. The TSM35N10CP ROG specifies 3V @ 250µA, the BUK9240-100A,118 specifies 2V @ 1mA, and the STD26NF10 specifies 4V @ 250µA. These differences affect gate drive circuit design. Verify that the gate drive voltage and current source in the application can accommodate the threshold voltage of the selected substitute.

Q: Why does the BUK9240-100A,118 have higher input capacitance than the original part?

A: The BUK9240-100A,118 exhibits input capacitance (Ciss) of 3072 pF @ 25V compared to 1598 pF @ 30V for the TSM35N10CP ROG. Higher input capacitance increases gate charge requirements and may affect switching speed. Evaluate the gate drive circuit's ability to supply the necessary charge within the required switching time frame.

Q: Are there package or mounting differences between these parts?

A: All three parts use the TO-252 (DPAK) surface mount package with identical pin configuration and footprint. No PCB layout modifications are required for substitution. Verify that the thermal management approach (heatsink or PCB copper area) is adequate for the selected part's power dissipation rating.

Q: What is the impact of product status (Obsolete vs. Active) on part selection?

A: The STD26NF10 carries active product status, indicating ongoing manufacturing and long-term availability. The TSM35N10CP ROG and BUK9240-100A,118 are classified as obsolete, meaning production has ended. For new designs or long-term production requirements, the STD26NF10 is preferred if the 25A current rating is acceptable. For existing designs requiring the 32A rating, the BUK9240-100A,118 provides the necessary performance with available inventory.

Q: How do the moisture sensitivity levels affect handling and storage?

A: The TSM35N10CP ROG specifies MSL 3 (168 Hours), requiring controlled moisture exposure during storage and handling. The BUK9240-100A,118 and STD26NF10 both specify MSL 1 (Unlimited), allowing indefinite storage without moisture control measures. This difference simplifies supply chain management and reduces handling costs for the substitute parts.

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