TSM250NB06LCV Equivalent & Substitute Parts

Part Overview

The TSM250NB06LCV is an N-Channel power MOSFET manufactured by Taiwan Semiconductor Corporation, rated for 60V drain-to-source voltage with continuous drain current capabilities of 6A at Ta (ambient temperature) and 27A at Tc (case temperature). This device is housed in an 8-PowerWDFN surface mount package and is designed for applications requiring efficient power switching and control. The part maintains Active product status and is ROHS3 compliant, making it suitable for current production environments. Equivalent and substitute parts are identified to provide design flexibility, support supply chain continuity, and accommodate inventory availability across manufacturing operations.

Key Parameters

Parameter	Value	Unit
Drain to Source Voltage (Vdss)	60	V
Continuous Drain Current @ 25°C (Ta)	6	A
Continuous Drain Current @ 25°C (Tc)	27	A
On-State Resistance (Rds On Max) @ 6A, 10V	25	mOhm
Gate Threshold Voltage (Vgs(th) Max) @ 250µA	2.5	V
Gate Charge (Qg Max) @ 10V	23	nC
Input Capacitance (Ciss Max) @ 30V	1307	pF
Power Dissipation (Ta)	1.9	W
Power Dissipation (Tc)	42	W
Operating Temperature Range	-55 to 150	°C
Package Type	8-PowerWDFN (3.15x3.1)	Surface Mount
FET Type	N-Channel	MOSFET

Substitute Part Grouping Explanation

Substitute parts for the TSM250NB06LCV are identified based on electrical and mechanical parameter equivalence within the N-Channel power MOSFET category. The substitution criteria are strictly limited to the following parameters:

Drain to Source Voltage (Vdss): 60V
Continuous Drain Current: 6A (Ta) and 27A (Tc)
On-State Resistance (Rds On): 25 mOhm @ 6A, 10V
Gate Threshold Voltage: 2.5V @ 250µA
Gate Charge: 23 nC @ 10V
Input Capacitance: 1307 pF @ 30V
Power Dissipation: 1.9W (Ta) and 42W (Tc)
Operating Temperature Range: -55°C to 150°C
Package Type: 8-PowerWDFN surface mount
Compliance: ROHS3 compliant, REACH unaffected

Parts meeting all these electrical and mechanical specifications are classified as parametric equivalents and direct substitutes. Packaging, mounting type, and compliance certifications must remain identical to ensure drop-in compatibility.

Parameter Comparison

Parameter	TSM250NB06LCV	TSM250NB06LCV RGG	Match
Manufacturer	Taiwan Semiconductor Corporation	Taiwan Semiconductor Corporation	Yes
Category	Transistors, FETs, MOSFETs	Transistors, FETs, MOSFETs	Yes
FET Type	N-Channel	N-Channel	Yes
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)	Yes
Drain to Source Voltage (Vdss)	60 V	60 V	Yes
Continuous Drain Current (Ta)	6 A	6 A	Yes
Continuous Drain Current (Tc)	27 A	27 A	Yes
Rds On (Max) @ 6A, 10V	25 mOhm	25 mOhm	Yes
Vgs(th) (Max) @ 250µA	2.5 V	2.5 V	Yes
Gate Charge (Qg) (Max) @ 10V	23 nC	23 nC	Yes
Input Capacitance (Ciss) (Max) @ 30V	1307 pF	1307 pF	Yes
Power Dissipation (Ta)	1.9 W	1.9 W	Yes
Power Dissipation (Tc)	42 W	42 W	Yes
Operating Temperature Range	-55°C to 150°C	-55°C to 150°C	Yes
Mounting Type	Surface Mount	Surface Mount	Yes
Package Type	8-PowerWDFN (3.15x3.1)	8-PowerWDFN (3.15x3.1)	Yes
Packaging Format	Tape & Reel (TR)	Tape & Reel (TR)	Yes
Product Status	Active	Active	Yes
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Yes
REACH Status	REACH Unaffected	REACH Unaffected	Yes
ECCN	EAR99	EAR99	Yes
HTSUS Code	8541.29.0095	8541.29.0095	Yes

Engineering Selection Recommendations

The TSM250NB06LCV RGG is a direct parametric equivalent to the TSM250NB06LCV. Both parts are manufactured by Taiwan Semiconductor Corporation and share identical electrical specifications, mechanical dimensions, and compliance certifications. Selection between these parts is based on inventory availability and supply chain requirements rather than technical performance differences.

Both parts maintain Active product status, ensuring continued manufacturing support and availability. ROHS3 compliance and REACH unaffected status confirm suitability for regulated manufacturing environments. The 8-PowerWDFN package provides identical thermal and electrical performance characteristics across both part numbers.

The TSM250NB06LCV RGG variant currently maintains higher inventory levels (10,773 pieces) compared to the standard TSM250NB06LCV (816 pieces), making it the preferred selection for applications where supply continuity is a priority.

Frequently Asked Questions (FAQ)

Q: Can TSM250NB06LCV RGG be used as a direct replacement for TSM250NB06LCV?

A: Yes. The TSM250NB06LCV RGG is a parametric equivalent with identical electrical characteristics, on-state resistance, gate charge, input capacitance, power dissipation ratings, and operating temperature range. Both parts use the same 8-PowerWDFN package and are ROHS3 compliant.

Q: Are there any differences in package dimensions between these parts?

A: No. Both TSM250NB06LCV and TSM250NB06LCV RGG use the 8-PowerWDFN (3.15x3.1) surface mount package with identical pinout and mechanical specifications.

Q: What does the "RGG" suffix indicate?

A: The RGG suffix represents a manufacturing or distribution variant of the base TSM250 product. It does not indicate a change in electrical performance or specifications.

Q: Are both parts suitable for high-temperature applications?

A: Yes. Both parts operate across the temperature range of -55°C to 150°C (junction temperature), supporting applications requiring extended thermal operating windows.

Q: Do both parts meet the same compliance standards?

A: Yes. Both TSM250NB06LCV and TSM250NB06LCV RGG are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronics manufacturing.

Q: What is the difference in continuous drain current ratings?

A: Both parts have identical continuous drain current ratings: 6A at ambient temperature (Ta) and 27A at case temperature (Tc). The difference reflects measurement conditions rather than device capability.

Q: Can these parts be used interchangeably in PCB designs?

A: Yes. Identical package type, pinout, and electrical specifications enable direct PCB-level substitution without design modifications.

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